2302785-2 High Speed Backplane Connectors  1
  • Connector System Board-to-Board
  • Row-to-Row Spacing 1.35
  • Connector Style Plug
  • Shrouded Unshrouded
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Signal Arrangement Differential
  • Connector Type Daughtercard (Plug)
  • Product Type Daughtercard Connector
  • Number of Signal Positions 8
  • Number of Pairs 32
  • Number of Power Positions 0
  • Number of Positions 112
  • Number of Rows 7
  • Number of Columns 16
  • Board-to-Board Configuration Right Angle
  • PCB Mount Orientation Right Angle
  • Guide Location Unguided
  • Card Slot Centerline 20.3
  • Number of Ground Positions 40
  • Number of Differential Pairs per Column 2
  • Differential Impedance 100
  • Contact Current Rating (Max) 1
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • Mating Alignment Guide Hardware
  • Mating Alignment Type Keyed
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) 1.8
  • Housing Material LCP - GF (Liquid Crystal Polymer)
  • Operating Temperature Range -55 – 125
  • Circuit Application Signal
2302786-2 High Speed Backplane Connectors  1
  • Connector System Board-to-Board
  • Row-to-Row Spacing 1.35
  • Connector Style Plug
  • Shrouded Unshrouded
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Connector Type Daughtercard (Plug)
  • Product Type Daughtercard Connector
  • Number of Signal Positions 16
  • Number of Pairs 4
  • Number of Power Positions 6
  • Number of Positions 56
  • Number of Rows 7
  • Number of Columns 8
  • Board-to-Board Configuration Right Angle
  • PCB Mount Orientation Right Angle
  • Guide Location Unguided
  • Card Slot Centerline 20.3
  • Number of Ground Positions 11
  • Number of Differential Pairs per Column 2
  • Differential Impedance 100
  • Contact Current Rating (Max) 1
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • Mating Alignment Guide Hardware
  • Mating Alignment Type Keyed
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) 1.8
  • Housing Material LCP - GF (Liquid Crystal Polymer)
  • Operating Temperature Range -55 – 125
  • Circuit Application Power & Signal
2302788-2 High Speed Backplane Connectors  1
  • Connector System Board-to-Board
  • Row-to-Row Spacing 1.8
  • Connector Style Receptacle
  • Shrouded Unshrouded
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Connector Type Backplane (Receptacle)
  • Product Type Motherboard Connector
  • Number of Positions 72
  • Number of Rows 9
  • Number of Columns 8
  • Board-to-Board Configuration Vertical
  • PCB Mount Orientation Vertical
  • Guide Location Unguided
  • Card Slot Centerline 20.3
  • Number of Differential Pairs per Column 2
  • Differential Impedance 100
  • Contact Current Rating (Max) 1
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • Mating Alignment Guide Hardware
  • Mating Alignment Type Keyed
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) 1.8
  • Housing Material LCP - GF (Liquid Crystal Polymer)
  • Operating Temperature Range -55 – 125
  • Circuit Application Power & Signal
2302789-2 High Speed Backplane Connectors  1
  • Connector System Board-to-Board
  • Row-to-Row Spacing 1.8
  • Connector Style Receptacle
  • Shrouded Unshrouded
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Connector Type Backplane (Receptacle)
  • Product Type Motherboard Connector
  • Number of Positions 144
  • Number of Rows 9
  • Number of Columns 16
  • Board-to-Board Configuration Vertical
  • PCB Mount Orientation Vertical
  • Guide Location Unguided
  • Card Slot Centerline 20.3
  • Number of Differential Pairs per Column 2
  • Differential Impedance 100
  • Contact Current Rating (Max) 1
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • Mating Alignment Guide Hardware
  • Mating Alignment Type Keyed
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) 1.8
  • Housing Material LCP - GF (Liquid Crystal Polymer)
  • Operating Temperature Range -55 – 125
  • Circuit Application Power & Signal
2302790-2 High Speed Backplane Connectors  1
  • Connector System Board-to-Board
  • Row-to-Row Spacing 1.8
  • Connector Style Receptacle
  • Shrouded Unshrouded
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Connector Type Backplane (Receptacle)
  • Product Type Motherboard Connector
  • Number of Positions 144
  • Number of Rows 9
  • Number of Columns 16
  • Board-to-Board Configuration Vertical
  • PCB Mount Orientation Vertical
  • Guide Location Unguided
  • Card Slot Centerline 20.3
  • Number of Differential Pairs per Column 2
  • Differential Impedance 100
  • Contact Current Rating (Max) 1
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • Mating Alignment Guide Hardware
  • Mating Alignment Type Keyed
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) 1.8
  • Housing Material LCP - GF (Liquid Crystal Polymer)
  • Operating Temperature Range -55 – 125
  • Circuit Application Power & Signal
2302791-2 High Speed Backplane Connectors  1
  • Connector System Board-to-Board
  • Row-to-Row Spacing 1.8
  • Connector Style Receptacle
  • Shrouded Unshrouded
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Connector Type Backplane (Receptacle)
  • Product Type Motherboard Connector
  • Number of Positions 135
  • Number of Rows 9
  • Number of Columns 16
  • Board-to-Board Configuration Vertical
  • PCB Mount Orientation Vertical
  • Guide Location Unguided
  • Card Slot Centerline 20.3
  • Number of Differential Pairs per Column 2
  • Differential Impedance 100
  • Contact Current Rating (Max) 1
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • Mating Alignment Guide Hardware
  • Mating Alignment Type Keyed
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) 1.8
  • Housing Material LCP - GF (Liquid Crystal Polymer)
  • Operating Temperature Range -55 – 125
  • Circuit Application Power & Signal
2302792-2 High Speed Backplane Connectors  1
  • Connector System Board-to-Board
  • Row-to-Row Spacing 1.8
  • Connector Style Receptacle
  • Shrouded Unshrouded
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Connector Type Backplane (Receptacle)
  • Product Type Motherboard Connector
  • Number of Positions 71
  • Number of Rows 9
  • Number of Columns 16
  • Board-to-Board Configuration Vertical
  • PCB Mount Orientation Vertical
  • Guide Location Unguided
  • Card Slot Centerline 20.3
  • Number of Differential Pairs per Column 2
  • Differential Impedance 100
  • Contact Current Rating (Max) 1
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • Mating Alignment Guide Hardware
  • Mating Alignment Type Keyed
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) 1.8
  • Housing Material LCP - GF (Liquid Crystal Polymer)
  • Operating Temperature Range -55 – 125
  • Circuit Application Power & Signal
2302793-2 High Speed Backplane Connectors  1
  • Connector System Board-to-Board
  • Row-to-Row Spacing 1.8
  • Connector Style Receptacle
  • Shrouded Unshrouded
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Connector Type Backplane (Receptacle)
  • Product Type Motherboard Connector
  • Number of Positions 80
  • Number of Rows 9
  • Number of Columns 16
  • Board-to-Board Configuration Vertical
  • PCB Mount Orientation Vertical
  • Guide Location Unguided
  • Card Slot Centerline 20.3
  • Number of Differential Pairs per Column 2
  • Differential Impedance 100
  • Contact Current Rating (Max) 1
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • Mating Alignment Guide Hardware
  • Mating Alignment Type Keyed
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) 1.8
  • Housing Material LCP - GF (Liquid Crystal Polymer)
  • Operating Temperature Range -55 – 125
  • Circuit Application Power & Signal
2302794-2 High Speed Backplane Connectors  1
  • Connector System Board-to-Board
  • Row-to-Row Spacing 1.35
  • Connector Style Plug
  • Shrouded Unshrouded
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Connector Type Daughtercard (Plug)
  • Product Type Daughtercard Connector
  • Number of Signal Positions 20
  • Number of Pairs 20
  • Number of Power Positions 4
  • Number of Positions 112
  • Number of Rows 7
  • Number of Columns 16
  • Board-to-Board Configuration Right Angle
  • PCB Mount Orientation Right Angle
  • Guide Location Unguided
  • Card Slot Centerline 20.3
  • Number of Ground Positions 31
  • Number of Differential Pairs per Column 2
  • Differential Impedance 100
  • Contact Current Rating (Max) 1
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • Mating Alignment Guide Hardware
  • Mating Alignment Type Keyed
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) 1.8
  • Housing Material LCP - GF (Liquid Crystal Polymer)
  • Operating Temperature Range -55 – 125
  • Circuit Application Power & Signal
2302795-2 High Speed Backplane Connectors  1
  • Connector System Board-to-Board
  • Row-to-Row Spacing 1.35
  • Connector Style Plug
  • Shrouded Unshrouded
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Signal Arrangement Differential
  • Connector Type Daughtercard (Plug)
  • Product Type Daughtercard Connector
  • Number of Signal Positions 8
  • Number of Pairs 32
  • Number of Power Positions 0
  • Number of Positions 112
  • Number of Rows 7
  • Number of Columns 16
  • Board-to-Board Configuration Right Angle
  • PCB Mount Orientation Right Angle
  • Guide Location Unguided
  • Card Slot Centerline 20.3
  • Number of Ground Positions 40
  • Number of Differential Pairs per Column 2
  • Differential Impedance 100
  • Contact Current Rating (Max) 1
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • Mating Alignment Guide Hardware
  • Mating Alignment Type Keyed
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) 1.8
  • Housing Material LCP - GF (Liquid Crystal Polymer)
  • Operating Temperature Range -55 – 125
  • Circuit Application Signal
2302796-2 High Speed Backplane Connectors  1
  • Connector System Board-to-Board
  • Row-to-Row Spacing 1.35
  • Connector Style Plug
  • Shrouded Unshrouded
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Signal Arrangement Differential
  • Connector Type Daughtercard (Plug)
  • Product Type Daughtercard Connector
  • Number of Signal Positions 4
  • Number of Pairs 16
  • Number of Power Positions 0
  • Number of Positions 56
  • Number of Rows 7
  • Number of Columns 8
  • Board-to-Board Configuration Right Angle
  • PCB Mount Orientation Right Angle
  • Guide Location Unguided
  • Card Slot Centerline 20.3
  • Number of Ground Positions 20
  • Number of Differential Pairs per Column 2
  • Differential Impedance 100
  • Contact Current Rating (Max) 1
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • Mating Alignment Guide Hardware
  • Mating Alignment Type Keyed
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) 1.8
  • Housing Material LCP - GF (Liquid Crystal Polymer)
  • Operating Temperature Range -55 – 125
  • Circuit Application Signal
2302797-2 High Speed Backplane Connectors  1
  • Connector System Board-to-Board
  • Row-to-Row Spacing 1.35
  • Connector Style Plug
  • Shrouded Unshrouded
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Signal Arrangement Differential Signaling & Single Ended
  • Connector Type Daughtercard (Plug)
  • Product Type Daughtercard Connector
  • Number of Signal Positions 44
  • Number of Pairs 16
  • Number of Power Positions 0
  • Number of Positions 112
  • Number of Rows 7
  • Number of Columns 16
  • Board-to-Board Configuration Right Angle
  • PCB Mount Orientation Right Angle
  • Guide Location Unguided
  • Card Slot Centerline 20.3
  • Number of Ground Positions 36
  • Number of Differential Pairs per Column 2
  • Differential Impedance 100
  • Contact Current Rating (Max) 1
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • Mating Alignment Guide Hardware
  • Mating Alignment Type Keyed
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) 1.8
  • Housing Material LCP - GF (Liquid Crystal Polymer)
  • Operating Temperature Range -55 – 125
  • Circuit Application Signal
2313237-2 High Speed Backplane Connectors  1
  • Connector System Board-to-Board
  • Row-to-Row Spacing 1.35
  • Connector Style Plug
  • Shrouded Unshrouded
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Signal Arrangement Differential Signaling & Single Ended
  • Connector Type Daughtercard (Plug)
  • Product Type Daughtercard Connector
  • Number of Signal Positions 20
  • Number of Pairs 20
  • Number of Power Positions 6
  • Number of Positions 112
  • Number of Rows 7
  • Number of Columns 16
  • Board-to-Board Configuration Right Angle
  • PCB Mount Orientation Right Angle
  • Guide Location Unguided
  • Card Slot Centerline 20.3
  • Number of Ground Positions 31
  • Number of Differential Pairs per Column 2
  • Differential Impedance 100
  • Contact Current Rating (Max) 1
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • Mating Alignment Guide Hardware
  • Mating Alignment Type Keyed
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) 1.8
  • Housing Material LCP - GF (Liquid Crystal Polymer)
  • Operating Temperature Range -55 – 125
  • Circuit Application Power & Signal
2313238-2 High Speed Backplane Connectors  1
  • Connector System Board-to-Board
  • Row-to-Row Spacing 1.8
  • Connector Style Receptacle
  • Shrouded Unshrouded
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Connector Type Backplane (Receptacle)
  • Product Type Motherboard Connector
  • Number of Positions 144
  • Number of Rows 9
  • Number of Columns 16
  • Board-to-Board Configuration Vertical
  • PCB Mount Orientation Vertical
  • Guide Location Unguided
  • Card Slot Centerline 20.3
  • Number of Differential Pairs per Column 2
  • Differential Impedance 100
  • Contact Current Rating (Max) 1
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • Mating Alignment Guide Hardware
  • Mating Alignment Type Keyed
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) 1.8
  • Housing Material LCP - GF (Liquid Crystal Polymer)
  • Operating Temperature Range -55 – 125
  • Circuit Application Power & Signal
2302793-1 High Speed Backplane Connectors  1
  • Connector System Board-to-Board
  • Row-to-Row Spacing 1.8
  • Connector Style Receptacle
  • Shrouded Unshrouded
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Connector Type Backplane (Receptacle)
  • Product Type Motherboard Connector
  • Number of Positions 80
  • Number of Rows 9
  • Number of Columns 16
  • Board-to-Board Configuration Vertical
  • PCB Mount Orientation Vertical
  • Guide Location Unguided
  • Card Slot Centerline 20.3
  • Number of Differential Pairs per Column 2
  • Differential Impedance 100
  • Contact Current Rating (Max) 1
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • Mating Alignment Guide Hardware
  • Mating Alignment Type Keyed
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) 1.8
  • Housing Material LCP - GF (Liquid Crystal Polymer)
  • Operating Temperature Range -55 – 125
  • Circuit Application Power & Signal
2302786-1 High Speed Backplane Connectors  1
  • Connector System Board-to-Board
  • Row-to-Row Spacing 1.35
  • Connector Style Plug
  • Shrouded Unshrouded
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Connector Type Daughtercard (Plug)
  • Product Type Daughtercard Connector
  • Number of Signal Positions 16
  • Number of Pairs 4
  • Number of Power Positions 6
  • Number of Positions 56
  • Number of Rows 7
  • Number of Columns 8
  • Board-to-Board Configuration Right Angle
  • PCB Mount Orientation Right Angle
  • Guide Location Unguided
  • Card Slot Centerline 20.3
  • Number of Ground Positions 11
  • Number of Differential Pairs per Column 2
  • Differential Impedance 100
  • Contact Current Rating (Max) 1
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • Mating Alignment Guide Hardware
  • Mating Alignment Type Keyed
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) 1.8
  • Housing Material LCP - GF (Liquid Crystal Polymer)
  • Operating Temperature Range -55 – 125
  • Circuit Application Power & Signal
2302795-1 High Speed Backplane Connectors  1
  • Connector System Board-to-Board
  • Row-to-Row Spacing 1.35
  • Connector Style Plug
  • Shrouded Unshrouded
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Signal Arrangement Differential
  • Connector Type Daughtercard (Plug)
  • Product Type Daughtercard Connector
  • Number of Signal Positions 8
  • Number of Pairs 32
  • Number of Power Positions 0
  • Number of Positions 112
  • Number of Rows 7
  • Number of Columns 16
  • Board-to-Board Configuration Right Angle
  • PCB Mount Orientation Right Angle
  • Guide Location Unguided
  • Card Slot Centerline 20.3
  • Number of Ground Positions 40
  • Number of Differential Pairs per Column 2
  • Differential Impedance 100
  • Contact Current Rating (Max) 1
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • Mating Alignment Guide Hardware
  • Mating Alignment Type Keyed
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) 1.8
  • Housing Material LCP - GF (Liquid Crystal Polymer)
  • Operating Temperature Range -55 – 125
  • Circuit Application Signal
2302788-1 High Speed Backplane Connectors  1
  • Connector System Board-to-Board
  • Row-to-Row Spacing 1.8
  • Connector Style Receptacle
  • Shrouded Unshrouded
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Connector Type Backplane (Receptacle)
  • Product Type Motherboard Connector
  • Number of Positions 72
  • Number of Rows 9
  • Number of Columns 8
  • Board-to-Board Configuration Vertical
  • PCB Mount Orientation Vertical
  • Guide Location Unguided
  • Card Slot Centerline 20.3
  • Number of Differential Pairs per Column 2
  • Differential Impedance 100
  • Contact Current Rating (Max) 1
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • Mating Alignment Guide Hardware
  • Mating Alignment Type Keyed
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) 1.8
  • Housing Material LCP - GF (Liquid Crystal Polymer)
  • Operating Temperature Range -55 – 125
  • Circuit Application Power & Signal
2302789-1 High Speed Backplane Connectors  1
  • Connector System Board-to-Board
  • Row-to-Row Spacing 1.8
  • Connector Style Receptacle
  • Shrouded Unshrouded
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Connector Type Backplane (Receptacle)
  • Product Type Motherboard Connector
  • Number of Positions 144
  • Number of Rows 9
  • Number of Columns 16
  • Board-to-Board Configuration Vertical
  • PCB Mount Orientation Vertical
  • Guide Location Unguided
  • Card Slot Centerline 20.3
  • Number of Differential Pairs per Column 2
  • Differential Impedance 100
  • Contact Current Rating (Max) 1
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • Mating Alignment Guide Hardware
  • Mating Alignment Type Keyed
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) 1.8
  • Housing Material LCP - GF (Liquid Crystal Polymer)
  • Operating Temperature Range -55 – 125
  • Circuit Application Power & Signal
2313238-1 High Speed Backplane Connectors  1
  • Connector System Board-to-Board
  • Row-to-Row Spacing 1.8
  • Connector Style Receptacle
  • Shrouded Unshrouded
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Connector Type Backplane (Receptacle)
  • Product Type Motherboard Connector
  • Number of Positions 144
  • Number of Rows 9
  • Number of Columns 16
  • Board-to-Board Configuration Vertical
  • PCB Mount Orientation Vertical
  • Guide Location Unguided
  • Card Slot Centerline 20.3
  • Number of Differential Pairs per Column 2
  • Differential Impedance 100
  • Contact Current Rating (Max) 1
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • Mating Alignment Guide Hardware
  • Mating Alignment Type Keyed
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) 1.8
  • Housing Material LCP - GF (Liquid Crystal Polymer)
  • Operating Temperature Range -55 – 125
  • Circuit Application Power & Signal