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Overview

The sensor module includes a pressure sensor and an ultra low power 24- bit ∆Σ ADC with internal factory calibrated coefficients. It provides a 24-bit digital pressure and temperature value and different operation modes that allow the user to optimize for conversion speed and current consumption. The MS5525DSO can be interfaced to virtually any microcontroller. The communication protocol is simple, without the need of programming internal registers in the device.

This new sensor module generation is based on leading MEMS technology and latest benefits from MEAS proven experience and know-how in high volume manufacturing of pressure modules, which have been widely used for over a decade. The rugged engineered thermoplastic transducer is available in single and dual port configurations, and can measure absolute, gauge, compound, and differential pressure from 1 to 30psi.

 

BENEFITS

  • Integrated Digital Pressure Sensor           (24-bit ∆Σ ADC)
  • Fast Conversion Down to 1 ms
  • Low Power, 1 µA (standby < 0.15 µA)
  • Supply  Voltage: 1.8 to 3.6V
  • Pressure Range: 1 to 30 PSI
  • I2C and SPI Interface
  • Small Outline IC Package
  • Barbed Pressure Ports
  • Low Power, High Resolution ADC
  • Digital Pressure and Temperature Outputs

Features

Please review product documents or contact us for the latest agency approval information.  

Product Type Features

  • Sensor Type  Digital Pressure and Altimeter Sensor Modules

  • Type  Absolute, Differential, Gage

Electrical Characteristics

  • Supply Voltage (V) 1.8 – 3.6

Usage Conditions

  • Operating Temperature Range  -40 – 125 °C [ -40 – 257 °F ]

Operation/Application

  • Output Interface  I²C and SPI (Mode 0, 3)

  • Overpressure  60 psi

  • Pressure (psi) 1, 2, 5, 15, 30

  • Output/Span  24 bit ADC

  • Accuracy  ±0.25% Span

Packaging Features

  • Package  SOIC-14

Related Materials

Datasheets & Catalog Pages

Product Specifications

Manuals & User Guides

Terms and Conditions

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Disclaimer:
This information has been provided to your free of charge for your use but remains the sole property of TE Connectivity Corporation (''TE'') or SnapEDA,  Inc. or Ultra Librarian/EMA Design Automation, Inc. (collectively, "Company"). While Company has used reasonable efforts to ensure its accuracy, Company does not guarantee that it is error-free, not makes any other representation, warranty, or guarantee that the information is completely accurate or up-to-date. In many cases, the CAD data has been simplified to remove proprietary detail while maintaining critical interface geometric detail for use by customers. Company expressly disclaims all implied warranties regarding this information, including but not limited to any implied warranties or merchantability or fitness for a particular purpose.