CAT-L59017-A76H IC Socket Hardware  1
PRODUCT
  1. Connectors
  2. IC Socket Hardware
  1. LGA 3647 Socket Hardware CAT-L59017-A76H
active
  • Card & Socket Accessory Type Backplate
  • Bolster Plate Assembly Material Stainless Steel
  • Insulator Material Polycarbonate Film Plus Acrylic Adhesive Layer
  • Compatible With IC Socket Type LGA 3647
  • Operating Temperature Range -25 – 100
  • Packaging Method Box & Tray
  • Comment Narrow Type without Cover.
CAT-L59017-A76 LGA Sockets  1
PRODUCT
  1. Connectors
  2. LGA Sockets
  1. LGA 3647 SOCKETS CAT-L59017-A76
active
  • Connector System Board-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Socket
  • Number of Positions 1823
  • Grid Spacing .9906 x .8585
  • Plating Thickness 30
  • Plating Material Gold
  • Frame Style Square
  • Contact Base Material Copper Alloy
  • IC Socket Type LGA 3647
  • Contact Mating Area Plating Material Gold
  • Contact Current Rating (Max) .5
  • PCB Mounting Style Surface Mount Solder Ball
  • Connector Mounting Type Board Mount
  • Heat Sink Attachment Without
  • Centerline (Pitch) .86
  • Housing Color Black
  • Housing Material High Temperature Thermoplastic
  • Operating Temperature Range -25 – 100
  • Circuit Application Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tray
  • Comment Lead-Free Solderball
CAT-D625-800072 DIP Sockets  1
PRODUCT
  1. Connectors
  2. DIP Sockets
  1. DIP Socket: Standard, Stamped & Formed, Open, Tin CAT-D625-800072
active
  • Leg Style Straight
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Socket
  • Number of Positions 8
  • PCB Mount Orientation Vertical
  • Number of Rows 2
  • Contact Resistance 10
  • Insulation Resistance 1000
  • Connector Profile Standard
  • Sleeve Material Brass/Copper
  • Color Black
  • Frame Style Ladder
  • Sleeve Plating Material Tin/Lead
  • Contact Base Material Beryllium Copper
  • PCB Contact Termination Area Plating Material Tin
  • Contact Fabrication Stamped & Formed
  • Contact Mating Area Plating Material Tin
  • Contact Current Rating (Max) 1
  • Socket Style Standard
  • Mating Contact Type Dual Leaf
  • Socket Type DIP
  • Contact Type Pin
  • Termination Method to Printed Circuit Board Through Hole - Solder
  • Termination Post Length 3
  • PCB Mount Retention Without
  • Connector Mounting Type Board Mount
  • Mating Alignment Type Polarization
  • Mating Alignment With
  • Centerline (Pitch) 2.54
  • Housing Material PBT GF30
  • Height Above PC Board 2.67
  • Row-to-Row Spacing 15.24
  • Operating Temperature Range -55 – 105
  • Circuit Application Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Method Box & Tube
CAT-D33037-SO1339 SO DIMM Sockets  1
PRODUCT
  1. Connectors
  2. SO DIMM Sockets
  1. DDR3 SO DIMM Sockets CAT-D33037-SO1339
active
  • DRAM Type Double Data Rate (DDR) 2
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Socket
  • Module Orientation Right Angle
  • Number of Positions 144
  • Number of Rows 2
  • Number of Bays 2
  • Number of Keys 1
  • Center Key Offset Left
  • DRAM Voltage 3.3
  • Ejector Type Locking
  • Connector Profile High
  • Module Key Type SDRAM
  • Latch Plating Material Tin
  • Latch Material Stainless Steel
  • Ejector Location None
  • Contact Base Material Copper Alloy
  • PCB Contact Termination Area Plating Material Gold
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Material Thickness .25
  • Socket Type Memory Card
  • Socket Style SO DIMM
  • Insertion Style Cam-In
  • PCB Mount Retention Type Hold-Down Post
  • PCB Mount Retention With
  • PCB Mounting Style Surface Mount
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) .8
  • Housing Color Natural
  • Housing Material High Temperature Plastic
  • Stack Height 5.2
  • Row-to-Row Spacing 5.4
  • Operating Temperature Range -55 – 105
  • Circuit Application Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Method Box
  • Packaging Quantity 20
CAT-D625-L52 DIP Sockets  1
PRODUCT
  1. Connectors
  2. DIP Sockets
  1. DIP Socket: Low Profile, Stamped & Formed, Open, Tin CAT-D625-L52
active
  • Leg Style Straight
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Socket
  • Number of Positions 8
  • PCB Mount Orientation Vertical
  • Number of Rows 2
  • Contact Resistance 20
  • Insulation Resistance 1000
  • Connector Profile Low
  • Sleeve Material Brass/Copper
  • Color Black
  • Frame Style Ladder
  • Sleeve Plating Material Tin/Lead
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin
  • Contact Fabrication Stamped & Formed
  • Contact Mating Area Plating Material Tin
  • Contact Current Rating (Max) 1
  • Socket Style Standard
  • Mating Contact Type Dual Leaf
  • Socket Type DIP
  • Contact Type Pin
  • Termination Method to Printed Circuit Board Through Hole - Solder
  • Connector Mounting Type Board Mount
  • Mating Alignment Type Polarization
  • Mating Alignment With
  • Centerline (Pitch) 2.54
  • Housing Material PBT GF30
  • Height Above PC Board 5.1
  • Row-to-Row Spacing 7.62
  • Operating Temperature Range -40 – 105
  • Circuit Application Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Method Box & Tube
  • Packaging Quantity 24
  • Tubes per Box 2
  • Quantity per Tube 2400
CAT-D3301-SO1339 SO DIMM Sockets  1
PRODUCT
  1. Connectors
  2. SO DIMM Sockets
  1. DDR2 SO DIMM Sockets CAT-D3301-SO1339
active
  • DRAM Type Double Data Rate (DDR)
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Socket
  • Module Orientation Right Angle
  • Number of Positions 200
  • Number of Rows 2
  • Keying Standard
  • Number of Bays 2
  • Number of Keys 1
  • Center Key None
  • DRAM Voltage 1.8
  • SGRAM Voltage 1.8
  • Ejector Type Locking
  • Connector Profile Low
  • Module Key Type SGRAM
  • Latch Plating Material Tin
  • Latch Material Stainless Steel
  • Ejector Location Both Ends
  • Contact Base Material Copper Alloy
  • PCB Contact Termination Area Plating Material Gold
  • Contact Underplating Material Nickel
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Material Thickness .76
  • Contact Current Rating (Max) .5
  • Socket Type Memory Card
  • Socket Style SO DIMM
  • Insertion Style Cam-In
  • PCB Mount Retention Type Solder Peg
  • PCB Mount Retention With
  • PCB Mounting Style Surface Mount
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) .6
  • Housing Color Black
  • Housing Material High Temperature Thermoplastic
  • Stack Height 4
  • Row-to-Row Spacing 5.6
  • Operating Temperature Range -55 – 85
  • Circuit Application Power
  • UL Flammability Rating UL 94V-0
  • Packaging Method Box
  • Packaging Quantity 20
CAT-377-MSSOB75 Pin Sockets  1
PRODUCT
  1. Connectors
  2. Pin Sockets
  1. Miniature Spring Sockets: Open Bottom, Beryllium Copper, 7.5A CAT-377-MSSOB75
active
  • Socket Sleeve Style Open Bottom
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Sleeve Material Copper
  • Sleeve Plating Material Gold
  • Contact Base Material Beryllium Copper
  • Contact Current Rating (Max) 7.5
  • Contact Spring Plating Thickness .762
  • Contact Transmits (Typical) Signal (Data)/Power
  • Contact Mating Area Plating Thickness 30
  • Contact Type Socket
  • Contact Spring Plating Material Gold
  • Socket Type Discrete
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • Termination Method to Wire & Cable Solder
  • Insertion Method Hand/Semi-Automatic
  • Socket Length 6.45
  • Hole Size (Recommended) 2.26
  • Wire Size 16 – 14
  • Wire Size .162 – .653
  • Mating Pin Diameter Range .46 – 1.02
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Solder Process Feature None
  • Circuit Application Power & Signal
  • Packaging Method Bag
  • Packaging Quantity 2000
  • Spring Material Beryllium Copper
CAT-377-MSSCB75 Pin Sockets  1
PRODUCT
  1. Connectors
  2. Pin Sockets
  1. Miniature Spring Sockets: Closed Bottom, Beryllium Copper, 7.5A CAT-377-MSSCB75
active
  • Socket Sleeve Style Closed Bottom
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Sleeve Material Copper
  • Sleeve Plating Material Tin
  • Contact Base Material Beryllium Copper
  • Contact Current Rating (Max) 7.5
  • Contact Spring Plating Thickness .762
  • Contact Transmits (Typical) Signal (Data)/Power
  • Contact Mating Area Plating Thickness 30
  • Contact Type Socket
  • Contact Spring Plating Material Gold
  • Socket Type Discrete
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • Termination Method to Wire & Cable Solder
  • Insertion Method Hand/Semi-Automatic
  • Socket Length 5.59
  • Hole Size (Recommended) 2.26
  • Wire Size 15
  • Wire Size .162 – .653
  • Mating Pin Diameter Range .46 – 1.02
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Solder Process Feature None
  • Circuit Application Power & Signal
  • Packaging Method Bag
  • Packaging Quantity 2000
  • Spring Material Beryllium Copper
CAT-377-MSSCB3 Pin Sockets  1
PRODUCT
  1. Connectors
  2. Pin Sockets
  1. Mini Spring Sockets: Closed Bottom, 3A CAT-377-MSSCB3
active
  • Socket Sleeve Style Closed
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Sleeve Material Copper
  • Sleeve Plating Material Tin
  • Contact Base Material Beryllium Copper
  • Contact Current Rating (Max) 3
  • Contact Spring Plating Thickness .762
  • Contact Transmits (Typical) Signal (Data)/Power
  • Contact Mating Area Plating Thickness 30
  • Contact Type Socket
  • Contact Mating Area Plating Material Gold
  • Contact Spring Plating Material Gold
  • Socket Type Discrete
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • Termination Method to Wire & Cable Solder
  • Insertion Method Hand/Semi-Automatic
  • Socket Length 3.61
  • Hole Size (Recommended) 1.02
  • Wire Size 28 – 25
  • Wire Size .081 – .162
  • Mating Pin Diameter Range .33 – .51
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Solder Process Feature None
  • Circuit Application Power & Signal
  • Packaging Method Bag
  • Packaging Quantity 2000
  • Spring Material Beryllium Copper
CAT-377-MSSCB4 Pin Sockets  1
PRODUCT
  1. Connectors
  2. Pin Sockets
  1. Miniature Spring Sockets: Closed Bottom, Beryllium Copper, 4A CAT-377-MSSCB4
active
  • Socket Sleeve Style Closed
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Sleeve Material Copper
  • Sleeve Plating Material Gold Flash over Nickel
  • Contact Base Material Beryllium Copper
  • Contact Current Rating (Max) 4
  • Contact Spring Plating Thickness .762
  • Contact Transmits (Typical) Signal (Data)/Power
  • Contact Mating Area Plating Thickness 30
  • Contact Type Socket
  • Contact Spring Plating Material Gold
  • Socket Type Discrete
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • Termination Method to Wire & Cable Solder
  • Insertion Method Hand/Semi-Automatic
  • Socket Length 3.51
  • Hole Size (Recommended) 1.32
  • Wire Size 20 – 16
  • Wire Size .081 – .326
  • Mating Pin Diameter Range .36 – .66
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Solder Process Feature Anti-Flux
  • Circuit Application Power & Signal
  • Packaging Method Bag
  • Packaging Quantity 2000
  • Spring Material Beryllium Copper
CAT-377-MSSKB65 Pin Sockets  1
PRODUCT
  1. Connectors
  2. Pin Sockets
  1. Miniature Spring Sockets: Open Bottom, Beryllium Copper, 4A CAT-377-MSSKB65
active
  • Socket Sleeve Style Open Bottom
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Sleeve Material Copper
  • Sleeve Plating Material Gold Flash over Nickel
  • Contact Base Material Beryllium Copper
  • Contact Current Rating (Max) 4
  • Contact Spring Plating Thickness .762
  • Contact Transmits (Typical) Signal (Data)/Power
  • Contact Mating Area Plating Thickness 30
  • Contact Type Socket
  • Contact Spring Plating Material Gold
  • Socket Type Discrete
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • Termination Method to Wire & Cable Solder
  • Insertion Method Hand/Semi-Automatic
  • Socket Length 3.51
  • Hole Size (Recommended) 1.32
  • Wire Size 25
  • Wire Size .081 – .326
  • Mating Pin Diameter Range .36 – .66
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Solder Process Feature None
  • Circuit Application Power & Signal
  • Packaging Method Bag
  • Packaging Quantity 2000
  • Spring Material Beryllium Copper
CAT-377-MSSOB5 Pin Sockets  1
PRODUCT
  1. Connectors
  2. Pin Sockets
  1. Miniature Spring Sockets: Open Bottom, Beryllium Copper, 5A CAT-377-MSSOB5
active
  • Socket Sleeve Style Open Bottom
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Sleeve Material Copper
  • Sleeve Plating Material Gold Flash over Nickel
  • Contact Base Material Beryllium Copper
  • Contact Current Rating (Max) 5
  • Contact Spring Plating Thickness .762
  • Contact Transmits (Typical) Signal (Data)/Power
  • Contact Mating Area Plating Thickness 30
  • Contact Type Socket
  • Contact Spring Plating Material Gold
  • Socket Type Discrete
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • Termination Method to Wire & Cable Solder
  • Insertion Method Hand/Semi-Automatic/Automatic
  • Socket Length 3.51
  • Hole Size (Recommended) 1.57
  • Wire Size 12 – 9
  • Wire Size .326 – .518
  • Mating Pin Diameter Range .66 – .84
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Solder Process Feature None
  • Circuit Application Power & Signal
  • Packaging Method Bag
  • Packaging Quantity 2000
  • Spring Material Beryllium Copper
CAT-377-MSSCB65 Pin Sockets  1
PRODUCT
  1. Connectors
  2. Pin Sockets
  1. Miniature Spring Sockets: Closed Bottom, Beryllium Copper, 6.5A CAT-377-MSSCB65
active
  • Socket Sleeve Style Closed Bottom
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Sleeve Material Copper
  • Sleeve Plating Material Tin
  • Contact Base Material Beryllium Copper
  • Contact Current Rating (Max) 6.5
  • Contact Spring Plating Thickness 1.27
  • Contact Transmits (Typical) Signal (Data)/Power
  • Contact Mating Area Plating Thickness 30
  • Contact Type Socket
  • Contact Spring Plating Material Gold
  • Socket Type Discrete
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • Termination Method to Wire & Cable Solder
  • Insertion Method Hand/Semi-Automatic
  • Socket Length 3.63
  • Hole Size (Recommended) 1.83
  • Wire Size 19
  • Wire Size .41 – .518
  • Mating Pin Diameter Range .76 – .84
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Solder Process Feature None
  • Circuit Application Power & Signal
  • Packaging Method Bag
  • Packaging Quantity 2000
  • Spring Material Beryllium Copper
CAT-377-MSSCB5 Pin Sockets  1
PRODUCT
  1. Connectors
  2. Pin Sockets
  1. Miniature Spring Sockets: Closed Bottom, Beryllium Copper, 5A CAT-377-MSSCB5
active
  • Socket Sleeve Style Closed
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Sleeve Material Copper
  • Sleeve Plating Material Tin
  • Contact Base Material Beryllium Copper
  • Contact Current Rating (Max) 5
  • Contact Transmits (Typical) Signal (Data)/Power
  • Contact Type Socket
  • Contact Mating Area Plating Material Tin
  • Contact Spring Plating Material Tin
  • Socket Type Discrete
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • Termination Method to Wire & Cable Solder
  • Insertion Method Hand/Semi-Automatic/Automatic
  • Socket Length 3.51
  • Hole Size (Recommended) 1.57
  • Wire Size 12 – 9
  • Wire Size .205 – .258
  • Mating Pin Diameter Range .56 – .64
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Solder Process Feature Anti-Flux
  • Circuit Application Power & Signal
  • Packaging Method Bag
  • Packaging Quantity 2000
  • Spring Material Beryllium Copper
CAT-D3304-SO1399 DIMM Sockets  1
PRODUCT
  1. Connectors
  2. DIMM Sockets
  1. DDR4 DIMM SOCKETS CAT-D3304-SO1399
active
  • DRAM Type Double Data Rate (DDR) 4
  • Connector System Board-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Center Post Without
  • Profile Standard
  • Product Type Socket
  • Number of Positions 288
  • Module Orientation Vertical
  • Number of Rows 2
  • Keying Standard
  • Number of Keys 1
  • Center Key Offset Right
  • DRAM Voltage 1.2
  • Ejector Type Standard
  • Latch Color Natural
  • Module Key Type Offset Right
  • Latch Material High Temperature Thermoplastic
  • Ejector Location Both Ends
  • Ejector Material High Temperature Thermoplastic
  • Ejector Material Color Natural
  • Contact Base Material Copper Alloy
  • PCB Contact Termination Area Plating Material Tin
  • Contact Underplating Material Nickel
  • Contact Current Rating (Max) .75
  • Socket Style DIMM
  • Contact Mating Area Plating Thickness .38
  • Contact Mating Area Plating Material Gold
  • Socket Type Memory Card
  • Insertion Style Direct Insert
  • PCB Mount Retention Type Boardlock
  • PCB Mount Retention With
  • PCB Mounting Style Surface Mount
  • Connector Mounting Type Board Mount
  • Boardlock Material Stainless Steel
  • Centerline (Pitch) .85
  • Housing Color Green
  • Housing Material High Temperature Thermoplastic
  • Height Above PC Board 20
  • Row-to-Row Spacing 2.2
  • Operating Temperature Range -55 – 105
  • Circuit Application Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Method Box & Tray
CAT-377-MSSBN4 Pin Sockets  1
PRODUCT
  1. Connectors
  2. Pin Sockets
  1. Miniature Spring Sockets: Bullet Nose, Beryllium Copper, 4A CAT-377-MSSBN4
active
  • Socket Sleeve Style Bullet Nose
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Sleeve Material Copper
  • Sleeve Plating Material Tin
  • Contact Base Material Beryllium Copper
  • Contact Current Rating (Max) 4
  • Contact Spring Plating Thickness 2.54
  • Contact Transmits (Typical) Signal (Data)/Power
  • Contact Type Socket
  • Contact Spring Plating Material Tin
  • Contact Mating Area Plating Thickness 2.54
  • Socket Type Discrete
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • Termination Method to Wire & Cable Solder
  • Insertion Method Hand/Semi-Automatic/Automatic
  • Socket Length 4.01
  • Hole Size (Recommended) 1.07
  • Wire Size 25 – 22
  • Wire Size .081 – .205
  • Mating Pin Diameter Range .3 – .53
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Solder Process Feature Anti-Flux
  • Circuit Application Power & Signal
  • Packaging Method Carrier Tape
  • Packaging Quantity 10000
  • Spring Material Beryllium Copper
CAT-377-MSSBN5 Pin Sockets  1
PRODUCT
  1. Connectors
  2. Pin Sockets
  1. Mini Spring Sockets: Bullet Nose, 5A CAT-377-MSSBN5
active
  • Socket Sleeve Style Bullet Nose
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Sleeve Material Copper
  • Sleeve Plating Material Tin
  • Contact Base Material Beryllium Copper
  • Contact Current Rating (Max) 5
  • Contact Spring Plating Thickness .762
  • Contact Transmits (Typical) Signal (Data)/Power
  • Contact Mating Area Plating Thickness 30
  • Contact Type Socket
  • Contact Spring Plating Material Gold
  • Socket Type Discrete
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • Termination Method to Wire & Cable Solder
  • Insertion Method Hand/Semi-Automatic/Automatic
  • Socket Length 4.67
  • Hole Size (Recommended) 1.32
  • Wire Size 22 – 20
  • Wire Size .081 – .326
  • Mating Pin Diameter Range .36 – .66
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Solder Process Feature Anti-Flux
  • Circuit Application Power & Signal
  • Packaging Method Carrier Tape
  • Packaging Quantity 10000
  • Spring Material Beryllium Copper
CAT-377-MSSKB3 Pin Sockets  1
PRODUCT
  1. Connectors
  2. Pin Sockets
  1. Miniature Spring Sockets: Knockout Bottom Beryllium Copper, 3A CAT-377-MSSKB3
active
  • Socket Sleeve Style Knockout Bottom
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Sleeve Material Copper
  • Sleeve Plating Material Tin
  • Contact Base Material Beryllium Copper
  • Contact Current Rating (Max) 3
  • Contact Spring Plating Thickness .762
  • Contact Transmits (Typical) Signal (Data)/Power
  • Contact Mating Area Plating Thickness 30
  • Contact Type Socket
  • Contact Spring Plating Material Gold
  • Socket Type Discrete
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • Termination Method to Wire & Cable Solder
  • Insertion Method Hand/Semi-Automatic
  • Socket Length 3.61
  • Hole Size (Recommended) 1.04
  • Wire Size 28 – 25
  • Wire Size .081 – .162
  • Mating Pin Diameter Range .33 – .51
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Solder Process Feature None
  • Circuit Application Power & Signal
  • Packaging Method Bag
  • Packaging Quantity 2000
  • Spring Material Beryllium Copper
CAT-D3303-SO1399 DIMM Sockets  1
PRODUCT
  1. Connectors
  2. DIMM Sockets
  1. DDR3 DIMM Sockets CAT-D3303-SO1399
active
  • DRAM Type Double Data Rate (DDR) 3
  • Connector System Board-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Center Post With
  • Product Type Socket
  • Number of Positions 240
  • Module Orientation Vertical
  • Number of Bays 2
  • Number of Rows 2
  • Keying Standard
  • Number of Keys 1
  • Center Key Center
  • DRAM Voltage 1.5
  • Ejector Type Rotary
  • Retention Post Location Center
  • Latch Color Natural
  • Module Key Type Offset Left
  • Latch Material Thermoplastic
  • Ejector Location Both Ends
  • Ejector Material High Temperature Nylon
  • Retention Post Material Brass
  • Ejector Material Color Natural
  • Contact Base Material Copper Alloy
  • PCB Contact Termination Area Plating Material Tin
  • Contact Underplating Material Nickel
  • Contact Current Rating (Max) .5
  • Socket Style DIMM
  • Solder Tail Contact Plating Thickness 3
  • Contact Mating Area Plating Thickness .38
  • Contact Mating Area Plating Material Gold
  • Socket Type Memory Card
  • Insertion Style Direct Insert
  • Termination Post Length 2.67
  • PCB Mount Retention Type Boardlock
  • PCB Mount Retention With
  • PCB Mounting Style Through Hole - Solder
  • Connector Mounting Type Board Mount
  • Mounting Angle Vertical
  • Boardlock Material Brass
  • Centerline (Pitch) 1
  • Housing Color Black
  • Housing Material High Temperature Nylon
  • Height Above PC Board 21
  • Row-to-Row Spacing 1.9
  • Center Retention Hole Diameter 1.8
  • Operating Temperature Range -55 – 105
  • Circuit Application Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Method Box & Tray
  • Packaging Quantity 50
CAT-377-MSSOB4 Pin Sockets  1
PRODUCT
  1. Connectors
  2. Pin Sockets
  1. Miniature Spring Sockets: Open Bottom, Beryllium Copper, 6.5A CAT-377-MSSOB4
active
  • Socket Sleeve Style Open Bottom
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Sleeve Material Copper
  • Sleeve Plating Material Gold Flash over Nickel
  • Contact Base Material Beryllium Copper
  • Contact Current Rating (Max) 6.5
  • Contact Spring Plating Thickness .762
  • Contact Transmits (Typical) Signal (Data)/Power
  • Contact Mating Area Plating Thickness 30
  • Contact Type Socket
  • Contact Spring Plating Material Gold
  • Socket Type Discrete
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • Termination Method to Wire & Cable Solder
  • Insertion Method Hand/Semi-Automatic
  • Socket Length 3.63
  • Hole Size (Recommended) 1.83
  • Wire Size 19
  • Wire Size .326 – .518
  • Mating Pin Diameter Range .71 – .84
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Solder Process Feature None
  • Circuit Application Power & Signal
  • Packaging Method Bag
  • Packaging Quantity 2000
  • Spring Material Beryllium Copper