Driving Innovation Across Industries
Our engineering leaders partner with customers worldwide to design next-generation technology. Together, we develop the robust, rugged solutions enabling fast, efficient, and reliable connectivity in data, power, signal, and wireless systems.
Our engineering leaders are committed to helping customers achieve business value through innovation in engineering, manufacturing, and materials. As the most technically accomplished members of our engineering community, our Fellows, Chief Technology Officers, and Subject-Matter Experts serve as mentors to colleagues and partners to customers. Their specialized capability and knowledge enables them to play a crucial role in leading the development of technology that is making the world safer, sustainable, productive, and connected.
Isabell Buresch, PhD
Isabell specializes in evaluating and developing new material systems and coatings that make connector contacts and terminals more reliable and fit for future purpose. Her three decades of professional experience in surface and plating technology enables her to understand the intricacies of producing materials cost-efficiently using sustainable manufacturing processes.
Read Q&A with Isabell on innovation in automotive connectivity.
Developing materials for contacts used in automobile systems
Analyzing production for more efficient, cost-effective processes
Ask Isabell about
Plating and joining technologies
Analyzing materials and surfaces
Base materials and metal substrates, material systems, and coatings
More than 60 articles authored
Guenter specializes in innovation for industrial communication, robotics, and I/O connectivity. He works closely with major industrial customers and technology partners to bring new and innovative products to market.
Guenter works at international standardization groups involved in electrical and electronical connectors and interconnections as well as electrical termination technologies like Crimp, IDC, Piercing, Spring Clamp, Press-In connection solutions. For more than three decades, he has served as a delegate, expert and working group chairman to VDE/DKE, IEC, and Cenelec.
Guenter received TE’s prestigious 2019 Lifetime Achievement Award for his nearly forty years of technical leadership and expertise. In addition to being a TE Fellow for the past decade, he amassed several distinctions: 40 granted patents, TE’s 2012 New Innovation Award, and 2016 Impact Innovation Award. His relationships with customers have helped drive competitive advantages that increased TE’s influence in the field of Industrial Communication.
Industrial Single Pair Ethernet (SPE) 1 Gbps
Advanced Physical Layer (APL) 10Mbps for 1000m
M12 x-coded, mini I/O Cat-6a 100 Mbps - 10 Gbps
Automation IO connectors
Industrial power and signal and communication connectors
Industrial Internet, IIoT
Cyber Physical Systems
Ask Guenter about
Sensor to the cloud
Industrial wireless, 5G ACIA
Electrical termination technologies
Fellow, Data and Devices
Dave specializes in helping customers innovate for high-speed connectivity in data centers.
Data center servers, storage, and switches
Matt specializes in solving for power and signal connectivity, especially when it involves high-speed connectors, PCB interconnects, compliant pin technology, and VME/VPX system solutions.
Rugged connector designs for aerospace
Spacecraft (manned and unmanned)
Aircraft (manned and unmanned)
Ask Matt about
Connector solutions for VPX architecture
Tom specializes in developing minimally invasive medical devices, with an emphasis on ultrasonic imaging technology.
Product platform and process platform development
Ask Tom About
Ash specializes in designing wires and cables delivering reliable power and signal connectivity in aerospace applications.
Fluoropolymer Extrusions and Crosslinking
Polymeric materials and technologies
Ask Ash About
High temperature adhesives
Multilayer thin-wall extrusions
Chemically and physically blown foams
Processing and crosslinking high melting high performance thermoplastics
Manufacturing heat shrink tubing and shape memory articles
Special formulations for property enhancement via crosslinking
Fellow, Data and Devices
Chad specializes in analyzing and designing high-speed, high-density components, as well as in developing signal integrity modeling, simulation, and measurement methods for characterizing digital and RF components. He is also focused on characterizing advanced conductor and dielectric materials electrically for high-speed signal transmission.
Electromagnetic interconnect modeling (FEA, TLM)
Full system simulation (SPICE, linear, convolution)
Component and system verification testing (TDR, VNA, BERT)
High-speed network analyzer measurement & de-embedding
High-speed right-angle and direct-plug orthogonal designs
Low-skew geometry modeling & novel solutions
Data center architectures (routers & switches)
Server architectures & disaggregation
Wireless backbone digital applications
High-speed, high-density digital component modeling
High-speed, equalized system simulation
Metal & dielectric electrical characterization at high frequency
External 28-112 Gbps cable assemblies (QSFP, OSFP, QSFP-DD)
Internal low-loss cable assemblies (Sliver cable assemblies)
Cabled backplane solutions (cabled STRADA Whisper connectors)
Ask Chad about
Choosing tools and methods for predicting performance
Achieving low insertion loss and crosstalk to 50 GHz
Removing unwanted resonances from components
Measuring high-frequency material characteristics
Selecting materials for high-speed
John specializes in developing value-adding terminal and connector solutions for automotive applications, using low-cost materials and processes.
Read Q&A with John on connectivity in automotive.
Automotive terminal and connector design
Low-voltage miniaturized automotive terminals and connectors
Ask John about
Designing terminals and connectors
Surface mount headers and compliant pins
Josef specializes in process improvement and process innovation in stamping, plating, molding and assembly.
Ask Josef about
Manufacturing and automation
Fellow, Global Operations
Frank specializes in taking innovation concepts and developing them into functional, sustainable manufacturing processes.
Manufacturing innovations (plating, stamping, molding)
Pilot and deployments in manufacturing
Sustainability optimization (energy, process water, chemicals)
Engineering and operational excellence
Ask Frank about
New opportunities with manufacturing transformation (digital factory)
Dave specializes in developing sensors – primarily MEMS-based sensors and electronic sensor systems.
Ask Dave about
Sensor requirements and trends
Fellow, Corporate Technology
Bill helps customers solve for high-speed, ruggedized, small form factor and low-cost optical transceivers.
End-to-end networking solutions for high speed communications
Fiber optic sensing
Ask Bill about
High speed communications
Networking - all types
The digital era is here for industrial manufacturing. We’re innovating a flexible solution for older equipment allowing these machines to connect to a network, enabling them to communicate with each other and with operators in real time.
Chief Technology Officers
CTO, Transportation Solutions
Alan Amici serves as the Vice President and Chief Technology Officer for TE Connectivity’s Transportation Solutions segment.
As the technical leader of the Transportation Solutions segment, Alan is responsible for the strategic direction of global engineering, technology, advanced development and innovation within the Automotive, Sensors, Application Tooling and Industrial & Commercial Transportation business units.
Alan joined TE after a 30-year career with Chrysler where he held a variety of global positions in engineering, manufacturing and service, including Head of Electrical and Electronics for Chrysler in Michigan, USA, Head of Electrical and Electronics for Fiat in Turin, Italy, Head of Global Uconnect and Global Service & Parts in Stuttgart, Germany.
Alan is the owner of two patents, is the recipient of the Walter P. Chrysler Technology Award and is a member of the SAE Convergence Technical Council where he served as the Technical Program Chair for Convergence.
Alan holds a Master of Business Administration degree, a Master of Science degree in Electrical Engineering and a Bachelor of Science degree in Electrical Engineering from the University of Michigan. He is also a graduate of the Chrysler Institute of Engineering.
CTO, Industrial Solutions
Davy Brown has served as the Vice President and Chief Technology Officer for TE Connectivity’s Industrial Solutions segment since 2017.
As the technical leader of the Industrial Solutions segment, Davy is responsible for the strategic direction of global engineering and product research and innovation within the Energy, Industrial, Medical, and Aerospace, Defence and Marine businesses.
Davy first joined TE in 2013 as Vice President and Chief Technology Officer of the Telecom and Wireless businesses and continued that role after the merger and creation of Broadband Network Solutions (BNS). He then served as Senior Vice President, Research and Development of CommScope’s Connectivity Solutions business after its acquisition of BNS before returning to TE in 2017.
After beginning his career at British Telecom Research Labs, he has held senior technology leadership and executive roles in various technology companies spanning the semiconductor, software, consumer electronics and telecommunications industries. He also co-founded and served as CTO of Trinity Convergence, a multimedia communications company.
Davy holds a Bachelor’s degree in Computer Science from the University of Newcastle Upon Tyne, UK.
CTO, Communications Solutions
Phil Gilchrist has served as the Vice President and Chief Technology Officer for TE Connectivity’s Communications Solutions segment since Oct 2017.
As the technical leader of the Communications Solutions segment, Phil is responsible for the strategic direction of global engineering and innovation, product research, engineering talent and digital process development within the business units comprised in CS: Data & Devices, Appliances and SubCom.
Phil first joined TE in 2011 as Vice President and Chief Technology Officer of the Enterprise business unit, moving on to be the CTO of TE’s Datacom business unit. He then served as General Manager of Optics and CTO of Data and Devices until becoming the CTO for the Communications Solutions Segment.
After beginning his career as the Co-Founder of a technology start-up, Phil held numerous senior technology leadership and executive roles at Motorola from 1999-2011 focused on software, chipset and platform product development.
Phil holds a Bachelor’s degree (Hons) in Computer Science from the University of Stirling, Scotland.
CTO, Industrial & Commercial Transportation
Joe Bolewitz serves as the Vice President and Chief Technology Officer for TE Connectivity’s Industrial and Commercial Transportation Business Unit (ICT).
As the technical leader of the ICT Business Unit, he has global responsibility for sustaining engineering, development engineering, project management and advanced development.
Joe joined TE Connectivity (AMP Incorporated) in July 1988 and has held various positions in manufacturing engineering and product development within the computer, signal transmission and automotive business units of TE. He joined the ICT business unit in 2013. Prior to this role, he was responsible for global engineering of TE’s Hybrid and Electric Mobility Solutions group.
Joe holds a Bachelor of Science degree in Mechanical Engineering Technology and a Master of Business Administration degree from the Pennsylvania State University. He is a graduate of the AMP Advanced Engineers Development Program (1996-1998) as one of 4 candidates selected globally to participate in this intensive 2 year multi-discipline engineering training program.
CTO, Data and Devices
Erin specializes in developing and commercializing next-gen connectivity solutions for data communications across electrical, optical, and RF domains.
Executing on product roadmaps to deliver differentiated value
Ask Erin about
Speed and density in data centers
Massive MIMO antennas for 5G
CTO, Application Tooling
Greg leads a global team that develops tooling solutions for enabling high-level precision in factory connectivity.
Translation of customer requests into customized solutions
Hardware and Software integration
Wire harness assembly
Pin insertion/press fit
Ask Greg about
Improving manufacturing efficiency
Terminal connection technology
Circuit board assembly
CTO, Sensor Solutions
In leading the technology vision for the TE sensors team, Byron focuses on solving for the challenge as much as for the outcome.
Paul leads a global team that partners with customers in developing innovative solutions for the home appliance market.
New product development
Large home appliances
Smart home technology
Ask Paul about
Wireless power distribution and transmission
CTO, Aerospace, Defense, & Marine
Thierry specializes in developing components that enable customers to innovate.
Ask Thierry about
Leif leads a global team that partners with customers in developing innovative solutions for optimization of power grid reliability.
Power grid reliability
Power grid connectivity
Ask Leif about
Power distribution and transmission