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Contact Features
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Contact Type :
Pin
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PCB Contact Termination Area Plating Material :
Tin-Lead
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Contact Base Material :
Phosphor Bronze
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Contact Mating Area Plating Material :
Gold Flash over Palladium Nickel
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Contact Layout :
Inline
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PCB Contact Termination Area Plating Material Thickness :
2.54 µm [ 100 µin ]
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Contact Mating Area Plating Material Thickness :
.76 µm [ 29.92 µin ]
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Contact Underplating Material Thickness :
1.27 µm [ 50 µin ]
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Contact Underplating Material :
Nickel
Mechanical Attachment
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PCB Mount Alignment :
Without
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Mating Alignment :
With
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PCB Mount Retention Type :
Boardlock
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Mating Alignment Type :
Polarization
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Mating Retention :
Without
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PCB Mount Retention :
With
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Panel Mount Feature :
Without
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Connector Mounting Type :
Board Mount
Industry Standards
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Compatible With Approved Standards Products :
CSA LR7189, UL E28476
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UL Flammability Rating :
UL 94V-0
Packaging Features
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Packaging Method :
Box & Tray, Tray
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