CAT-377-MSSOB75 Pin Sockets  1
PRODUCT
  1. Connectors
  2. Pin Sockets
  1. Miniature Spring Sockets: Open Bottom, Beryllium Copper, 7.5A CAT-377-MSSOB75
active
  • Socket Sleeve Style Open Bottom
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Sleeve Plating Material Gold
  • Sleeve Material Copper
  • Contact Base Material Beryllium Copper
  • Contact Current Rating (Max) 7.5
  • Contact Type Socket
  • Contact Spring Plating Thickness .762
  • Contact Spring Plating Material Gold
  • Contact Mating Area Plating Thickness 30
  • Contact Transmits (Typical) Signal (Data)/Power
  • Socket Type Discrete
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • Termination Method to Wire & Cable Solder
  • Insertion Method Hand/Semi-Automatic
  • Socket Length 6.45
  • Hole Size (Recommended) 2.26
  • Wire Size 16 – 14
  • Wire Size .162 – .653
  • Mating Pin Diameter Range .46 – 1.02
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Solder Process Feature None
  • Circuit Application Power & Signal
  • Packaging Method Bag
  • Packaging Quantity 2000
  • Spring Material Beryllium Copper
CAT-377-MSSCB75 Pin Sockets  1
PRODUCT
  1. Connectors
  2. Pin Sockets
  1. Miniature Spring Sockets: Closed Bottom, Beryllium Copper, 7.5A CAT-377-MSSCB75
active
  • Socket Sleeve Style Closed Bottom
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Sleeve Plating Material Tin
  • Sleeve Material Copper
  • Contact Base Material Beryllium Copper
  • Contact Current Rating (Max) 7.5
  • Contact Type Socket
  • Contact Spring Plating Thickness .762
  • Contact Spring Plating Material Gold
  • Contact Mating Area Plating Thickness 30
  • Contact Transmits (Typical) Signal (Data)/Power
  • Socket Type Discrete
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • Termination Method to Wire & Cable Solder
  • Insertion Method Hand/Semi-Automatic
  • Socket Length 5.59
  • Hole Size (Recommended) 2.26
  • Wire Size 15
  • Wire Size .162 – .653
  • Mating Pin Diameter Range .46 – 1.02
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Solder Process Feature None
  • Circuit Application Power & Signal
  • Packaging Method Bag
  • Packaging Quantity 2000
  • Spring Material Beryllium Copper
CAT-377-MSSCB3 Pin Sockets  1
PRODUCT
  1. Connectors
  2. Pin Sockets
  1. Mini Spring Sockets: Closed Bottom, 3A CAT-377-MSSCB3
active
  • Socket Sleeve Style Closed
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Sleeve Plating Material Gold Flash over Nickel
  • Sleeve Material Copper
  • Contact Base Material Beryllium Copper
  • Contact Current Rating (Max) 3
  • Contact Type Socket
  • Contact Spring Plating Thickness .762
  • Contact Spring Plating Material Gold
  • Contact Mating Area Plating Thickness 30
  • Contact Transmits (Typical) Signal (Data)/Power
  • Socket Type Discrete
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • Termination Method to Wire & Cable Solder
  • Insertion Method Hand/Semi-Automatic
  • Socket Length 3.61
  • Hole Size (Recommended) 1.02
  • Wire Size 28 – 25
  • Wire Size .081 – .162
  • Mating Pin Diameter Range .33 – .51
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Solder Process Feature None
  • Circuit Application Power & Signal
  • Packaging Method Bag
  • Packaging Quantity 2000
  • Spring Material Beryllium Copper
CAT-377-MSSCB4 Pin Sockets  1
PRODUCT
  1. Connectors
  2. Pin Sockets
  1. Miniature Spring Sockets: Closed Bottom, Beryllium Copper, 4A CAT-377-MSSCB4
active
  • Socket Sleeve Style Closed
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Sleeve Plating Material Gold Flash over Nickel
  • Sleeve Material Copper
  • Contact Base Material Beryllium Copper
  • Contact Current Rating (Max) 4
  • Contact Type Socket
  • Contact Spring Plating Thickness .762
  • Contact Spring Plating Material Gold
  • Contact Mating Area Plating Thickness 30
  • Contact Transmits (Typical) Signal (Data)/Power
  • Socket Type Discrete
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • Termination Method to Wire & Cable Solder
  • Insertion Method Hand/Semi-Automatic
  • Socket Length 3.51
  • Hole Size (Recommended) 1.32
  • Wire Size 20 – 16
  • Wire Size .081 – .326
  • Mating Pin Diameter Range .36 – .66
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Solder Process Feature Anti-Flux
  • Circuit Application Power & Signal
  • Packaging Method Bag
  • Packaging Quantity 2000
  • Spring Material Beryllium Copper
CAT-377-MSSKB65 Pin Sockets  1
PRODUCT
  1. Connectors
  2. Pin Sockets
  1. Miniature Spring Sockets: Open Bottom, Beryllium Copper, 4A CAT-377-MSSKB65
active
  • Socket Sleeve Style Open Bottom
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Sleeve Plating Material Gold Flash over Nickel
  • Sleeve Material Copper
  • Contact Base Material Beryllium Copper
  • Contact Current Rating (Max) 4
  • Contact Type Socket
  • Contact Spring Plating Thickness .762
  • Contact Spring Plating Material Gold
  • Contact Mating Area Plating Thickness 30
  • Contact Transmits (Typical) Signal (Data)/Power
  • Socket Type Discrete
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • Termination Method to Wire & Cable Solder
  • Insertion Method Hand/Semi-Automatic
  • Socket Length 3.51
  • Hole Size (Recommended) 1.32
  • Wire Size 25
  • Wire Size .081 – .326
  • Mating Pin Diameter Range .36 – .66
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Solder Process Feature None
  • Circuit Application Power & Signal
  • Packaging Method Bag
  • Packaging Quantity 2000
  • Spring Material Beryllium Copper
CAT-377-MSSOB5 Pin Sockets  1
PRODUCT
  1. Connectors
  2. Pin Sockets
  1. Miniature Spring Sockets: Open Bottom, Beryllium Copper, 5A CAT-377-MSSOB5
active
  • Socket Sleeve Style Open Bottom
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Sleeve Plating Material Gold Flash over Nickel
  • Sleeve Material Copper
  • Contact Base Material Beryllium Copper
  • Contact Current Rating (Max) 5
  • Contact Type Socket
  • Contact Spring Plating Thickness .762
  • Contact Spring Plating Material Gold
  • Contact Mating Area Plating Thickness 30
  • Contact Transmits (Typical) Signal (Data)/Power
  • Socket Type Discrete
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • Termination Method to Wire & Cable Solder
  • Insertion Method Hand/Semi-Automatic/Automatic
  • Socket Length 3.51
  • Hole Size (Recommended) 1.57
  • Wire Size 12 – 9
  • Wire Size .326 – .518
  • Mating Pin Diameter Range .66 – .84
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Solder Process Feature None
  • Circuit Application Power & Signal
  • Packaging Method Bag
  • Packaging Quantity 2000
  • Spring Material Beryllium Copper
CAT-377-MSSCB65 Pin Sockets  1
PRODUCT
  1. Connectors
  2. Pin Sockets
  1. Miniature Spring Sockets: Closed Bottom, Beryllium Copper, 6.5A CAT-377-MSSCB65
active
  • Socket Sleeve Style Closed Bottom
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Sleeve Plating Material Tin
  • Sleeve Material Copper
  • Contact Base Material Beryllium Copper
  • Contact Current Rating (Max) 6.5
  • Contact Type Socket
  • Contact Spring Plating Thickness 1.27
  • Contact Spring Plating Material Gold
  • Contact Mating Area Plating Thickness 30
  • Contact Transmits (Typical) Signal (Data)/Power
  • Socket Type Discrete
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • Termination Method to Wire & Cable Solder
  • Insertion Method Hand/Semi-Automatic
  • Socket Length 3.63
  • Hole Size (Recommended) 1.83
  • Wire Size 19
  • Wire Size .41 – .518
  • Mating Pin Diameter Range .76 – .84
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Solder Process Feature None
  • Circuit Application Power & Signal
  • Packaging Method Bag
  • Packaging Quantity 2000
  • Spring Material Beryllium Copper
CAT-377-MSSCB5 Pin Sockets  1
PRODUCT
  1. Connectors
  2. Pin Sockets
  1. Miniature Spring Sockets: Closed Bottom, Beryllium Copper, 5A CAT-377-MSSCB5
active
  • Socket Sleeve Style Closed
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Sleeve Plating Material Tin
  • Sleeve Material Copper
  • Contact Base Material Beryllium Copper
  • Contact Current Rating (Max) 5
  • Contact Type Socket
  • Contact Spring Plating Material Tin
  • Contact Transmits (Typical) Signal (Data)/Power
  • Contact Mating Area Plating Material Tin
  • Socket Type Discrete
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • Termination Method to Wire & Cable Solder
  • Insertion Method Hand/Semi-Automatic/Automatic
  • Socket Length 3.51
  • Hole Size (Recommended) 1.57
  • Wire Size 12 – 9
  • Wire Size .205 – .258
  • Mating Pin Diameter Range .56 – .64
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Solder Process Feature Anti-Flux
  • Circuit Application Power & Signal
  • Packaging Method Bag
  • Packaging Quantity 2000
  • Spring Material Beryllium Copper
CAT-377-MSSBN4 Pin Sockets  1
PRODUCT
  1. Connectors
  2. Pin Sockets
  1. Miniature Spring Sockets: Bullet Nose, Beryllium Copper, 4A CAT-377-MSSBN4
active
  • Socket Sleeve Style Bullet Nose
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Sleeve Plating Material Tin
  • Sleeve Material Copper
  • Contact Base Material Beryllium Copper
  • Contact Current Rating (Max) 4
  • Contact Type Socket
  • Contact Spring Plating Thickness 2.54
  • Contact Spring Plating Material Tin
  • Contact Mating Area Plating Thickness 2.54
  • Contact Transmits (Typical) Signal (Data)/Power
  • Socket Type Discrete
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • Termination Method to Wire & Cable Solder
  • Insertion Method Hand/Semi-Automatic/Automatic
  • Socket Length 4.01
  • Hole Size (Recommended) 1.07
  • Wire Size 25 – 22
  • Wire Size .081 – .205
  • Mating Pin Diameter Range .3 – .53
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Solder Process Feature Anti-Flux
  • Circuit Application Power & Signal
  • Packaging Method Carrier Tape
  • Packaging Quantity 10000
  • Spring Material Beryllium Copper
CAT-377-MSSBN5 Pin Sockets  1
PRODUCT
  1. Connectors
  2. Pin Sockets
  1. Mini Spring Sockets: Bullet Nose, 5A CAT-377-MSSBN5
active
  • Socket Sleeve Style Bullet Nose
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Sleeve Plating Material Tin
  • Sleeve Material Copper
  • Contact Base Material Beryllium Copper
  • Contact Current Rating (Max) 5
  • Contact Type Socket
  • Contact Spring Plating Thickness .762
  • Contact Spring Plating Material Gold
  • Contact Mating Area Plating Thickness 30
  • Contact Transmits (Typical) Signal (Data)/Power
  • Socket Type Discrete
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • Termination Method to Wire & Cable Solder
  • Insertion Method Hand/Semi-Automatic/Automatic
  • Socket Length 4.67
  • Hole Size (Recommended) 1.32
  • Wire Size 22 – 20
  • Wire Size .081 – .326
  • Mating Pin Diameter Range .36 – .66
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Solder Process Feature Anti-Flux
  • Circuit Application Power & Signal
  • Packaging Method Carrier Tape
  • Packaging Quantity 10000
  • Spring Material Beryllium Copper
CAT-377-MSSKB3 Pin Sockets  1
PRODUCT
  1. Connectors
  2. Pin Sockets
  1. Miniature Spring Sockets: Knockout Bottom Beryllium Copper, 3A CAT-377-MSSKB3
active
  • Socket Sleeve Style Knockout Bottom
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Sleeve Plating Material Tin
  • Sleeve Material Copper
  • Contact Base Material Beryllium Copper
  • Contact Current Rating (Max) 3
  • Contact Type Socket
  • Contact Spring Plating Thickness .762
  • Contact Spring Plating Material Gold
  • Contact Mating Area Plating Thickness 30
  • Contact Transmits (Typical) Signal (Data)/Power
  • Socket Type Discrete
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • Termination Method to Wire & Cable Solder
  • Insertion Method Hand/Semi-Automatic
  • Socket Length 3.61
  • Hole Size (Recommended) 1.04
  • Wire Size 28 – 25
  • Wire Size .081 – .162
  • Mating Pin Diameter Range .33 – .51
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Solder Process Feature None
  • Circuit Application Power & Signal
  • Packaging Method Bag
  • Packaging Quantity 2000
  • Spring Material Beryllium Copper
CAT-377-MSSOB4 Pin Sockets  1
PRODUCT
  1. Connectors
  2. Pin Sockets
  1. Miniature Spring Sockets: Open Bottom, Beryllium Copper, 6.5A CAT-377-MSSOB4
active
  • Socket Sleeve Style Open Bottom
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Sleeve Plating Material Gold Flash over Nickel
  • Sleeve Material Copper
  • Contact Base Material Beryllium Copper
  • Contact Current Rating (Max) 6.5
  • Contact Type Socket
  • Contact Spring Plating Thickness .762
  • Contact Spring Plating Material Gold
  • Contact Mating Area Plating Thickness 30
  • Contact Transmits (Typical) Signal (Data)/Power
  • Socket Type Discrete
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • Termination Method to Wire & Cable Solder
  • Insertion Method Hand/Semi-Automatic
  • Socket Length 3.63
  • Hole Size (Recommended) 1.83
  • Wire Size 19
  • Wire Size .326 – .518
  • Mating Pin Diameter Range .71 – .84
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Solder Process Feature None
  • Circuit Application Power & Signal
  • Packaging Method Bag
  • Packaging Quantity 2000
  • Spring Material Beryllium Copper
CAT-377-MSSBN65 Pin Sockets  1
PRODUCT
  1. Connectors
  2. Pin Sockets
  1. Miniature Spring Sockets: Bullet Nose, Beryllium Copper, 6.5A CAT-377-MSSBN65
active
  • Socket Sleeve Style Bullet Nose
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Sleeve Plating Material Tin
  • Sleeve Material Copper
  • Contact Base Material Beryllium Copper
  • Contact Current Rating (Max) 6.5
  • Contact Type Socket
  • Contact Spring Plating Material Gold
  • Contact Mating Area Plating Thickness 30
  • Contact Transmits (Typical) Signal (Data)/Power
  • Socket Type Discrete
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • Termination Method to Wire & Cable Solder
  • Insertion Method Hand/Semi-Automatic/Automatic
  • Socket Length 6.6
  • Hole Size (Recommended) 1.75
  • Wire Size 19
  • Wire Size .653
  • Mating Pin Diameter Range .94 – 1.04
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Solder Process Feature Anti-Flux
  • Circuit Application Power & Signal
  • Packaging Method Carrier Tape
  • Packaging Quantity 10000
  • Spring Material Beryllium Copper
CAT-377-MSSKB65A Pin Sockets  1
PRODUCT
  1. Connectors
  2. Pin Sockets
  1. Miniature Spring Sockets: Knockout Bottom Beryllium Copper, 6.5A CAT-377-MSSKB65A
active
  • Socket Sleeve Style Knockout Bottom
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Sleeve Plating Material Tin
  • Sleeve Material Copper
  • Contact Base Material Beryllium Copper
  • Contact Current Rating (Max) 6.5
  • Contact Type Socket
  • Contact Spring Plating Thickness .685
  • Contact Spring Plating Material Gold
  • Contact Mating Area Plating Thickness 30
  • Contact Transmits (Typical) Signal (Data)/Power
  • Socket Type Discrete
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • Termination Method to Wire & Cable Solder
  • Insertion Method Hand/Semi-Automatic
  • Socket Length 3.63
  • Hole Size (Recommended) 1.83
  • Wire Size 19
  • Wire Size .518 – .823
  • Mating Pin Diameter Range .86 – 1.04
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Solder Process Feature None
  • Circuit Application Power & Signal
  • Packaging Method Bag
  • Packaging Quantity 2000
  • Spring Material Beryllium Copper
CAT-377-MSSBN75 Pin Sockets  1
PRODUCT
  1. Connectors
  2. Pin Sockets
  1. Miniature Spring Sockets: Bullet Nose, Beryllium Copper, 7.5A CAT-377-MSSBN75
active
  • Socket Sleeve Style Bullet Nose
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Sleeve Plating Material Tin
  • Sleeve Material Copper
  • Contact Base Material Beryllium Copper
  • Contact Current Rating (Max) 7.5
  • Contact Type Socket
  • Contact Spring Plating Thickness 2.54
  • Contact Spring Plating Material Tin
  • Contact Mating Area Plating Thickness 30
  • Contact Transmits (Typical) Signal (Data)/Power
  • Socket Type Discrete
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • Termination Method to Wire & Cable Solder
  • Insertion Method Hand/Semi-Automatic
  • Socket Length 7.82
  • Hole Size (Recommended) 2.59
  • Wire Size 18 – 17
  • Wire Size .823 – 1.04
  • Mating Pin Diameter Range 1.07 – 1.24
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Solder Process Feature Anti-Flux
  • Circuit Application Power & Signal
  • Packaging Method Bag
  • Packaging Quantity 2000
  • Spring Material Beryllium Copper
5-5330808-6 Pin Sockets  1
PRODUCT
  1. Connectors
  2. Pin Sockets
  1. SOCKET,MIN-SPR W/H SN-AU SER-1 5-5330808-6
active
  • Socket Sleeve Style Open Bottom
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Sleeve Plating Material Tin
  • Sleeve Material Copper
  • Contact Base Material Beryllium Copper
  • Contact Current Rating (Max) 3
  • Contact Type Socket
  • Contact Spring Plating Thickness .762
  • Contact Spring Plating Material Gold
  • Contact Mating Area Plating Thickness 30
  • Contact Transmits (Typical) Signal (Data)/Power
  • Socket Type Discrete
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • Termination Method to Wire & Cable Solder
  • Insertion Method Hand/Semi-Automatic
  • Socket Length 3.61
  • Hole Size (Recommended) 1.04
  • Wire Size 28 – 25
  • Wire Size .081 – .162
  • Mating Pin Diameter Range .33 – .51
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Solder Process Feature None
  • Circuit Application Signal
  • Packaging Method Bag
  • Packaging Quantity 2000
  • Spring Material Beryllium Copper
2-331677-9 Pin Sockets  1
PRODUCT
  1. Connectors
  2. Pin Sockets
  1. SOCKET,MIN-SPR W/KO AU SER-3 2-331677-9
active
  • Socket Sleeve Style Knockout Bottom
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Sleeve Plating Material Gold Flash over Nickel
  • Sleeve Material Copper
  • Contact Base Material Beryllium Copper
  • Contact Current Rating (Max) 5
  • Contact Type Socket
  • Contact Spring Plating Thickness .762
  • Contact Spring Plating Material Gold
  • Contact Mating Area Plating Thickness 30
  • Contact Transmits (Typical) Signal (Data)/Power
  • Socket Type Discrete
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • Termination Method to Wire & Cable Solder
  • Insertion Method Hand/Semi-Automatic/Automatic
  • Socket Length 3.51
  • Hole Size (Recommended) 1.57
  • Wire Size 20 – 21
  • Wire Size .41 – .518
  • Mating Pin Diameter Range .76 – .84
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Solder Process Feature None
  • Circuit Application Power & Signal
  • Packaging Method Bag
  • Packaging Quantity 2000
  • Spring Material Beryllium Copper
5645522-1 Pin Sockets  1
PRODUCT
  1. Connectors
  2. Pin Sockets
  1. MSS, SER 4, W/SEAL,SN-SN,STRIP 5645522-1
active
  • Connector System Cable-to-Board
  • Sealable Yes
  • Connector & Contact Terminates To Printed Circuit Board
  • Contact Current Rating (Max) 6.5
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • Termination Method to Wire & Cable Solder
  • Socket Length 6.6
  • Hole Size (Recommended) 1.8
  • Mating Pin Diameter Range .86 – 1.04
  • Operating Temperature Range -65 – 125
  • Solder Process Feature Anti-Flux
  • Circuit Application Power & Signal
3-5331272-5 Pin Sockets  1
PRODUCT
  1. Connectors
  2. Pin Sockets
  1. SOCKET,MIN-SPR SN-AU SER-2 3-5331272-5
active
  • Socket Sleeve Style Knockout Bottom
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Sleeve Plating Material Tin
  • Sleeve Material Copper
  • Contact Base Material Beryllium Copper
  • Contact Current Rating (Max) 4
  • Contact Type Socket
  • Contact Spring Plating Thickness .762
  • Contact Spring Plating Material Gold
  • Contact Mating Area Plating Thickness 30
  • Contact Transmits (Typical) Signal (Data)/Power
  • Socket Type Discrete
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • Termination Method to Wire & Cable Solder
  • Insertion Method Hand/Semi-Automatic
  • Socket Length 3.51
  • Hole Size (Recommended) 1.32
  • Wire Size 24 – 23
  • Wire Size .205 – .258
  • Mating Pin Diameter Range .56 – .64
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Solder Process Feature None
  • Circuit Application Power & Signal
  • Packaging Method Bag
  • Packaging Quantity 2000
  • Spring Material Beryllium Copper
322-HCS6P2-100 Pin Sockets  1
PRODUCT
  1. Connectors
  2. Pin Sockets
  1. 322-HCS6P2-100=HOLT CNT SKT RE 322-HCS6P2-100
nrd
  • Socket Sleeve Style Open Bottom
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Sleeve Plating Material Tin
  • Sleeve Material Copper
  • Contact Base Material Beryllium Copper
  • Contact Current Rating (Max) 5
  • Contact Type Socket
  • Contact Spring Plating Material Tin
  • Contact Mating Area Plating Thickness .76
  • Contact Transmits (Typical) Signal (Data)/Power
  • Contact Mating Area Plating Material Tin
  • Socket Type Discrete
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • Termination Method to Wire & Cable Solder
  • Insertion Method Hand/Semi-Automatic/Automatic
  • Socket Length 3.45
  • Hole Size (Recommended) 1.61
  • Wire Size 28 – 25
  • Wire Size .081 – .162
  • Mating Pin Diameter Range .51 – .76
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Solder Process Feature None
  • Circuit Application Signal
  • Packaging Method Reel
  • Packaging Quantity 2000
  • Spring Material Beryllium Copper