 
					   
					Control Unit Header (CH2) - Mixed Miniaturized Wire-to-Board Connector Solutions
TE's new generation of mixed miniaturized standard wire-to-board connectors has been designed from the outset with the need for flexible layout of domain control connections in mind. It’s compact in structural design and offers a variety of optional interfaces to cover a wide range of current-carrying requirements.
ZONAL
Reduced E/E architecture complexity, space, weight & cost
SPACE
Miniaturized design enabling significant PCB space savings
FLEX
Flexible connector system with broad current coverage across mixed interfaces
MODULAR VS. HYBRID VS. MIXED CONNECTIVITY SOLUTIONS
| MIXED | Mixed connectors are designed to combine multiple Signal and Power terminal sizes within a single connector interface (i.e. 0.50mm, 0.64mm, 1.2mm, 2.8mm, etc.) | 
| HYBRID (Signal, Power, and Data) | Hybrid connectors take the concept of mixed connectors further by integrating high-speed Data Connectivity terminals within a single connector. | 
| MODULAR (Flexible, Scalable, Automation-Ready & Miniaturized) | Modular connectors can be customized or adapted by combining different modules or components into a single connector housing leading to maximum flexibility, scalability and time-to-market. | 
Power Meets Precision:
TE Connectivity’s New CH2 Miniaturized Mixed Connectors
The future of intelligent vehicles is here — and it's smarter, more compact, and more demanding than ever. As multi-functional zonal controllers become central to vehicle architectures, the need for high-performance, space-saving connectors is critical.
TE Connectivity introduces its next-generation miniaturized mixed wire-to-board connectors, using the trusted NanoMQS 0.50, MCON 1.2, and MCP 2.8/6.3 terminal series. Designed for today's automotive and industrial challenges, these connectors combine compact design with high current-carrying capacity and flexible interface options — delivering performance without compromise.
Ready for next-gen applications, our miniaturized mixed connectors deliver the reliability, adaptability, and performance that leading-edge designs demand.
KEY BENEFITS:
- Platform-optimized miniaturized design for maximum PCB space efficiency
- Proven performance built on TE’s trusted NanoMQS 0.50, MCON 1.2, MCP 2.8, and MCP 6.3 terminal series — widely recognized by leading global OEMs
- Versatile mixed-interface design supporting a broad range of current levels
- Spliceable architecture for maximum application flexibility
- Mechanical keying features ensure error-proof assembly across multiple positions
- Streamlined assembly process for ease and efficiency
 
Ready for next-gen applications, our miniaturized mixed connectors deliver the reliability, adaptability, and performance that leading-edge designs demand.
CH2 Connector Offerings
| Part Number | Positions | Terminals | Orientation | Coding | Soldering | Plating | 
| 12 | 4x 2.8 8x 1.2 | 90° | 4 | PIP / Wave Soldering | Tin (Sn) / Silver (Ag) | |
| 23 | 2x 6.3 21x 0.50 | 90° | 4 | PIP / Wave Soldering | Tin (Sn) / Silver (Ag) | |
| 28 | 4x 2.8 24x 0.50 | 90° | 6 | PIP / Wave Soldering | Tin (Sn) / Silver (Ag) | |
| 29 | 8x 1.2 21x 0.50 | 90° | 4 | PIP / Wave Soldering | Tin (Sn) / Silver (Ag) | |
| 52 | 23P + 29P | 90° | 2 | PIP / Wave Soldering | Tin (Sn) / Silver (Ag) | |
| 73 | 35P + 38P | 90° | 1 | PIP / Wave Soldering | Tin (Sn) / Silver (Ag) | 
This product table can only be viewed on desktop.
| Part Number | Positions | Terminals | Orientation | Coding | Soldering | Plating | 
| 12 | 4x 2.8 8x 1.2 | 90° | 4 | PIP / Wave Soldering | Tin (Sn) / Silver (Ag) | |
| 23 | 2x 6.3 21x 0.50 | 90° | 4 | PIP / Wave Soldering | Tin (Sn) / Silver (Ag) | |
| 28 | 4x 2.8 24x 0.50 | 90° | 6 | PIP / Wave Soldering | Tin (Sn) / Silver (Ag) | |
| 29 | 8x 1.2 21x 0.50 | 90° | 4 | PIP / Wave Soldering | Tin (Sn) / Silver (Ag) | |
| 52 | 23P + 29P | 90° | 2 | PIP / Wave Soldering | Tin (Sn) / Silver (Ag) | |
| 52 | 23P + 29P | 90° | 2 | PIP / Wave Soldering | Tin (Sn) / Silver (Ag) | |
| 73 | 35P + 38P | 90° | 1 | PIP / Wave Soldering | Tin (Sn) / Silver (Ag) | |
| 73 | 35P + 38P | 90° | 1 | PIP / Wave Soldering | Tin (Sn) / Silver (Ag) | 
This product table can only be viewed on desktop.
CH2 Terminals
| Terminals | Applicable Wire | Current Rating | Material/Finish | |
| 0.13-0.22mm2 | 6A | Copper Alloy / Tin | ||
| 0.35-1.5mm2 | 17A | Tin / Silver | ||
| 0.35-4.0mm2 | 40A | Tin / Silver | ||
| 0.5-6.0mm2 | 52A | Tin / Silver | 
This product table can only be viewed on desktop.
CH2 Applications
- ADAS zonal control unit
- Body zonal control unit
- Intelligent cockpit zonal control unit
- Entertainment zonal control unit
- Vehicle Body Control Units
 Header: 2418381
            Header: 2418381 Header: 2418382
            Header: 2418382 Header: 2418383
            Header: 2418383 Header: 2418384
            Header: 2418384 Header: 2418486
            Header: 2418486 Header: 2420419
            Header: 2420419 Plug: 2418400
            Plug: 2418400 Plug: 2418500
            Plug: 2418500 Plug: 2418600
            Plug: 2418600 Plug: 2418700
            Plug: 2418700 Plug: 2436800
            Plug: 2436800 Plug: 2436900
            Plug: 2436900 Plug: 2188698
            Plug: 2188698 Plug: 2188701
            Plug: 2188701 NanoMQS 0.50mm
            NanoMQS 0.50mm MCON 1.2mm
            MCON 1.2mm MCP2.8mm
            MCP2.8mm MCP6.3mm
            MCP6.3mm 
                    
                     
                        
                                    