TE Connectivity will showcase a broad portfolio of interconnect solutions designed for higher speeds, scalability, and power efficiency in data center architectures.
Published
10/13/25
October 13, 2025
HARRISBURG, Pa.
TE Connectivity, a world leader in connectors and sensors, will showcase how it is contributing to the evolution of artificial intelligence (AI) and machine learning (ML) with products that are engineered for compatibility, interconnectivity and support industry standard form factors and performance requirements Oct. 14-16 at the 2025 OCP Global Summit in San Jose, California.
TE’s advancements in rack-level power and connectivity, including LVDC/HVDC distribution, liquid-cooled busbars and next-generation high-speed high-density solutions that support hyperscale, AI/ML and high-performance computing workloads, can be seen in booth #B34.
Demonstrations will highlight innovations across signal integrity and thermal management, such as active cabled backplanes with integrated retimers, 448G/lane co-packaged copper (CPC) connectors, liquid-cooled I/O and OCP NIC solutions, and 1.6T optical and copper interconnects. In collaboration with multiple industry partners, TE will demonstrate how these technologies come together to provide the building blocks for the next generation of data center systems.
“Artificial Intelligence presents unprecedented demands on data centers, pushing the boundaries of computational power and necessitating innovative solutions in data center design and operation,” said TE Vice President of Strategy, Business Development and Marketing Pranav Garg. “Data center customers look to industry partners like TE to provide the critical components that enable data to travel at the speed and density of AI for every generational evolution.”
TE Product Solutions on Display at OCP Global Summit
- Power Distribution: Innovative LVDC/HVDC rack power solutions, from facility busway to chip
- Rack-Level Integration: TE’s OCP rack-level technologies that help enable high-performance, high-density architectures
- High-Density Interconnects: Active cabled backplanes, 448G CPC connectors, and 224G OTB solutions that deliver high-bandwidth, low-loss connectivity with improved signal integrity for AI/ML and high-performance computing systems
- High-Speed Connectivity: Active copper and optical interconnects that deliver notable bandwidth and improved reliability
- Liquid Cooling Solutions: Advanced OCP NIC and I/O thermal solutions designed for restricted airflow and high-density power components
“As data center architectures advance across generations, system-level efficiency improvements are becoming increasingly critical,” said TE Vice President of Product Management Ganesh Srinivasan. “TE is enabling this evolution with a comprehensive portfolio of high-performance connectivity and power solutions, optimized for scalability, thermal management, and signal integrity. Through our robust partner ecosystem, we’re accelerating the deployment of next-generation AI infrastructure. At OCP, attendees will see how TE is engineering the future of AI.”
Visit te.com/ocp-2025 for additional details about TE’s products, demonstrations and presentations at OCP. Further information on TE’s AI solutions can be found at te.com/AI.
About TE Connectivity
TE Connectivity plc (NYSE: TEL) is a global industrial technology leader creating a safer, sustainable, productive, and connected future. Our broad range of connectivity and sensor solutions enable the distribution of power, signal and data to advance next-generation transportation, energy networks, automated factories, data centers, medical technology and more. With more than 85,000 employees, including 9,000 engineers, working alongside customers in approximately 130 countries, TE ensures that EVERY CONNECTION COUNTS. Learn more at www.te.com and on LinkedIn, Facebook, WeChat and Instagram.
