DIP (Dual Inline Package) and HOLTITE Sockets

DIP Socket Products for Reliable Connections

Our large selection of HOLTITE and Dual Inline Package (DIP) sockets can provide a highly reliable connection between your integrated circuit (IC) devices and PCBs. We offer DIP sockets in a wide variety, with positions ranging from 1 to 48, and termination options that include through hole and surface mounting, solderless zero profile, four-finger inner contact and dual leaf contacts, as well as a variety of plating options.

Product Features:

DIP Sockets
  • 1 to 48 positions
  • HOLTITE socket (solderless zero profile) is available
  • Precision four-finger inner contacts or dual leaf contacts are optional 
  • Open frame and closed frame housings
  • Available with a variety of plating options

 

IC-to-Socket-to-Board
Four-Fingered Contacts

Four-Fingered Contacts

Precision machined or stamped four-finger inner contacts with open or closed frame housings facilitate highly reliable DIP sockets.

Dual Leaf Contacts

Dual Leaf Contacts

Dual leaf contacts provide a cost effective solution to the DIP socket design with superior handling characteristics.

Zero Profile(HOLTITE)

Zero Profile(HOLTITE)

HOLTITE socket contact is designed to be press-fit into the plated-thru hole of a printed wiring board, offering the solderless zero profile by allowing the plated-thru hole to become the component socket. For DIP package components, the HOLTITE socket contacts on reel provide with disposable terminal carriers, which can be peeled away and disposed after assembly.