1-2267440-0 Board-to-Board Headers & Receptacles  1
  • Connector & Housing Type Receptacle
  • PCB Connector Assembly Type PCB Mount Receptacle
  • Connector System Board-to-Board
  • Connector & Contact Terminates To Printed Circuit Board
  • Applied Pressure Low
  • Number of Signal Positions 20
  • Connector Contact Load Condition Fully Loaded
  • Stackable No
  • Number of Loaded Positions 20
  • Number of Rows 2
  • PCB Mount Orientation Vertical
  • Number of Positions 20
  • Board-to-Board Configuration Parallel
  • Operating Voltage 30
  • Operating Voltage 30
  • Dielectric Withstanding Voltage (Max) 1000
  • Termination Resistance 16
  • Post Size .24 x .55
  • Assembly Process Feature Material Stainless Steel
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin
  • Contact Underplating Material Nickel
  • Contact Mating Area Plating Material Finish Bright
  • Contact Shape & Form Rectangular
  • PCB Contact Termination Area Plating Material Finish Matte
  • Contact Underplating Material Thickness 1.27
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Material Thickness .00076
  • Contact Type Socket
  • Contact Current Rating (Max) 1
  • PCB Contact Termination Area Plating Material Thickness 3.81
  • Contact Protection Type Closed Entry Housing
  • Contact Mating Area Length 2
  • Contact Layout In-line
  • Termination Method to Printed Circuit Board Surface Mount
  • Mating Retention Without
  • Connector Mounting Type Board Mount
  • Mating Entry Location Bottom & Top
  • Centerline (Pitch) 1
  • Housing Color Black
  • Housing Material LCP
  • Connector Height 3.12
  • Row-to-Row Spacing 1
  • PCB Thickness (Recommended) .8 – 1.6
  • Connector Length 10.6
  • Operating Temperature Range -55 – 125
  • Housing Temperature Rating High
  • Assembly Process Feature Pick and Place Cover
  • Circuit Application Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tube
1-2267440-1 Board-to-Board Headers & Receptacles  1
  • Connector & Housing Type Receptacle
  • PCB Connector Assembly Type PCB Mount Receptacle
  • Connector System Board-to-Board
  • Connector & Contact Terminates To Printed Circuit Board
  • Applied Pressure Low
  • Number of Signal Positions 22
  • Connector Contact Load Condition Fully Loaded
  • Stackable No
  • Number of Loaded Positions 22
  • Number of Rows 2
  • PCB Mount Orientation Vertical
  • Number of Positions 22
  • Board-to-Board Configuration Parallel
  • Operating Voltage 30
  • Operating Voltage 30
  • Dielectric Withstanding Voltage (Max) 1000
  • Termination Resistance 16
  • Post Size .24 x .55
  • Assembly Process Feature Material Stainless Steel
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin
  • Contact Underplating Material Nickel
  • Contact Mating Area Plating Material Finish Bright
  • Contact Shape & Form Rectangular
  • PCB Contact Termination Area Plating Material Finish Matte
  • Contact Underplating Material Thickness 1.27
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Material Thickness .00076
  • Contact Type Socket
  • Contact Current Rating (Max) 1
  • PCB Contact Termination Area Plating Material Thickness 3.81
  • Contact Protection Type Closed Entry Housing
  • Contact Mating Area Length 2
  • Contact Layout In-line
  • Termination Method to Printed Circuit Board Surface Mount
  • Mating Retention Without
  • Connector Mounting Type Board Mount
  • Mating Entry Location Bottom & Top
  • Centerline (Pitch) 1
  • Housing Color Black
  • Housing Material LCP
  • Connector Height 3.12
  • Row-to-Row Spacing 1
  • PCB Thickness (Recommended) .8 – 1.6
  • Connector Length 11.6
  • Operating Temperature Range -55 – 125
  • Housing Temperature Rating High
  • Assembly Process Feature Pick and Place Cover
  • Circuit Application Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tube
1-2267440-2 Board-to-Board Headers & Receptacles  1
  • Connector & Housing Type Receptacle
  • PCB Connector Assembly Type PCB Mount Receptacle
  • Connector System Board-to-Board
  • Connector & Contact Terminates To Printed Circuit Board
  • Applied Pressure Low
  • Number of Signal Positions 24
  • Connector Contact Load Condition Fully Loaded
  • Stackable No
  • Number of Loaded Positions 24
  • Number of Rows 2
  • PCB Mount Orientation Vertical
  • Number of Positions 24
  • Board-to-Board Configuration Parallel
  • Operating Voltage 30
  • Operating Voltage 30
  • Dielectric Withstanding Voltage (Max) 1000
  • Termination Resistance 16
  • Post Size .24 x .55
  • Assembly Process Feature Material Stainless Steel
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin
  • Contact Underplating Material Nickel
  • Contact Mating Area Plating Material Finish Bright
  • Contact Shape & Form Rectangular
  • PCB Contact Termination Area Plating Material Finish Matte
  • Contact Underplating Material Thickness 1.27
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Material Thickness .00076
  • Contact Type Socket
  • Contact Current Rating (Max) 1
  • PCB Contact Termination Area Plating Material Thickness 3.81
  • Contact Protection Type Closed Entry Housing
  • Contact Mating Area Length 2
  • Contact Layout In-line
  • Termination Method to Printed Circuit Board Surface Mount
  • Mating Retention Without
  • Connector Mounting Type Board Mount
  • Mating Entry Location Bottom & Top
  • Centerline (Pitch) 1
  • Housing Color Black
  • Housing Material LCP
  • Connector Height 3.12
  • Row-to-Row Spacing 1
  • PCB Thickness (Recommended) .8 – 1.6
  • Connector Length 12.6
  • Operating Temperature Range -55 – 125
  • Housing Temperature Rating High
  • Assembly Process Feature Pick and Place Cover
  • Circuit Application Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tube
1-2267440-3 Board-to-Board Headers & Receptacles  1
  • Connector & Housing Type Receptacle
  • PCB Connector Assembly Type PCB Mount Receptacle
  • Connector System Board-to-Board
  • Connector & Contact Terminates To Printed Circuit Board
  • Applied Pressure Low
  • Number of Signal Positions 26
  • Connector Contact Load Condition Fully Loaded
  • Stackable No
  • Number of Loaded Positions 26
  • Number of Rows 2
  • PCB Mount Orientation Vertical
  • Number of Positions 26
  • Board-to-Board Configuration Parallel
  • Operating Voltage 30
  • Operating Voltage 30
  • Dielectric Withstanding Voltage (Max) 1000
  • Termination Resistance 16
  • Post Size .24 x .55
  • Assembly Process Feature Material Stainless Steel
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin
  • Contact Underplating Material Nickel
  • Contact Mating Area Plating Material Finish Bright
  • Contact Shape & Form Rectangular
  • PCB Contact Termination Area Plating Material Finish Matte
  • Contact Underplating Material Thickness 1.27
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Material Thickness .00076
  • Contact Type Socket
  • Contact Current Rating (Max) 1
  • PCB Contact Termination Area Plating Material Thickness 3.81
  • Contact Protection Type Closed Entry Housing
  • Contact Mating Area Length 2
  • Contact Layout In-line
  • Termination Method to Printed Circuit Board Surface Mount
  • Mating Retention Without
  • Connector Mounting Type Board Mount
  • Mating Entry Location Bottom & Top
  • Centerline (Pitch) 1
  • Housing Color Black
  • Housing Material LCP
  • Connector Height 3.12
  • Row-to-Row Spacing 1
  • PCB Thickness (Recommended) .8 – 1.6
  • Connector Length 13.6
  • Operating Temperature Range -55 – 125
  • Housing Temperature Rating High
  • Assembly Process Feature Pick and Place Cover
  • Circuit Application Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tube
1-2267440-4 Board-to-Board Headers & Receptacles  1
  • Connector & Housing Type Receptacle
  • PCB Connector Assembly Type PCB Mount Receptacle
  • Connector System Board-to-Board
  • Connector & Contact Terminates To Printed Circuit Board
  • Applied Pressure Low
  • Number of Signal Positions 28
  • Connector Contact Load Condition Fully Loaded
  • Stackable No
  • Number of Loaded Positions 28
  • Number of Rows 2
  • PCB Mount Orientation Vertical
  • Number of Positions 28
  • Board-to-Board Configuration Parallel
  • Operating Voltage 30
  • Operating Voltage 30
  • Dielectric Withstanding Voltage (Max) 1000
  • Termination Resistance 16
  • Post Size .24 x .55
  • Assembly Process Feature Material Stainless Steel
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin
  • Contact Underplating Material Nickel
  • Contact Mating Area Plating Material Finish Bright
  • Contact Shape & Form Rectangular
  • PCB Contact Termination Area Plating Material Finish Matte
  • Contact Underplating Material Thickness 1.27
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Material Thickness .00076
  • Contact Type Socket
  • Contact Current Rating (Max) 1
  • PCB Contact Termination Area Plating Material Thickness 3.81
  • Contact Protection Type Closed Entry Housing
  • Contact Mating Area Length 2
  • Contact Layout In-line
  • Termination Method to Printed Circuit Board Surface Mount
  • Mating Retention Without
  • Connector Mounting Type Board Mount
  • Mating Entry Location Bottom & Top
  • Centerline (Pitch) 1
  • Housing Color Black
  • Housing Material LCP
  • Connector Height 3.12
  • Row-to-Row Spacing 1
  • PCB Thickness (Recommended) .8 – 1.6
  • Connector Length 14.6
  • Operating Temperature Range -55 – 125
  • Housing Temperature Rating High
  • Assembly Process Feature Pick and Place Cover
  • Circuit Application Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tube
1-2267440-5 Board-to-Board Headers & Receptacles  1
  • Connector & Housing Type Receptacle
  • PCB Connector Assembly Type PCB Mount Receptacle
  • Connector System Board-to-Board
  • Connector & Contact Terminates To Printed Circuit Board
  • Applied Pressure Low
  • Number of Signal Positions 30
  • Connector Contact Load Condition Fully Loaded
  • Stackable No
  • Number of Loaded Positions 30
  • Number of Rows 2
  • PCB Mount Orientation Vertical
  • Number of Positions 30
  • Board-to-Board Configuration Parallel
  • Operating Voltage 30
  • Operating Voltage 30
  • Dielectric Withstanding Voltage (Max) 1000
  • Termination Resistance 16
  • Post Size .24 x .55
  • Assembly Process Feature Material Stainless Steel
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin
  • Contact Underplating Material Nickel
  • Contact Mating Area Plating Material Finish Bright
  • Contact Shape & Form Rectangular
  • PCB Contact Termination Area Plating Material Finish Matte
  • Contact Underplating Material Thickness 1.27
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Material Thickness .00076
  • Contact Type Socket
  • Contact Current Rating (Max) 1
  • PCB Contact Termination Area Plating Material Thickness 3.81
  • Contact Protection Type Closed Entry Housing
  • Contact Mating Area Length 2
  • Contact Layout In-line
  • Termination Method to Printed Circuit Board Surface Mount
  • Mating Retention Without
  • Connector Mounting Type Board Mount
  • Mating Entry Location Bottom & Top
  • Centerline (Pitch) 1
  • Housing Color Black
  • Housing Material LCP
  • Connector Height 3.12
  • Row-to-Row Spacing 1
  • PCB Thickness (Recommended) .8 – 1.6
  • Connector Length 15.6
  • Operating Temperature Range -55 – 125
  • Housing Temperature Rating High
  • Assembly Process Feature Pick and Place Cover
  • Circuit Application Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tube
1-2267440-6 Board-to-Board Headers & Receptacles  1
  • Connector & Housing Type Receptacle
  • PCB Connector Assembly Type PCB Mount Receptacle
  • Connector System Board-to-Board
  • Connector & Contact Terminates To Printed Circuit Board
  • Applied Pressure Low
  • Number of Signal Positions 32
  • Connector Contact Load Condition Fully Loaded
  • Stackable No
  • Number of Loaded Positions 32
  • Number of Rows 2
  • PCB Mount Orientation Vertical
  • Number of Positions 32
  • Board-to-Board Configuration Parallel
  • Operating Voltage 30
  • Operating Voltage 30
  • Dielectric Withstanding Voltage (Max) 1000
  • Termination Resistance 16
  • Post Size .24 x .55
  • Assembly Process Feature Material Stainless Steel
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin
  • Contact Underplating Material Nickel
  • Contact Mating Area Plating Material Finish Bright
  • Contact Shape & Form Rectangular
  • PCB Contact Termination Area Plating Material Finish Matte
  • Contact Underplating Material Thickness 1.27
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Material Thickness .00076
  • Contact Type Socket
  • Contact Current Rating (Max) 1
  • PCB Contact Termination Area Plating Material Thickness 3.81
  • Contact Protection Type Closed Entry Housing
  • Contact Mating Area Length 2
  • Contact Layout In-line
  • Termination Method to Printed Circuit Board Surface Mount
  • Mating Retention Without
  • Connector Mounting Type Board Mount
  • Mating Entry Location Bottom & Top
  • Centerline (Pitch) 1
  • Housing Color Black
  • Housing Material LCP
  • Connector Height 3.12
  • Row-to-Row Spacing 1
  • PCB Thickness (Recommended) .8 – 1.6
  • Connector Length 16.6
  • Operating Temperature Range -55 – 125
  • Housing Temperature Rating High
  • Assembly Process Feature Pick and Place Cover
  • Circuit Application Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tube
1-2267440-7 Board-to-Board Headers & Receptacles  1
  • Connector & Housing Type Receptacle
  • PCB Connector Assembly Type PCB Mount Receptacle
  • Connector System Board-to-Board
  • Connector & Contact Terminates To Printed Circuit Board
  • Applied Pressure Low
  • Number of Signal Positions 34
  • Connector Contact Load Condition Fully Loaded
  • Stackable No
  • Number of Loaded Positions 34
  • Number of Rows 2
  • PCB Mount Orientation Vertical
  • Number of Positions 34
  • Board-to-Board Configuration Parallel
  • Operating Voltage 30
  • Operating Voltage 30
  • Dielectric Withstanding Voltage (Max) 1000
  • Termination Resistance 16
  • Post Size .24 x .55
  • Assembly Process Feature Material Stainless Steel
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin
  • Contact Underplating Material Nickel
  • Contact Mating Area Plating Material Finish Bright
  • Contact Shape & Form Rectangular
  • PCB Contact Termination Area Plating Material Finish Matte
  • Contact Underplating Material Thickness 1.27
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Material Thickness .00076
  • Contact Type Socket
  • Contact Current Rating (Max) 1
  • PCB Contact Termination Area Plating Material Thickness 3.81
  • Contact Protection Type Closed Entry Housing
  • Contact Mating Area Length 2
  • Contact Layout In-line
  • Termination Method to Printed Circuit Board Surface Mount
  • Mating Retention Without
  • Connector Mounting Type Board Mount
  • Mating Entry Location Bottom & Top
  • Centerline (Pitch) 1
  • Housing Color Black
  • Housing Material LCP
  • Connector Height 3.12
  • Row-to-Row Spacing 1
  • PCB Thickness (Recommended) .8 – 1.6
  • Connector Length 17.6
  • Operating Temperature Range -55 – 125
  • Housing Temperature Rating High
  • Assembly Process Feature Pick and Place Cover
  • Circuit Application Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tube
1-2267440-8 Board-to-Board Headers & Receptacles  1
  • Connector & Housing Type Receptacle
  • PCB Connector Assembly Type PCB Mount Receptacle
  • Connector System Board-to-Board
  • Connector & Contact Terminates To Printed Circuit Board
  • Applied Pressure Low
  • Number of Signal Positions 36
  • Connector Contact Load Condition Fully Loaded
  • Stackable No
  • Number of Loaded Positions 36
  • Number of Rows 2
  • PCB Mount Orientation Vertical
  • Number of Positions 36
  • Board-to-Board Configuration Parallel
  • Operating Voltage 30
  • Operating Voltage 30
  • Dielectric Withstanding Voltage (Max) 1000
  • Termination Resistance 16
  • Post Size .24 x .55
  • Assembly Process Feature Material Stainless Steel
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin
  • Contact Underplating Material Nickel
  • Contact Mating Area Plating Material Finish Bright
  • Contact Shape & Form Rectangular
  • PCB Contact Termination Area Plating Material Finish Matte
  • Contact Underplating Material Thickness 1.27
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Material Thickness .00076
  • Contact Type Socket
  • Contact Current Rating (Max) 1
  • PCB Contact Termination Area Plating Material Thickness 3.81
  • Contact Protection Type Closed Entry Housing
  • Contact Mating Area Length 2
  • Contact Layout In-line
  • Termination Method to Printed Circuit Board Surface Mount
  • Mating Retention Without
  • Connector Mounting Type Board Mount
  • Mating Entry Location Bottom & Top
  • Centerline (Pitch) 1
  • Housing Color Black
  • Housing Material LCP
  • Connector Height 3.12
  • Row-to-Row Spacing 1
  • PCB Thickness (Recommended) .8 – 1.6
  • Connector Length 18.6
  • Operating Temperature Range -55 – 125
  • Housing Temperature Rating High
  • Assembly Process Feature Pick and Place Cover
  • Circuit Application Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tube
1-2267440-9 Board-to-Board Headers & Receptacles  1
  • Connector & Housing Type Receptacle
  • PCB Connector Assembly Type PCB Mount Receptacle
  • Connector System Board-to-Board
  • Connector & Contact Terminates To Printed Circuit Board
  • Applied Pressure Low
  • Number of Signal Positions 38
  • Connector Contact Load Condition Fully Loaded
  • Stackable No
  • Number of Loaded Positions 38
  • Number of Rows 2
  • PCB Mount Orientation Vertical
  • Number of Positions 38
  • Board-to-Board Configuration Parallel
  • Operating Voltage 30
  • Operating Voltage 30
  • Dielectric Withstanding Voltage (Max) 1000
  • Termination Resistance 16
  • Post Size .24 x .55
  • Assembly Process Feature Material Stainless Steel
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin
  • Contact Underplating Material Nickel
  • Contact Mating Area Plating Material Finish Bright
  • Contact Shape & Form Rectangular
  • PCB Contact Termination Area Plating Material Finish Matte
  • Contact Underplating Material Thickness 1.27
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Material Thickness .00076
  • Contact Type Socket
  • Contact Current Rating (Max) 1
  • PCB Contact Termination Area Plating Material Thickness 3.81
  • Contact Protection Type Closed Entry Housing
  • Contact Mating Area Length 2
  • Contact Layout In-line
  • Termination Method to Printed Circuit Board Surface Mount
  • Mating Retention Without
  • Connector Mounting Type Board Mount
  • Mating Entry Location Bottom & Top
  • Centerline (Pitch) 1
  • Housing Color Black
  • Housing Material LCP
  • Connector Height 3.12
  • Row-to-Row Spacing 1
  • PCB Thickness (Recommended) .8 – 1.6
  • Connector Length 19.6
  • Operating Temperature Range -55 – 125
  • Housing Temperature Rating High
  • Assembly Process Feature Pick and Place Cover
  • Circuit Application Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tube
1-2331928-0 Board-to-Board Headers & Receptacles  1
  • PCB Connector Assembly Type PCB Mount Header
  • Connector System Board-to-Board
  • Header Type Breakaway
  • Connector & Contact Terminates To Printed Circuit Board
  • Number of Signal Positions 20
  • Number of Loaded Positions 20
  • Number of Columns 10
  • Number of Rows 2
  • PCB Mount Orientation Vertical
  • Number of Positions 20
  • Board-to-Board Configuration Vertical
  • Pairs per Column 1
  • Connector Profile Standard
  • Assembly Process Feature Material Thermoplastic
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin
  • Contact Underplating Material Nickel
  • Contact Shape & Form Square
  • PCB Contact Termination Area Plating Material Finish Matte
  • Contact Underplating Material Thickness 1.27
  • Contact Mating Area Plating Material Gold Flash
  • Contact Mating Area Plating Material Thickness .1
  • Contact Type Pin
  • Contact Current Rating (Max) 1
  • PCB Contact Termination Area Plating Material Thickness 3 – 5
  • Contact Mating Area Length 1.9
  • Contact Layout In-line
  • Termination Method to Printed Circuit Board Surface Mount
  • Mating Alignment Without
  • PCB Mount Retention Without
  • Connector Mounting Type Board Mount
  • Mating Entry Location Top
  • Centerline (Pitch) 1
  • Housing Color Black
  • Housing Material LCP
  • Connector Height 1.5
  • Row-to-Row Spacing 1
  • Stack Height 4.3
  • Operating Temperature Range -55 – 125
  • Housing Temperature Rating High
  • Assembly Process Feature Pick and Place Cover
  • Circuit Application Signal
  • Solder Process Feature Board Standoff
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tube
1-2331928-1 Board-to-Board Headers & Receptacles  1
  • PCB Connector Assembly Type PCB Mount Header
  • Connector System Board-to-Board
  • Header Type Breakaway
  • Connector & Contact Terminates To Printed Circuit Board
  • Number of Loaded Positions 22
  • Number of Columns 11
  • Number of Rows 2
  • PCB Mount Orientation Vertical
  • Number of Positions 22
  • Board-to-Board Configuration Vertical
  • Pairs per Column 1
  • Connector Profile Standard
  • Assembly Process Feature Material Thermoplastic
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin
  • Contact Underplating Material Nickel
  • Contact Shape & Form Square
  • PCB Contact Termination Area Plating Material Finish Matte
  • Contact Underplating Material Thickness 1.27
  • Contact Mating Area Plating Material Gold Flash
  • Contact Mating Area Plating Material Thickness .1
  • Contact Type Pin
  • Contact Current Rating (Max) 1
  • PCB Contact Termination Area Plating Material Thickness 3 – 5
  • Contact Mating Area Length 1.9
  • Contact Layout In-line
  • Termination Method to Printed Circuit Board Surface Mount
  • Mating Alignment Without
  • PCB Mount Retention Without
  • Connector Mounting Type Board Mount
  • Mating Entry Location Top
  • Centerline (Pitch) 1
  • Housing Color Black
  • Housing Material LCP
  • Connector Height 1.5
  • Row-to-Row Spacing 1
  • Stack Height 4.3
  • Operating Temperature Range -55 – 125
  • Housing Temperature Rating High
  • Assembly Process Feature Pick and Place Cover
  • Circuit Application Signal
  • Solder Process Feature Board Standoff
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tube
1-2331928-2 Board-to-Board Headers & Receptacles  1
  • PCB Connector Assembly Type PCB Mount Header
  • Connector System Board-to-Board
  • Header Type Breakaway
  • Connector & Contact Terminates To Printed Circuit Board
  • Number of Signal Positions 24
  • Number of Loaded Positions 24
  • Number of Columns 12
  • Number of Rows 2
  • PCB Mount Orientation Vertical
  • Number of Positions 24
  • Board-to-Board Configuration Vertical
  • Pairs per Column 1
  • Connector Profile Standard
  • Assembly Process Feature Material Thermoplastic
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin
  • Contact Underplating Material Nickel
  • Contact Shape & Form Square
  • PCB Contact Termination Area Plating Material Finish Matte
  • Contact Underplating Material Thickness 1.27
  • Contact Mating Area Plating Material Gold Flash
  • Contact Mating Area Plating Material Thickness .1
  • Contact Type Pin
  • Contact Current Rating (Max) 1
  • PCB Contact Termination Area Plating Material Thickness 3 – 5
  • Contact Mating Area Length 1.9
  • Contact Layout In-line
  • Termination Method to Printed Circuit Board Surface Mount
  • Mating Alignment Without
  • PCB Mount Retention Without
  • Connector Mounting Type Board Mount
  • Mating Entry Location Top
  • Centerline (Pitch) 1
  • Housing Color Black
  • Housing Material LCP
  • Connector Height 1.5
  • Row-to-Row Spacing 1
  • Stack Height 4.3
  • Operating Temperature Range -55 – 125
  • Housing Temperature Rating High
  • Assembly Process Feature Pick and Place Cover
  • Circuit Application Signal
  • Solder Process Feature Board Standoff
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tube
1-2331928-3 Board-to-Board Headers & Receptacles  1
  • PCB Connector Assembly Type PCB Mount Header
  • Connector System Board-to-Board
  • Header Type Breakaway
  • Connector & Contact Terminates To Printed Circuit Board
  • Number of Loaded Positions 26
  • Number of Columns 13
  • Number of Rows 2
  • PCB Mount Orientation Vertical
  • Number of Positions 26
  • Board-to-Board Configuration Vertical
  • Pairs per Column 1
  • Connector Profile Standard
  • Assembly Process Feature Material Thermoplastic
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin
  • Contact Underplating Material Nickel
  • Contact Shape & Form Square
  • PCB Contact Termination Area Plating Material Finish Matte
  • Contact Underplating Material Thickness 1.27
  • Contact Mating Area Plating Material Gold Flash
  • Contact Mating Area Plating Material Thickness .1
  • Contact Type Pin
  • Contact Current Rating (Max) 1
  • PCB Contact Termination Area Plating Material Thickness 3 – 5
  • Contact Mating Area Length 1.9
  • Contact Layout In-line
  • Termination Method to Printed Circuit Board Surface Mount
  • Mating Alignment Without
  • PCB Mount Retention Without
  • Connector Mounting Type Board Mount
  • Mating Entry Location Top
  • Centerline (Pitch) 1
  • Housing Color Black
  • Housing Material LCP
  • Connector Height 1.5
  • Row-to-Row Spacing 1
  • Stack Height 4.3
  • Operating Temperature Range -55 – 125
  • Housing Temperature Rating High
  • Assembly Process Feature Pick and Place Cover
  • Circuit Application Signal
  • Solder Process Feature Board Standoff
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tube
1-2331928-4 Board-to-Board Headers & Receptacles  1
  • PCB Connector Assembly Type PCB Mount Header
  • Connector System Board-to-Board
  • Header Type Breakaway
  • Connector & Contact Terminates To Printed Circuit Board
  • Number of Signal Positions 28
  • Number of Loaded Positions 28
  • Number of Columns 14
  • Number of Rows 2
  • PCB Mount Orientation Vertical
  • Number of Positions 28
  • Board-to-Board Configuration Vertical
  • Pairs per Column 1
  • Connector Profile Standard
  • Assembly Process Feature Material Thermoplastic
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin
  • Contact Underplating Material Nickel
  • Contact Shape & Form Square
  • PCB Contact Termination Area Plating Material Finish Matte
  • Contact Underplating Material Thickness 1.27
  • Contact Mating Area Plating Material Gold Flash
  • Contact Mating Area Plating Material Thickness .1
  • Contact Type Pin
  • Contact Current Rating (Max) 1
  • PCB Contact Termination Area Plating Material Thickness 3 – 5
  • Contact Mating Area Length 1.9
  • Contact Layout In-line
  • Termination Method to Printed Circuit Board Surface Mount
  • Mating Alignment Without
  • PCB Mount Retention Without
  • Connector Mounting Type Board Mount
  • Mating Entry Location Top
  • Centerline (Pitch) 1
  • Housing Color Black
  • Housing Material LCP
  • Connector Height 1.5
  • Row-to-Row Spacing 1
  • Stack Height 4.3
  • Operating Temperature Range -55 – 125
  • Housing Temperature Rating High
  • Assembly Process Feature Pick and Place Cover
  • Circuit Application Signal
  • Solder Process Feature Board Standoff
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tube
1-2331928-5 Board-to-Board Headers & Receptacles  1
  • PCB Connector Assembly Type PCB Mount Header
  • Connector System Board-to-Board
  • Header Type Breakaway
  • Connector & Contact Terminates To Printed Circuit Board
  • Number of Signal Positions 30
  • Number of Loaded Positions 30
  • Number of Columns 15
  • Number of Rows 2
  • PCB Mount Orientation Vertical
  • Number of Positions 30
  • Board-to-Board Configuration Vertical
  • Pairs per Column 1
  • Connector Profile Standard
  • Assembly Process Feature Material Thermoplastic
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin
  • Contact Underplating Material Nickel
  • Contact Shape & Form Square
  • PCB Contact Termination Area Plating Material Finish Matte
  • Contact Underplating Material Thickness 1.27
  • Contact Mating Area Plating Material Gold Flash
  • Contact Mating Area Plating Material Thickness .1
  • Contact Type Pin
  • Contact Current Rating (Max) 1
  • PCB Contact Termination Area Plating Material Thickness 3 – 5
  • Contact Mating Area Length 1.9
  • Contact Layout In-line
  • Termination Method to Printed Circuit Board Surface Mount
  • Mating Alignment Without
  • PCB Mount Retention Without
  • Connector Mounting Type Board Mount
  • Mating Entry Location Top
  • Centerline (Pitch) 1
  • Housing Color Black
  • Housing Material LCP
  • Connector Height 1.5
  • Row-to-Row Spacing 1
  • Stack Height 4.3
  • Operating Temperature Range -55 – 125
  • Housing Temperature Rating High
  • Assembly Process Feature Pick and Place Cover
  • Circuit Application Signal
  • Solder Process Feature Board Standoff
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tube
1-2331928-6 Board-to-Board Headers & Receptacles  1
  • PCB Connector Assembly Type PCB Mount Header
  • Connector System Board-to-Board
  • Header Type Breakaway
  • Connector & Contact Terminates To Printed Circuit Board
  • Number of Signal Positions 32
  • Number of Loaded Positions 32
  • Number of Columns 16
  • Number of Rows 2
  • PCB Mount Orientation Vertical
  • Number of Positions 32
  • Board-to-Board Configuration Vertical
  • Pairs per Column 1
  • Connector Profile Standard
  • Assembly Process Feature Material Thermoplastic
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin
  • Contact Underplating Material Nickel
  • Contact Shape & Form Square
  • PCB Contact Termination Area Plating Material Finish Matte
  • Contact Underplating Material Thickness 1.27
  • Contact Mating Area Plating Material Gold Flash
  • Contact Mating Area Plating Material Thickness .1
  • Contact Type Pin
  • Contact Current Rating (Max) 1
  • PCB Contact Termination Area Plating Material Thickness 3 – 5
  • Contact Mating Area Length 1.9
  • Contact Layout In-line
  • Termination Method to Printed Circuit Board Surface Mount
  • Mating Alignment Without
  • PCB Mount Retention Without
  • Connector Mounting Type Board Mount
  • Mating Entry Location Top
  • Centerline (Pitch) 1
  • Housing Color Black
  • Housing Material LCP
  • Connector Height 1.5
  • Row-to-Row Spacing 1
  • Stack Height 4.3
  • Operating Temperature Range -55 – 125
  • Housing Temperature Rating High
  • Assembly Process Feature Pick and Place Cover
  • Circuit Application Signal
  • Solder Process Feature Board Standoff
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tube
1-2331928-7 Board-to-Board Headers & Receptacles  1
  • PCB Connector Assembly Type PCB Mount Header
  • Connector System Board-to-Board
  • Header Type Breakaway
  • Connector & Contact Terminates To Printed Circuit Board
  • Number of Loaded Positions 34
  • Number of Columns 17
  • Number of Rows 2
  • PCB Mount Orientation Vertical
  • Number of Positions 34
  • Board-to-Board Configuration Vertical
  • Pairs per Column 1
  • Connector Profile Standard
  • Assembly Process Feature Material Thermoplastic
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin
  • Contact Underplating Material Nickel
  • Contact Shape & Form Square
  • PCB Contact Termination Area Plating Material Finish Matte
  • Contact Underplating Material Thickness 1.27
  • Contact Mating Area Plating Material Gold Flash
  • Contact Mating Area Plating Material Thickness .1
  • Contact Type Pin
  • Contact Current Rating (Max) 1
  • PCB Contact Termination Area Plating Material Thickness 3 – 5
  • Contact Mating Area Length 1.9
  • Contact Layout In-line
  • Termination Method to Printed Circuit Board Surface Mount
  • Mating Alignment Without
  • PCB Mount Retention Without
  • Connector Mounting Type Board Mount
  • Mating Entry Location Top
  • Centerline (Pitch) 1
  • Housing Color Black
  • Housing Material LCP
  • Connector Height 1.5
  • Row-to-Row Spacing 1
  • Stack Height 4.3
  • Operating Temperature Range -55 – 125
  • Housing Temperature Rating High
  • Assembly Process Feature Pick and Place Cover
  • Circuit Application Signal
  • Solder Process Feature Board Standoff
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tube
1-2331928-8 Board-to-Board Headers & Receptacles  1
  • PCB Connector Assembly Type PCB Mount Header
  • Connector System Board-to-Board
  • Header Type Breakaway
  • Connector & Contact Terminates To Printed Circuit Board
  • Number of Signal Positions 36
  • Number of Loaded Positions 36
  • Number of Columns 18
  • Number of Rows 2
  • PCB Mount Orientation Vertical
  • Number of Positions 36
  • Board-to-Board Configuration Vertical
  • Pairs per Column 1
  • Connector Profile Standard
  • Assembly Process Feature Material Thermoplastic
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin
  • Contact Underplating Material Nickel
  • Contact Shape & Form Square
  • PCB Contact Termination Area Plating Material Finish Matte
  • Contact Underplating Material Thickness 1.27
  • Contact Mating Area Plating Material Gold Flash
  • Contact Mating Area Plating Material Thickness .1
  • Contact Type Pin
  • Contact Current Rating (Max) 1
  • PCB Contact Termination Area Plating Material Thickness 3 – 5
  • Contact Mating Area Length 1.9
  • Contact Layout In-line
  • Termination Method to Printed Circuit Board Surface Mount
  • Mating Alignment Without
  • PCB Mount Retention Without
  • Connector Mounting Type Board Mount
  • Mating Entry Location Top
  • Centerline (Pitch) 1
  • Housing Color Black
  • Housing Material LCP
  • Connector Height 1.5
  • Row-to-Row Spacing 1
  • Stack Height 4.3
  • Operating Temperature Range -55 – 125
  • Housing Temperature Rating High
  • Assembly Process Feature Pick and Place Cover
  • Circuit Application Signal
  • Solder Process Feature Board Standoff
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tube
1-2331928-9 Board-to-Board Headers & Receptacles  1
  • PCB Connector Assembly Type PCB Mount Header
  • Connector System Board-to-Board
  • Header Type Breakaway
  • Connector & Contact Terminates To Printed Circuit Board
  • Number of Signal Positions 38
  • Number of Loaded Positions 38
  • Number of Columns 19
  • Number of Rows 2
  • PCB Mount Orientation Vertical
  • Number of Positions 38
  • Board-to-Board Configuration Vertical
  • Pairs per Column 1
  • Connector Profile Standard
  • Assembly Process Feature Material Thermoplastic
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin
  • Contact Underplating Material Nickel
  • Contact Shape & Form Square
  • PCB Contact Termination Area Plating Material Finish Matte
  • Contact Underplating Material Thickness 1.27
  • Contact Mating Area Plating Material Gold Flash
  • Contact Mating Area Plating Material Thickness .1
  • Contact Type Pin
  • Contact Current Rating (Max) 1
  • PCB Contact Termination Area Plating Material Thickness 3 – 5
  • Contact Mating Area Length 1.9
  • Contact Layout In-line
  • Termination Method to Printed Circuit Board Surface Mount
  • Mating Alignment Without
  • PCB Mount Retention Without
  • Connector Mounting Type Board Mount
  • Mating Entry Location Top
  • Centerline (Pitch) 1
  • Housing Color Black
  • Housing Material LCP
  • Connector Height 1.5
  • Row-to-Row Spacing 1
  • Stack Height 4.3
  • Operating Temperature Range -55 – 125
  • Housing Temperature Rating High
  • Assembly Process Feature Pick and Place Cover
  • Circuit Application Signal
  • Solder Process Feature Board Standoff
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tube