OSFP for Next-Gen Thermal Performance

TE’s Octal Small Form Factor Pluggable (OSFP) connectors and cable assemblies address next-generation data center needs by supporting aggregate data rates of 200 Gbps and up to 400 Gbps. These products are designed for both 28G NRZ and 56G PAM-4 protocols, with a roadmap to 112G PAM-4 for future system upgrades. By utilizing integrated thermal heatsink technology in the plug, OSFP products provide superior thermal performance and signal integrity needed to support 400G data rates. OSFP products offer high-port density and can fit up to 36 ports of an 8-lane interface in a 1RU switch form factor, aligning with current and next-generation silicon road maps.

OSFP 224G Copper Cable Assemblies

DAC / ACC / AEC

TE Connectivity’s (TE) next-generation OSFP 224G copper cable assemblies are designed to meet the evolving needs of high-speed and high-density data centers and cloud computing environments.
These solutions offer excellent performance, flexibility, compatibility, and meet the increasing demands of modern network infrastructure.

 

High Speed & Density

  • Offers 1.6Tbps aggregate data rates at 224Gbps lane speeds to support high-density data center applications.
  • Meets IEEE standard signal performance requirements.

 

Design Flexibility

  • Straight and breakout configurations are supported, providing flexibility in the design.
  • Wild range of gauge size (25 – 32 AWG) offers versatility in deployment scenarios in dense racks.
  • EEPROM in cable provides programmability and enhanced management capabilities.

 

Seamless Integration & Cost Savings

  • Supporting both legacy and next-generation bandwidth port capabilities.
  • Helps seamless integration with existing infrastructure without the need for costly upgrades.

 

Extended Length

  • Supports longer reach within data center racks.
    • DAC can reach up to 1.3 meters
    • ACC extend the range from 1.2 to 2.5 meters
    • For distances beyond 2.5 meters, AEC is the solution
osfp

OSFP 112G Cages and Connectors

TE’s new OSFP 112G cages and connectors add to the wide range of products in the existing OSFP product portfolio providing customers with an 8x112G interconnect solution to support data transfer in next generation high density data center and cloud computing.

 

Product Features

OSFP connectors, cages, and cable assemblies

  • Support aggregate data rates of 200 Gbps (8 x 28G NRZ) and up to 400 Gbps (8 x 56G PAM-4), with a roadmap to 112 Gbps PAM-4
  • Superior thermal and signal-integrity performance
  • High port density

 

 

 

  • Designed for up to 15W thermal loads with low airflow 
  • Optimized for front-to-back and back-to-front airflow
  • Fit up to 36 ports of an 8-lane interface in a 1RU switch form factor
  • Connector has proven .6mm pitch, 60 contacts total 

 

Product Specifications

OSFP connectors, cages, and cable assemblies

Cage Assembly Connector
  • 1x1 and 1x4 cage to support both multi and single port applications
  • 8-lane high density connector, footprint and mating interface per OSFP MSA spec
  • Low cost, stainless steel cage with tuned airflow venting supports module cooling and optimal system airflow
  • Proven .6mm pitch, 60 contacts total
  • Traditional EMI containment at the bezel and port opening
  • Simple, low cost wafer design with 2 rows of contacts
  • Flat rock PCB Assembly
  • Belly-to-belly capable via in-ground alignment for low PCB cost and noise
  • Proven to 56G PAM-4, with roadmap to 112G PAM-4

1x1 Cage

1x4 Cage

SMT Connector

OSFP to OSFP

OSFP to 2 QSFP

OSFP to 4 QSFP

Cable Assembly Information

  • OSFP to OSFP straight cables
  • OSFP to 2 or 4 QSFP56 breakout cables
  • OSFP to 8 SFP56 breakout cables
  • Other custom cable configurations will be considered
  • Up to 26 AWG supported in the OSFP form factor
  • Maximum cable reach of 3 meters meets IEEE 802.3cd SDD21 requirement of -17.16 dB at 13.28 GHz

 

Select Applications

OSFP connectors, cages, and cable assemblies