This product is not currently available. For more information, including distributor inventory, please contact us.

148534-1

Active

Socket Contact, Gold (Au), Brass, Power, -55 – 125 °C [-67 – 257 °F], Z-PACK 2mm HM

148534-1

Active

Socket Contact, Gold (Au), Brass, Power, -55 – 125 °C [-67 – 257 °F], Z-PACK 2mm HM

- Z-PACK
- Z-PACK 2mm HM

TE Internal #: 148534-1
TE Internal Description: PWR CONT FMALE 90DGR MFBL40AMP

Contact Type : Socket
Contact Mating Area Plating Material : Gold (Au)
Contact Base Material : Brass
Product Terminates To : Printed Circuit Board
Contact Current Rating (Max) (A): 40

See All Features

More Less

Compatible Parts & Tooling

Documents

Product Drawings

POWER CONTACT, EUROCARD TYPE M, FEMALE 90 DEG, PRINTED CIRCUIT BOARD MOUNT, MFBL, WITH SOLDER POSTS, (40 AMP) tif English
POWER CONTACT, EUROCARD TYPE M, FEMALE 90 DEG, PRINTED CIRCUIT BOARD MOUNT, MFBL, WITH SOLDER POSTS, (40 AMP) ENG_CD_148534_C.pdf English

CAD Files

Download ECAD Model File
Download the free Library Loader to convert this file to your ECAD Tool. Learn more about the ECAD Model.
3D PDF 3D_CVM_CVM_148534-1_O.pdf 3D
Customer View Model ENG_CVM_CVM_148534-1_O.2d_dxf.zip English
ENG_CVM_CVM_148534-1_O.3d_igs.zip English
ENG_CVM_CVM_148534-1_O.3d_stp.zip English

Product Change Notification

View Product Change Notification Login required to access product change notifications

Features

Please review product documents or contact us for the latest agency approval information.

Please Note: Use the Product Drawing for all design activity.

Contact Features

Contact Mating Area Plating Material Thickness : .762 µm [ 30 µin ]
PCB Contact Termination Area Plating Material : Tin-Lead
Contact Orientation : Right Angle
Contact Underplating Material : Nickel
PCB Contact Termination Area Plating Material Thickness : 2.54 µm [ 100 µin ]
Contact Type : Socket
Contact Mating Area Plating Material : Gold (Au)
Contact Base Material : Brass
Contact Current Rating (Max) (A): 40

Termination Features

Termination Method to PCB : Through Hole - Solder
Product Terminates To : Printed Circuit Board

Mechanical Attachment

PCB Mount Retention : Without
Wire Insulation Support : Without

Usage Conditions

Operating Temperature Range : -55 – 125 °C [ -67 – 257 °F ]

Operation/Application

Circuit Application : Power

Packaging Features

Packaging Quantity : 1
Packaging Method : Tray

148534-1

Socket Contact, Gold (Au), Brass, Power, -55 – 125 °C [-67 – 257 °F], Z-PACK 2mm HM

148534-1

Socket Contact, Gold (Au), Brass, Power, -55 – 125 °C [-67 – 257 °F], Z-PACK 2mm HM

Contact Type : Socket

Contact Mating Area Plating Material : Gold (Au)

Contact Base Material : Brass

Product Terminates To : Printed Circuit Board

Contact Current Rating (Max) (A): 40

Documents

Product Drawings

CAD Files

Product Change Notification

Features

Contact Features

Contact Mating Area Plating Material Thickness : .762 µm [ 30 µin ]

PCB Contact Termination Area Plating Material : Tin-Lead

Contact Orientation : Right Angle

Contact Underplating Material : Nickel

PCB Contact Termination Area Plating Material Thickness : 2.54 µm [ 100 µin ]

Contact Type : Socket

Contact Mating Area Plating Material : Gold (Au)

Contact Base Material : Brass

Contact Current Rating (Max) (A): 40

Termination Features

Termination Method to PCB : Through Hole - Solder

Product Terminates To : Printed Circuit Board

Mechanical Attachment

PCB Mount Retention : Without

Wire Insulation Support : Without

Usage Conditions

Operating Temperature Range : -55 – 125 °C [ -67 – 257 °F ]

Operation/Application

Circuit Application : Power

Packaging Features

Packaging Quantity : 1

Packaging Method : Tray

Product Compliance