1-50871-3 Pin Sockets  1
  • Socket Sleeve Style Closed Bottom
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Sleeve Plating Material Gold Flash over Nickel
  • Sleeve Material Copper
  • Contact Base Material Beryllium Copper
  • Contact Current Rating (Max) 7.5
  • Contact Type Socket
  • Contact Spring Plating Thickness .762
  • Contact Spring Plating Material Gold
  • Contact Mating Area Plating Thickness 30
  • Contact Transmits (Typical) Signal (Data)/Power
  • Socket Type Discrete
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • Termination Method to Wire & Cable Solder
  • Insertion Method Hand/Semi-Automatic
  • Socket Length 7.32
  • Hole Size (Recommended) 2.56
  • Wire Size 17 – 15
  • Wire Size 1.04 – 1.65
  • Mating Pin Diameter Range 1.27 – 1.45
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Solder Process Feature None
  • Circuit Application Power & Signal
  • Packaging Method Bag
  • Packaging Quantity 2000
  • Spring Material Beryllium Copper
5645994-1 Pin Sockets  1
  • Socket Sleeve Style Closed
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Sleeve Plating Material Tin
  • Sleeve Material Copper
  • Contact Base Material Beryllium Copper
  • Contact Current Rating (Max) 6.5
  • Contact Type Socket
  • Contact Spring Plating Thickness .762
  • Contact Spring Plating Material Gold
  • Contact Mating Area Plating Thickness 30
  • Contact Transmits (Typical) Signal (Data)/Power
  • Socket Type Discrete
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • Termination Method to Wire & Cable Solder
  • Insertion Method Hand/Semi-Automatic
  • Socket Length 6.53
  • Hole Size (Recommended) 1.57
  • Wire Size 22 – 20
  • Wire Size .326 – .518
  • Mating Pin Diameter Range .66 – .84
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Solder Process Feature Anti-Flux
  • Circuit Application Power & Signal
  • Packaging Method Carrier Tape
  • Packaging Quantity 10000
  • Spring Material Beryllium Copper
5645522-1 Pin Sockets  1
  • Connector System Cable-to-Board
  • Sealable Yes
  • Connector & Contact Terminates To Printed Circuit Board
  • Contact Current Rating (Max) 6.5
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • Termination Method to Wire & Cable Solder
  • Socket Length 6.6
  • Hole Size (Recommended) 1.8
  • Mating Pin Diameter Range .86 – 1.04
  • Operating Temperature Range -65 – 125
  • Solder Process Feature Anti-Flux
  • Circuit Application Power & Signal
1-5332095-9 Pin Sockets  1
  • Socket Sleeve Style Knockout Bottom
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Sleeve Plating Material Tin
  • Sleeve Material Copper
  • Contact Base Material Beryllium Copper
  • Contact Current Rating (Max) 5
  • Contact Type Socket
  • Contact Spring Plating Thickness .762
  • Contact Spring Plating Material Gold
  • Contact Mating Area Plating Thickness 30
  • Contact Transmits (Typical) Signal (Data)/Power
  • Contact Mating Area Plating Material Gold
  • Socket Type Discrete
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • Termination Method to Wire & Cable Solder
  • Insertion Method Hand/Semi-Automatic
  • Socket Length 4.52
  • Hole Size (Recommended) 1.04
  • Wire Size 28 – 25
  • Wire Size .081 – .162
  • Mating Pin Diameter Range .33 – .51
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Solder Process Feature None
  • Circuit Application Power & Signal
  • Packaging Method Bag
  • Packaging Quantity 2000
  • Spring Material Beryllium Copper
5050865-6 Pin Sockets  1
  • Socket Sleeve Style Open Bottom
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Sleeve Plating Material Tin
  • Sleeve Material Copper
  • Contact Base Material Beryllium Copper
  • Contact Current Rating (Max) 7.5
  • Contact Type Socket
  • Contact Spring Plating Thickness 2.54
  • Contact Spring Plating Material Tin
  • Contact Mating Area Plating Thickness 2.54
  • Contact Transmits (Typical) Signal (Data)/Power
  • Socket Type Discrete
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • Termination Method to Wire & Cable Solder
  • Insertion Method Hand/Semi-Automatic
  • Socket Length 6.6
  • Hole Size (Recommended) 1.83
  • Wire Size 20 – 18
  • Wire Size .518 – .823
  • Mating Pin Diameter Range .86 – 1.04
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Solder Process Feature None
  • Circuit Application Power & Signal
  • Packaging Method Bag
  • Packaging Quantity 2000
  • Spring Material Beryllium Copper
5050871-6 Pin Sockets  1
  • Socket Sleeve Style Open Bottom
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Sleeve Plating Material Tin
  • Sleeve Material Copper
  • Contact Base Material Beryllium Copper
  • Contact Current Rating (Max) 7.5
  • Contact Type Socket
  • Contact Spring Plating Thickness 2.54
  • Contact Spring Plating Material Tin
  • Contact Mating Area Plating Thickness 2.54
  • Contact Transmits (Typical) Signal (Data)/Power
  • Socket Type Discrete
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • Termination Method to Wire & Cable Solder
  • Insertion Method Hand/Semi-Automatic
  • Socket Length 7.32
  • Hole Size (Recommended) 2.56
  • Wire Size 18 – 17
  • Wire Size .823 – 1.04
  • Mating Pin Diameter Range 1.07 – 1.24
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Solder Process Feature None
  • Circuit Application Power & Signal
  • Packaging Method Bag
  • Packaging Quantity 2000
  • Spring Material Beryllium Copper
5050864-6 Pin Sockets  1
  • Socket Sleeve Style Closed Bottom
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Sleeve Plating Material Tin
  • Sleeve Material Copper
  • Contact Base Material Beryllium Copper
  • Contact Current Rating (Max) 6.5
  • Contact Type Socket
  • Contact Spring Plating Material Tin
  • Contact Transmits (Typical) Signal (Data)/Power
  • Contact Mating Area Plating Material Tin
  • Socket Type Discrete
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • Termination Method to Wire & Cable Solder
  • Insertion Method Hand/Semi-Automatic/Automatic
  • Socket Length 6.53
  • Hole Size (Recommended) 1.57
  • Wire Size 22 – 20
  • Wire Size .326 – .518
  • Mating Pin Diameter Range .66 – .84
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Solder Process Feature None
  • Circuit Application Power & Signal
  • Packaging Method Bag
  • Packaging Quantity 2000
  • Spring Material Beryllium Copper
50865 Pin Sockets  1
  • Socket Sleeve Style Closed Bottom
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Sleeve Plating Material Gold Flash over Nickel
  • Sleeve Material Copper
  • Contact Base Material Beryllium Copper
  • Contact Current Rating (Max) 7.5
  • Contact Type Socket
  • Contact Spring Plating Thickness .127
  • Contact Spring Plating Material Gold
  • Contact Mating Area Plating Thickness 30
  • Contact Transmits (Typical) Signal (Data)/Power
  • Socket Type Discrete
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • Termination Method to Wire & Cable Solder
  • Insertion Method Hand/Semi-Automatic
  • Socket Length 6.6
  • Hole Size (Recommended) 1.83
  • Wire Size 20 – 18
  • Wire Size .518 – .823
  • Mating Pin Diameter Range .86 – 1.04
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Solder Process Feature None
  • Circuit Application Power & Signal
  • Packaging Method Bag
  • Packaging Quantity 2000
  • Spring Material Beryllium Copper
1-5645502-1 Pin Sockets  1
  • Socket Sleeve Style Bullet Nose
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Sleeve Plating Material Tin
  • Sleeve Material Copper
  • Contact Base Material Beryllium Copper
  • Contact Current Rating (Max) 7.5
  • Contact Type Socket
  • Contact Spring Plating Material Gold
  • Contact Mating Area Plating Thickness 30
  • Contact Transmits (Typical) Signal (Data)/Power
  • Socket Type Discrete
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • Termination Method to Wire & Cable Solder
  • Insertion Method Hand/Semi-Automatic/Automatic
  • Socket Length 6.6
  • Hole Size (Recommended) 1.75
  • Wire Size 19
  • Wire Size .653
  • Mating Pin Diameter Range .94 – 1.04
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Solder Process Feature None
  • Circuit Application Power & Signal
  • Packaging Method Carrier Tape
  • Packaging Quantity 10000
  • Spring Material Beryllium Copper
50935 Pin Sockets  1
  • Socket Sleeve Style Closed Bottom
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Sleeve Plating Material Gold Flash over Nickel
  • Sleeve Material Copper
  • Contact Base Material Beryllium Copper
  • Contact Current Rating (Max) 5
  • Contact Type Socket
  • Contact Spring Plating Thickness .762
  • Contact Spring Plating Material Gold
  • Contact Mating Area Plating Thickness 30
  • Contact Transmits (Typical) Signal (Data)/Power
  • Socket Type Discrete
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • Termination Method to Wire & Cable Solder
  • Insertion Method Hand/Semi-Automatic
  • Socket Length 4.27
  • Hole Size (Recommended) 1.04
  • Wire Size 28 – 25
  • Wire Size .081 – .162
  • Mating Pin Diameter Range .33 – .51
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Solder Process Feature None
  • Circuit Application Power & Signal
  • Packaging Method Bag
  • Packaging Quantity 2000
  • Spring Material Beryllium Copper
5050865-1 Pin Sockets  1
  • Socket Sleeve Style Knockout Bottom
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Sleeve Plating Material Tin
  • Sleeve Material Copper
  • Contact Base Material Beryllium Copper
  • Contact Current Rating (Max) 7.5
  • Contact Type Socket
  • Contact Spring Plating Thickness .762
  • Contact Spring Plating Material Gold
  • Contact Mating Area Plating Thickness 30
  • Contact Transmits (Typical) Signal (Data)/Power
  • Socket Type Discrete
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • Termination Method to Wire & Cable Solder
  • Insertion Method Hand/Semi-Automatic
  • Socket Length 6.6
  • Hole Size (Recommended) 1.83
  • Wire Size 20 – 18
  • Wire Size .518 – .823
  • Mating Pin Diameter Range .86 – 1.04
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Solder Process Feature None
  • Circuit Application Power & Signal
  • Packaging Method Bag
  • Packaging Quantity 2000
  • Spring Material Beryllium Copper
50865-5 Pin Sockets  1
  • Socket Sleeve Style Closed Bottom
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Sleeve Plating Material Tin
  • Sleeve Material Copper
  • Contact Base Material Beryllium Copper
  • Contact Current Rating (Max) 7.5
  • Contact Type Socket
  • Contact Spring Plating Thickness .127
  • Contact Spring Plating Material Gold
  • Contact Mating Area Plating Thickness 30
  • Contact Transmits (Typical) Signal (Data)/Power
  • Socket Type Discrete
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • Termination Method to Wire & Cable Solder
  • Insertion Method Hand/Semi-Automatic
  • Socket Length 6.6
  • Hole Size (Recommended) 1.83
  • Wire Size 20 – 18
  • Wire Size .518 – .823
  • Mating Pin Diameter Range .86 – 1.04
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Solder Process Feature None
  • Circuit Application Power & Signal
  • Packaging Method Bag
  • Packaging Quantity 2000
  • Spring Material Beryllium Copper
8134-HC-6P3 Pin Sockets  1
  • Socket Sleeve Style Open Bottom
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Sleeve Plating Material Tin
  • Sleeve Material Copper
  • Contact Base Material Beryllium Copper
  • Contact Current Rating (Max) 5
  • Contact Type Socket
  • Contact Spring Plating Material Tin
  • Contact Transmits (Typical) Signal (Data)/Power
  • Contact Mating Area Plating Material Tin-Lead
  • Socket Type Discrete
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • Termination Method to Wire & Cable Solder
  • Insertion Method Hand/Semi-Automatic
  • Socket Length 3.45
  • Hole Size (Recommended) 1.47
  • Mating Pin Diameter Range .51 – .76
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Solder Process Feature None
  • Circuit Application Signal
  • Packaging Method Loose Piece
  • Packaging Quantity 2000
  • Spring Material Beryllium Copper
147444-1 Pin Sockets
  • Socket Sleeve Style Closed
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Contact
  • Profile Zero
  • Sleeve Plating Material Gold
  • Sleeve Material Copper
  • Contact Base Material Beryllium Copper
  • Contact Current Rating (Max) 5
  • Contact Type Socket
  • Contact Spring Plating Material Gold
  • Contact Mating Area Plating Thickness 30
  • Contact Transmits (Typical) Signal (Data)/Power
  • Socket Type Discrete
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • Termination Method to Wire & Cable Solder
  • Insertion Method Hand/Semi-Automatic
  • Socket Length 5.84
  • Hole Size (Recommended) 1.02
  • Mating Pin Diameter Range .33 – .51
  • Solder Process Feature None
  • Circuit Application Power & Signal
  • Packaging Method Bag
  • Packaging Quantity 2000
  • Spring Material Beryllium Copper
5050863-5 Pin Sockets  1
  • Socket Sleeve Style Closed Bottom
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Sleeve Plating Material Tin
  • Sleeve Material Copper
  • Contact Base Material Beryllium Copper
  • Contact Current Rating (Max) 5
  • Contact Type Socket
  • Contact Spring Plating Thickness .762
  • Contact Spring Plating Material Gold
  • Contact Mating Area Plating Thickness 30
  • Contact Transmits (Typical) Signal (Data)/Power
  • Socket Type Discrete
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • Termination Method to Wire & Cable Solder
  • Insertion Method Hand/Semi-Automatic
  • Socket Length 6.6
  • Hole Size (Recommended) 1.32
  • Wire Size 28 – 22
  • Wire Size .081 – .326
  • Mating Pin Diameter Range .36 – .66
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Solder Process Feature None
  • Circuit Application Power & Signal
  • Packaging Method Bag
  • Packaging Quantity 2000
  • Spring Material Beryllium Copper
3-5332070-5 Pin Sockets  1
  • Socket Sleeve Style Knockout Bottom
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Sleeve Plating Material Tin
  • Sleeve Material Copper
  • Contact Base Material Beryllium Copper
  • Contact Current Rating (Max) 7.5
  • Contact Type Socket
  • Contact Spring Plating Thickness .685
  • Contact Spring Plating Material Gold
  • Contact Mating Area Plating Thickness 30
  • Contact Transmits (Typical) Signal (Data)/Power
  • Socket Type Discrete
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • Termination Method to Wire & Cable Solder
  • Insertion Method Hand/Semi-Automatic
  • Socket Length 3.63
  • Hole Size (Recommended) 1.83
  • Wire Size 19
  • Wire Size .653
  • Mating Pin Diameter Range .94 – 1.02
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Solder Process Feature None
  • Circuit Application Power & Signal
  • Packaging Method Bag
  • Packaging Quantity 2000
  • Spring Material Beryllium Copper
6-1437514-7 Pin Sockets  1
  • Socket Sleeve Style Open Bottom
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Sleeve Plating Material Tin
  • Sleeve Material Copper
  • Contact Base Material Beryllium Copper
  • Contact Current Rating (Max) 5
  • Contact Type Socket
  • Contact Spring Plating Material Tin
  • Contact Transmits (Typical) Signal (Data)/Power
  • Contact Mating Area Plating Material Tin-Lead
  • Socket Type Discrete
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • Termination Method to Wire & Cable Solder
  • Insertion Method Hand/Semi-Automatic/Automatic
  • Socket Length 3.51
  • Hole Size (Recommended) 1.57
  • Mating Pin Diameter Range .66 – .74
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Solder Process Feature None
  • Circuit Application Signal
  • Packaging Method Loose Piece
  • Packaging Quantity 2000
  • Spring Material Beryllium Copper
5380635-2 Pin Sockets  1
  • Socket Sleeve Style Open Bottom
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Sleeve Plating Material Tin
  • Sleeve Material Copper
  • Contact Base Material Beryllium Copper
  • Contact Current Rating (Max) 7.5
  • Contact Type Socket
  • Contact Spring Plating Thickness .762
  • Contact Spring Plating Material Gold
  • Contact Mating Area Plating Thickness 30
  • Contact Transmits (Typical) Signal (Data)/Power
  • Socket Type Discrete
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • Termination Method to Wire & Cable Solder
  • Insertion Method Hand/Semi-Automatic
  • Socket Length 6.45
  • Hole Size (Recommended) 2.26
  • Wire Size 25 – 19
  • Wire Size .162 – .653
  • Mating Pin Diameter Range .46 – 1.02
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 126
  • Solder Process Feature None
  • Circuit Application Power & Signal
  • Packaging Method Bag
  • Packaging Quantity 2000
  • Spring Material Beryllium Copper
50935-6 Pin Sockets  1
  • Socket Sleeve Style Open Bottom
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Sleeve Plating Material Gold Flash over Nickel
  • Sleeve Material Copper
  • Contact Base Material Beryllium Copper
  • Contact Current Rating (Max) 5
  • Contact Type Socket
  • Contact Spring Plating Thickness .762
  • Contact Spring Plating Material Gold
  • Contact Mating Area Plating Thickness 30
  • Contact Transmits (Typical) Signal (Data)/Power
  • Socket Type Discrete
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • Termination Method to Wire & Cable Solder
  • Insertion Method Hand/Semi-Automatic
  • Socket Length 4.27
  • Hole Size (Recommended) 1.04
  • Wire Size 28 – 25
  • Wire Size .081 – .162
  • Mating Pin Diameter Range .33 – .51
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Solder Process Feature None
  • Circuit Application Power & Signal
  • Packaging Method Bag
  • Packaging Quantity 1000
  • Spring Material Beryllium Copper
2-331677-6 Pin Sockets  1
  • Socket Sleeve Style Open Bottom
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Sleeve Plating Material Gold Flash over Nickel
  • Sleeve Material Copper
  • Contact Base Material Beryllium Copper
  • Contact Current Rating (Max) 6.5
  • Contact Type Socket
  • Contact Spring Plating Thickness .762
  • Contact Spring Plating Material Gold
  • Contact Mating Area Plating Thickness 30
  • Contact Transmits (Typical) Signal (Data)/Power
  • Socket Type Discrete
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • Termination Method to Wire & Cable Solder
  • Insertion Method Hand/Semi-Automatic/Automatic
  • Socket Length 3.51
  • Hole Size (Recommended) 1.57
  • Wire Size 20 – 21
  • Wire Size .41 – .518
  • Mating Pin Diameter Range .76 – .84
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Solder Process Feature None
  • Circuit Application Power & Signal
  • Packaging Method Bag
  • Packaging Quantity 2000
  • Spring Material Beryllium Copper