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DDR2 SO DIMM Sockets

DDR2 SO DIMM Sockets-CAT-D3301-SO1339
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Product Features

  • DRAM Type : Double Data Rate (DDR) | Double Data Rate (DDR) 2

  • Stack Height (mm): 4 | 4.6 | 5.2 | 6.5 | 8 | 9.2

  • Stack Height (in): .157 | .18 | .205 | .256 | .315 | .362

  • Module Orientation : Right Angle | Vertical

  • Number of Positions : 200

  • Centerline (Pitch) : .6 mm [ .024 in ]

Available from

LADD Inc
Features

Please review product documents or contact us for the latest agency approval information.  

Product Type Features

  • Connector System  Cable-to-Board

  • Connector & Contact Terminates To  Printed Circuit Board

  • DRAM Type  Double Data Rate (DDR) | Double Data Rate (DDR) 2

Configuration Features

  • Number of Keys  1

  • Number of Bays  2

  • Number of Rows  2

  • Module Orientation  Right Angle | Vertical

  • Number of Positions  200

Electrical Characteristics

  • DRAM Voltage (V) 1.8 | 2.5

Signal Characteristics

  • SGRAM Voltage (V) 1.8 | 2.5

Body Features

  • Latch Plating Material  Tin

  • Retention Post Location  Both Ends | Center

  • Latch Material  High Temperature Thermoplastic | Stainless Steel

  • Ejector Type  Locking | Standard

  • Ejector Location  Both Ends

  • Module Key Type  Offset Left | Offset Right | SGRAM

  • Retention Post Material  Copper Alloy

  • Connector Profile  Low | Reverse | Standard | Ultra High

Contact Features

  • Contact Underplating Material  Nickel

  • Contact Current Rating (Max) (A) .5

  • Memory Socket Type  Memory Card

  • Contact Base Material  Copper Alloy

  • PCB Contact Termination Area Plating Material  Gold | Gold Flash | Tin

  • Contact Mating Area Plating Material  Gold (Au) | Gold Flash

  • Contact Mating Area Plating Material Thickness (µm) .254 | .76

  • Contact Mating Area Plating Material Thickness (µin) 10 | 30

Termination Features

  • Termination Method to PCB  Surface Mount

  • Insertion Style  Cam-In

Mechanical Attachment

  • PCB Mount Retention Type  Solder Peg | Solder Tail

  • PCB Mount Retention  With

  • Mating Alignment Type  Reverse Keying | Standard Keying

  • Connector Mounting Type  Board Mount

Housing Features

  • Housing Material  High Temperature Thermoplastic | LCP | Thermoplastic

  • Housing Color  Black | Gray

  • Centerline (Pitch)  .6 mm [ .024 in ]

Dimensions

  • Stack Height (mm) 4 | 4.6 | 5.2 | 6.5 | 8 | 9.2

  • Stack Height (in) .157 | .18 | .205 | .256 | .315 | .362

  • Row-to-Row Spacing (mm) 5.6 | 5.8 | 6.2 | 7.6 | 8.6

  • Row-to-Row Spacing (in) .22 | .228 | .244 | .299 | .338

Usage Conditions

  • Operating Temperature Range  -55 – 85 °C [ -67 – 185 °F ]

Operation/Application

  • Circuit Application  Power

Industry Standards

  • UL Flammability Rating  UL 94V-0

Packaging Features

  • Packaging Quantity  16 | 20 | 24 | 150 | 200

  • Packaging Method  Box | Hard Tray | Reel | Semi-Hard Tray Assembly | Tape & Reel | Tray

Reference Number

  • TE Internal Number CAT-D3301-SO1339

Related Materials
No documentation available.