Industry Tradeshow
OCP Global Summit 2025
Join TE Connectivity in Booth #B34
October 14-16, 2025
San Jose, CA
Engineering the Future of AI
Join TE Connectivity (TE) at OCP Global Summit 2025, booth #34, to learn more about our broad portfolio of interconnect solutions designed for higher speeds, scalability, and power efficiency in data center architectures.
At the OCP Global Summit, TE will showcase advances in rack-level power and connectivity, including LVDC/HVDC distribution, liquid-cooled busbars, and next-generation high-density solutions that support hyperscale, AI/ML, and HPC workloads.
Product Solutions on Display at OCP
TE OCP Rack-Level Solutions: TE is demonstrating how our portfolio of interconnected rack-level technologies helps to enable next-generation hyperscale, AI/ML, and HPC data center architectures, from liquid-cooled busbars to cabled backplanes, OCP power distribution, and next-gen PCIe.
LVDC/HVDC Data Center Rack Power Solutions: TE is supporting next-generation data center power needs with innovative DC power solutions. From facility power busway to chip-level delivery, these systems help to enable efficient 12V, 48V, and HVDC architectures.
AdrenaLINE Slingshot High-Density Active Cabled Backplane: This demo showcases TE’s AdrenaLINE Slingshot HD active cabled backplane cartridge integrated with retimers to deliver improved signal integrity with double the cable reach (vs. traditional passive channels).
448G/Lane Copper Connectivity: TE is highlighting a co-packaged copper connector designed for the bandwidth demands of AI and networking. With high-density design and strong signal integrity, TE’s OTB and CPC portfolio are contributing to next-generation Ethernet and ASIC connectivity.
200G OTB AdrenaLINE Catapult UHD Connector: This demo showcases the latest 224G CPC solutions from TE. Designed for GPU-to-switch and ASIC-to-font-panel connections, TE’s AdrenaLINE Catapult UHD connector delivers lower latency and higher signal integrity to support improved power efficiency for AI/ML workloads.
Liquid-Cooled OCP NIC: TE is partnering to develop a solution to cool the TSFF NIC. This demo showcases how TE supports the next generation of AI networking cards, by providing a path to higher power TSFF NICs with a 40W chip and 30W optic.
1.6T Optics - OSFP224 2xDR4 Optical Transceiver: This innovative optics module delivers notable data transmission speeds of up to 1.6 T. This solution is designed to help meet the demands of next generation data centers, AI workloads, and hyperscale environments, with notable BER performance and improved power efficiency.
1.6T Active Copper Cable (ACC): TE is showcasing an ACC solution with far-end equalization for reliable long-reach performance. By optimizing copper interconnects, TE helps enable high-density compute clusters to scale with stronger signal performance.
Active Copper Cables with Redriver Solution: This demo highlights how TE
Connectivity’s advanced ACC products help to enable longer reach and greater reliability using thinner-gauge designs, ideal for AI/Ml hyperscale deployments. Enhanced by linear redriver technology, this solution delivers stronger signal performance to help support high-density compute clusters.
Hear From Our Experts
Reinventing the Backplane: Why AI Demands an Active Approach
October 14th @ 3:35 PM
Presented by Matthew Ho (TE Connectivity) and Chris Blackburn (Astera Labs)
Join TE's Matthew Ho as he explores the challenges and solutions of passive cable architectures in AI clusters and unveils how active cable backplanes are redefining signal integrity and scalability.
Next Gen ORv3 HPR Power Levels and Sidecar Architectures with Liquid Cooled Busbars
October 15th @ 10:45 AM
Presented by Hal Loket (TE Connectivity) and Dmitry Shapiro (Meta)
TE's Hal Loket discusses how liquid-cooled busbars are transforming 48V ORv3 HPR sidecar architectures by boosting efficiency, reducing copper, and enhancing rack-to-rack connectivity.
Panel: Progress in Optical Interconnects for AI Clusters
October 15th @ 11:05 AM
Presented by Nathan Tracy TE Connectivity)
Join TE's Nathan Tracy and a panel of industry experts as they explore how optics are shaping next-gen scale-up networks.
DC-MHS: Enabling 48V Architecture and Connectivity in the MHS Eecosystem
October 16th @ 8:35 AM
Presented by Hal Loket (TE Connectivity) and Clifford DuBay (Intel)
In a second session, Hal Loket returns to discuss how DC-MHS enables safer, more efficient 48V power distribution across the data center, and powering the next generation of server infrastructure.
Solutions on Display
Industry Tradeshow
OCP Global Summit 2025
Join TE Connectivity in Booth #B34
October 14-16, 2025
San Jose, CA
Engineering the Future of AI
Join TE Connectivity (TE) at OCP Global Summit 2025, booth #34, to learn more about our broad portfolio of interconnect solutions designed for higher speeds, scalability, and power efficiency in data center architectures.
At the OCP Global Summit, TE will showcase advances in rack-level power and connectivity, including LVDC/HVDC distribution, liquid-cooled busbars, and next-generation high-density solutions that support hyperscale, AI/ML, and HPC workloads.
Product Solutions on Display at OCP
TE OCP Rack-Level Solutions: TE is demonstrating how our portfolio of interconnected rack-level technologies helps to enable next-generation hyperscale, AI/ML, and HPC data center architectures, from liquid-cooled busbars to cabled backplanes, OCP power distribution, and next-gen PCIe.
LVDC/HVDC Data Center Rack Power Solutions: TE is supporting next-generation data center power needs with innovative DC power solutions. From facility power busway to chip-level delivery, these systems help to enable efficient 12V, 48V, and HVDC architectures.
AdrenaLINE Slingshot High-Density Active Cabled Backplane: This demo showcases TE’s AdrenaLINE Slingshot HD active cabled backplane cartridge integrated with retimers to deliver improved signal integrity with double the cable reach (vs. traditional passive channels).
448G/Lane Copper Connectivity: TE is highlighting a co-packaged copper connector designed for the bandwidth demands of AI and networking. With high-density design and strong signal integrity, TE’s OTB and CPC portfolio are contributing to next-generation Ethernet and ASIC connectivity.
200G OTB AdrenaLINE Catapult UHD Connector: This demo showcases the latest 224G CPC solutions from TE. Designed for GPU-to-switch and ASIC-to-font-panel connections, TE’s AdrenaLINE Catapult UHD connector delivers lower latency and higher signal integrity to support improved power efficiency for AI/ML workloads.
Liquid-Cooled OCP NIC: TE is partnering to develop a solution to cool the TSFF NIC. This demo showcases how TE supports the next generation of AI networking cards, by providing a path to higher power TSFF NICs with a 40W chip and 30W optic.
1.6T Optics - OSFP224 2xDR4 Optical Transceiver: This innovative optics module delivers notable data transmission speeds of up to 1.6 T. This solution is designed to help meet the demands of next generation data centers, AI workloads, and hyperscale environments, with notable BER performance and improved power efficiency.
1.6T Active Copper Cable (ACC): TE is showcasing an ACC solution with far-end equalization for reliable long-reach performance. By optimizing copper interconnects, TE helps enable high-density compute clusters to scale with stronger signal performance.
Active Copper Cables with Redriver Solution: This demo highlights how TE
Connectivity’s advanced ACC products help to enable longer reach and greater reliability using thinner-gauge designs, ideal for AI/Ml hyperscale deployments. Enhanced by linear redriver technology, this solution delivers stronger signal performance to help support high-density compute clusters.
Hear From Our Experts
Reinventing the Backplane: Why AI Demands an Active Approach
October 14th @ 3:35 PM
Presented by Matthew Ho (TE Connectivity) and Chris Blackburn (Astera Labs)
Join TE's Matthew Ho as he explores the challenges and solutions of passive cable architectures in AI clusters and unveils how active cable backplanes are redefining signal integrity and scalability.
Next Gen ORv3 HPR Power Levels and Sidecar Architectures with Liquid Cooled Busbars
October 15th @ 10:45 AM
Presented by Hal Loket (TE Connectivity) and Dmitry Shapiro (Meta)
TE's Hal Loket discusses how liquid-cooled busbars are transforming 48V ORv3 HPR sidecar architectures by boosting efficiency, reducing copper, and enhancing rack-to-rack connectivity.
Panel: Progress in Optical Interconnects for AI Clusters
October 15th @ 11:05 AM
Presented by Nathan Tracy TE Connectivity)
Join TE's Nathan Tracy and a panel of industry experts as they explore how optics are shaping next-gen scale-up networks.
DC-MHS: Enabling 48V Architecture and Connectivity in the MHS Eecosystem
October 16th @ 8:35 AM
Presented by Hal Loket (TE Connectivity) and Clifford DuBay (Intel)
In a second session, Hal Loket returns to discuss how DC-MHS enables safer, more efficient 48V power distribution across the data center, and powering the next generation of server infrastructure.
