OSFP Family

Next-Gen Thermal Performance

TE’s OSFP connectors and cable assemblies address next-generation data center needs by supporting aggregate data rates of 200G and up to 400 Gbps. These products are designed for both 28G NRZ and 56G PAM-4 protocols, with a roadmap to 112G PAM-4 for future system upgrades. By utilizing integrated thermal heatsink technology in the plug, OSFP products provide superior thermal performance and signal integrity needed to support 400G data rates. OSFP products offer high port density and can fit up to 36 ports of an 8 lane interface in a 1 RU switch form factor, aligning with current and next-generation silicon road maps.

Product Features

OSFP Connectors, Cages & Cable Assemblies
  • Support aggregate data rates of 200G and up to 400G
  • Designed for both 28G NRZ and 56G PAM-4
  • Superior thermal and SI performance
  • Designed for up to 15W thermal loads with low airflow
  • Optimized for front-to-back and back-to-front airflow
  • Fit up to 36 ports of an 8 lane interface in a 1RU switch form factor
  • Connector has proven .6mm pitch

 

General Information

Cage Assembly Connector
  • 1x1 and 1x4 cage to support both multi and single port applications
  • 8-lane high density connector, footprint and mating interface per OSFP MSA spec
  • Low cost, stainless steel cage with tuned airflow venting supports module cooling and optimal system airflow
  • Proven .6mm pitch, 60 contacts total
  • Traditional EMI containment at the bezel and port opening
  • Simple, low cost wafer design with 2 rows of contacts
  • Flat rock PCB Assembly
  • Belly-to-belly capable via in-ground alignment for low PCB cost and noise
  • Proven to 56G PAM-4, with roadmap to 112G PAM-4

1x1 Cage

1x4 Cage

SMT Connector

OSFP to OSFP

OSFP to 2 QSFP

OSFP to 4 QSFP

Cable Assembly Information

  • OSFP to OSFP straight cables
  • OSFP to 2 or 4 QSFP56
  • OSFP to 8 SFP56 breakout cables
  • Up to 26 AWG supported in the OSFP form factor