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Electrical Characteristics
Contact Features
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Contact Mating Area Plating Material Thickness :
.3 µm [ 11.81 µin ]
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PCB Contact Termination Area Plating Material :
Tin-Lead
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Contact Base Material :
Copper Alloy
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Memory Socket Type :
Memory Card
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Contact Mating Area Plating Material :
Gold Flash
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Socket Style :
M3 (Mini Memory Module)
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Contact Underplating Material :
Nickel
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PCB Contact Termination Area Plating Material Thickness :
2 µm [ 78.7 µin ]
Mechanical Attachment
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PCB Mount Alignment Type :
Locating Posts
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PCB Mount Retention :
Without
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Mating Alignment :
Without
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Mating Alignment Type :
None
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Mount Angle :
Right Angle
Industry Standards
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UL Flammability Rating :
UL 94V-0
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