PRODUCT
active
- Connector Style Receptacle
- Connector System Cable-to-Board
- Connector & Contact Terminates To Printed Circuit Board
- Product Designation SFP
- Product Type Connector
- Number of Positions 7
- Number of Bays 1
- Contact Base Material Copper Alloy
- Contact Current Rating (Max) .5
- Contact Mating Area Plating Thickness 1.27
- Contact Mating Area Plating Material Gold over Nickel
- PCB Mount Retention Without
- Mounting Angle Right Angle
- PCB Mounting Style Surface Mount
- Connector Mounting Type Board Mount
- Centerline (Pitch) 1.27
- Housing Material LCP (Liquid Crystal Polymer)
- Operating Temperature Range -10 – 60
- Circuit Application Signal
- For Use With Fibre Channel
- Packaging Method Tape & Reel
PRODUCT
active
- Connector Style Plug
- Connector System Cable-to-Board
- Product Designation None
- Product Type Connector
- Number of Positions 7
- Spring Plating Material Tin
- Contact Current Rating (Max) .5
- Housing Material Die Cast Metal
- Housing Plating Material Tin-Lead over Nickel over Copper
- Cable Diameter Range 5.46 – 6.22
- Operating Temperature Range -10 – 60
- For Use With HSSDC2
- Spring Material Phosphor Bronze
- Comment Does not include cable, overmold, wire organizer or plug PCB.
PRODUCT
active
- Connector Style Receptacle
- Connector System Cable-to-Board
- Connector & Contact Terminates To Printed Circuit Board
- Product Designation SFP
- Product Type Connector
- Number of Positions 7
- Number of Bays 1
- Contact Base Material Copper Alloy
- Contact Current Rating (Max) .5
- Contact Mating Area Plating Thickness 1.27
- Contact Mating Area Plating Material Gold over Nickel
- PCB Mount Retention Without
- Mounting Angle Right Angle
- PCB Mounting Style Surface Mount
- Connector Mounting Type Board Mount
- Centerline (Pitch) 1.27
- Housing Material LCP (Liquid Crystal Polymer)
- Operating Temperature Range -10 – 60
- Circuit Application Signal
- For Use With Fibre Channel
- Packaging Method Tape & Reel
PRODUCT
active
- Connector Style Plug
- Connector System Cable-to-Board
- Product Designation None
- Product Type Connector
- Number of Positions 7
- Spring Plating Material Tin
- Contact Current Rating (Max) .5
- Housing Material Die Cast Metal
- Housing Plating Material Tin over Nickel over Copper
- Cable Diameter Range 5.46 – 6.22
- Operating Temperature Range -10 – 60
- For Use With HSSDC2
- Spring Material Phosphor Bronze
- Comment Does not include cable, overmold, wire organizer or plug PCB.
PRODUCT
active
- Connector Style Plug
- Connector System Cable-to-Board
- Product Designation None
- Product Type Connector
- Number of Positions 7
- Spring Plating Material Tin
- Contact Current Rating (Max) .5
- Housing Material Die Cast Metal
- Housing Plating Material Tin over Nickel over Copper
- Cable Diameter Range 4.06 – 4.83
- Operating Temperature Range -10 – 60
- For Use With HSSDC2
- Spring Material Phosphor Bronze
- Comment Does not include cable, overmold, wire organizer or plug PCB.
PRODUCT
active
- Connector Style Receptacle
- Connector System Cable-to-Board
- Connector & Contact Terminates To Printed Circuit Board
- Product Designation SFP
- Product Type Connector
- Number of Positions 7
- Number of Bays 1
- Contact Base Material Copper Alloy
- Contact Current Rating (Max) .5
- Contact Mating Area Plating Thickness 1.27
- Contact Mating Area Plating Material Gold over Nickel
- PCB Mount Retention Without
- Mounting Angle Right Angle
- PCB Mounting Style Surface Mount
- Connector Mounting Type Board Mount
- Centerline (Pitch) 1.27
- Housing Material LCP (Liquid Crystal Polymer)
- Operating Temperature Range -10 – 60
- Circuit Application Signal
- For Use With Fibre Channel
- Packaging Method Box & Tray
PRODUCT
active
- Connector Style Receptacle
- Connector System Cable-to-Board
- Connector & Contact Terminates To Printed Circuit Board
- Product Designation SFP
- Product Type Connector
- Number of Positions 7
- PCB Retention Location On Shell
- Number of Bays 1
- Contact Base Material Copper Alloy
- Contact Current Rating (Max) .5
- Contact Mating Area Plating Thickness 1.27
- Contact Mating Area Plating Material Gold over Nickel
- PCB Mount Retention Type Boardlock
- PCB Mount Retention With
- Mounting Angle Right Angle
- PCB Mounting Style Surface Mount
- Connector Mounting Type Board Mount
- Centerline (Pitch) 1.27
- Housing Material LCP (Liquid Crystal Polymer)
- Operating Temperature Range -10 – 60
- Circuit Application Signal
- For Use With Fibre Channel
- Packaging Method Tape & Reel
PRODUCT
active
- Connector Style Receptacle
- Connector System Cable-to-Board
- Connector & Contact Terminates To Printed Circuit Board
- Product Designation None
- Product Type Connector
- Number of Positions 7
- PCB Retention Location On Shell
- Number of Bays 1
- Shield Material Phosphor Bronze
- Shield Plating Material Tin over Nickel
- Contact Base Material Copper Alloy
- Contact Current Rating (Max) .5
- Contact Mating Area Plating Thickness 1.27
- Contact Mating Area Plating Material Gold over Nickel
- PCB Mount Retention Type Boardlock
- PCB Mount Retention With
- Mounting Angle Right Angle
- PCB Mounting Style Surface Mount
- Connector Mounting Type Board Mount
- Centerline (Pitch) 1.27
- Housing Material LCP (Liquid Crystal Polymer)
- Operating Temperature Range -10 – 60
- Circuit Application Signal
- For Use With Fibre Channel
- Packaging Method Tape & Reel