Please review product documents or contact us for the latest agency approval information. 

Please Note: Use the Product Drawing for all design activity. 

• Sealable : No

• Operating Voltage (VAC): 250

• Operating Voltage (VDC): 250

• Contact Mating Area Plating Material Finish : Bright

• PCB Contact Termination Area Plating Material : Tin-Lead

• Wire Contact Termination Area Plating Thickness : 1.27 µm [ 50 µin ]

• Contact Shape & Form : Round

• PCB Contact Termination Area Plating Material Thickness : 1.27 µm [ 50 µin ]

• Wire Contact Termination Area Plating Material Finish : Bright

• Contact Mating Area Plating Material Thickness : .76 µm [ 30 µin ]

• Contact Underplating Material Thickness : 1.27 µm [ 50 µin ]

• Mating Pin Diameter : 1.57 mm [ .062 in ]

• Contact Orientation : Straight

• Contact Underplating Material : Nickel

• Contact Type : Pin

• Contact Mating Area Plating Material : Gold (Au)

• Wire Contact Termination Area Plating Material : Tin-Lead

• Contact Retention Within Housing : With

• Contact Size : Size 16

• Contact Base Material : Brass

• Contact Current Rating (Max) (A): 1.8

• Termination Method to PCB : Through Hole - Solder

• Product Terminates To : Wire & Cable

• Wire Insulation Support : Without

• Operating Temperature Range : -55 – 150 °C [ -67 – 302 °F ]

• Circuit Application : Power