CAT-L59017-A68 LGA Sockets  1
  • Connector System Board-to-Board
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Socket
  • Number of Positions 2011
  • Grid Spacing 1.016 x .8814
  • Plating Thickness 30
  • Plating Material Gold
  • Frame Style Square
  • Contact Base Material Copper Alloy
  • IC Socket Type LGA 2011
  • Contact Mating Area Plating Material Gold
  • Contact Current Rating (Max) .5
  • PCB Mounting Style Surface Mount Solder Ball
  • Connector Mounting Type Board Mount
  • Heat Sink Attachment Without
  • Centerline (Pitch) 1.016
  • Housing Color Black
  • Housing Material High Temperature Thermoplastic
  • Operating Temperature Range -25 – 100
  • Circuit Application Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tray
  • Tray Color Black
  • Comment Lead-Free Solderball
CAT-D3304-SO1399 DIMM Sockets  1
  • DRAM Type Double Data Rate (DDR) 4
  • Connector System Board-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Center Post Without
  • Profile Standard
  • Product Type Socket
  • Number of Positions 288
  • Module Orientation Vertical
  • Center Key Offset Right
  • Number of Rows 2
  • Keying Standard
  • Number of Keys 1
  • DRAM Voltage 1.2
  • Ejector Type Standard
  • Latch Color Natural
  • Latch Material High Temperature Thermoplastic
  • Ejector Material Color Natural
  • Module Key Type Offset Right
  • Ejector Location Both Ends
  • Ejector Material High Temperature Thermoplastic
  • Contact Base Material Copper Alloy
  • PCB Contact Termination Area Plating Material Tin
  • Contact Underplating Material Nickel
  • Contact Current Rating (Max) .75
  • Socket Style DIMM
  • Contact Mating Area Plating Thickness .38
  • Contact Mating Area Plating Material Gold
  • Socket Type Memory Card
  • Insertion Style Direct Insert
  • PCB Mount Retention Type Boardlock
  • PCB Mount Retention With
  • PCB Mounting Style Surface Mount
  • Connector Mounting Type Board Mount
  • Boardlock Material Stainless Steel
  • Centerline (Pitch) .85
  • Housing Material High Temperature Thermoplastic
  • Housing Color Black
  • Height Above PC Board 20
  • Row-to-Row Spacing 2.2
  • Operating Temperature Range -55 – 105
  • Circuit Application Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Method Box & Tray
CAT-L59017-A76 LGA Sockets  1
  • Connector System Board-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Socket
  • Number of Positions 1823
  • Grid Spacing .9906 x .8585
  • Plating Thickness 30
  • Plating Material Gold
  • Frame Style Square
  • Contact Base Material Copper Alloy
  • IC Socket Type LGA 3647
  • Contact Mating Area Plating Material Gold
  • Contact Current Rating (Max) .5
  • PCB Mounting Style Surface Mount Solder Ball
  • Connector Mounting Type Board Mount
  • Heat Sink Attachment Without
  • Centerline (Pitch) .8585
  • Housing Color Black
  • Housing Material High Temperature Thermoplastic
  • Operating Temperature Range -25 – 100
  • Circuit Application Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tray
  • Comment Lead-Free Solderball
CAT-D33047-SO1339 SO DIMM Sockets  1
  • DRAM Type Small Outline (SO)
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Center Post Without
  • Product Type Socket
  • Module Orientation Right Angle
  • Number of Positions 200
  • Number of Rows 2
  • Center Key Offset Right
  • Keying Reverse
  • Number of Keys 1
  • DRAM Voltage 1.2
  • SGRAM Voltage 1.2
  • Ejector Type Locking
  • Connector Profile High
  • Latch Material High Temperature Thermoplastic
  • Retention Post Location Both Ends
  • Ejector Location Both Ends
  • Contact Base Material Copper Alloy
  • PCB Contact Termination Area Plating Material Gold Flash
  • Contact Underplating Material Nickel
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Material Thickness .127
  • Contact Current Rating (Max) .5
  • Socket Type Memory Card
  • Socket Style SO DIMM
  • Insertion Style Cam-In
  • PCB Mount Retention Type Solder Peg
  • PCB Mount Retention With
  • PCB Mounting Style Surface Mount
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) .5
  • Housing Color Black
  • Housing Material High Temperature Thermoplastic
  • Stack Height 4
  • Row-to-Row Spacing 8.2
  • Operating Temperature Range -55 – 85
  • Circuit Application Power
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tape & Reel
  • Packaging Quantity 900
CAT-L59017-A76H IC Socket Hardware  1
  • Card & Socket Accessory Type Backplate
  • Insulator Material Polycarbonate Film Plus Acrylic Adhesive Layer
  • Bolster Plate Assembly Material Stainless Steel
  • Compatible With IC Socket Type LGA 3647
  • Operating Temperature Range -25 – 100
  • Packaging Method Box & Tray
  • Comment Narrow Type with Cover.
CAT-D33037-SO1339 SO DIMM Sockets  1
  • DRAM Type Double Data Rate (DDR) 2
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Socket
  • Module Orientation Right Angle
  • Number of Positions 144
  • Number of Rows 2
  • Center Key Offset Left
  • Number of Bays 2
  • Number of Keys 1
  • SGRAM Type 64 Bit
  • SGRAM Voltage 3.3
  • Ejector Type Locking
  • Connector Profile High
  • Latch Material Stainless Steel
  • Module Key Type SGRAM
  • Latch Plating Material Tin
  • Ejector Location None
  • Contact Base Material Copper Alloy
  • PCB Contact Termination Area Plating Material Gold
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Material Thickness .25
  • Socket Type Memory Card
  • Socket Style SO DIMM
  • Insertion Style Cam-In
  • PCB Mount Retention Type Hold-Down Post
  • PCB Mount Retention With
  • PCB Mounting Style Surface Mount
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) .8
  • Housing Color Natural
  • Housing Material High Temperature Plastic
  • Stack Height 4
  • Row-to-Row Spacing 5.4
  • Operating Temperature Range -55 – 105
  • Circuit Application Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Method Box
  • Packaging Quantity 20
CAT-D3301-SO1339 SO DIMM Sockets  1
  • DRAM Type Double Data Rate (DDR)
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Socket
  • Module Orientation Right Angle
  • Number of Positions 200
  • Number of Rows 2
  • Center Key None
  • Keying Standard
  • Number of Bays 2
  • Number of Keys 1
  • DRAM Voltage 1.8
  • SGRAM Voltage 1.8
  • Ejector Type Locking
  • Connector Profile Low
  • Latch Material Stainless Steel
  • Module Key Type SGRAM
  • Latch Plating Material Tin
  • Ejector Location Both Ends
  • Contact Base Material Copper Alloy
  • PCB Contact Termination Area Plating Material Gold
  • Contact Underplating Material Nickel
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Material Thickness .254
  • Contact Current Rating (Max) .5
  • Socket Type Memory Card
  • Socket Style SO DIMM
  • Insertion Style Cam-In
  • PCB Mount Retention Type Solder Peg
  • PCB Mount Retention With
  • PCB Mounting Style Surface Mount
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) .6
  • Housing Color Black
  • Housing Material High Temperature Thermoplastic
  • Stack Height 4
  • Row-to-Row Spacing 5.6
  • Operating Temperature Range -55 – 105
  • Circuit Application Power
  • UL Flammability Rating UL 94V-0
  • Packaging Method Box
  • Packaging Quantity 20
CAT-L59017-A68H IC Socket Hardware  1
  • Card & Socket Accessory Type Backplate
  • Product Type Accessory
  • Insulator Material Polycarbonate Film Plus Acrylic Adhesive Layer
  • Plating Material Nickel
  • Backplate Material Steel
  • Top Support Plate Material Stainless Steel
  • Spring Plate Assembly Material Stainless Steel
  • Compatible With IC Socket Type LGA 2011
  • Operating Temperature Range -25 – 100
  • Packaging Method Bag/Box
CAT-D3303-SO1399 DIMM Sockets  1
  • DRAM Type Double Data Rate (DDR) 3
  • Connector System Board-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Center Post With
  • Product Type Socket
  • Number of Positions 240
  • Module Orientation Vertical
  • Center Key Center
  • Number of Bays 2
  • Number of Rows 2
  • Keying Standard
  • Number of Keys 1
  • DRAM Voltage 1.5
  • Ejector Type Rotary
  • Latch Color Natural
  • Latch Material Thermoplastic
  • Retention Post Material Brass
  • Ejector Material Color Natural
  • Retention Post Location Center
  • Module Key Type Offset Left
  • Ejector Location Both Ends
  • Ejector Material High Temperature Nylon
  • Contact Base Material Copper Alloy
  • PCB Contact Termination Area Plating Material Tin
  • Contact Underplating Material Nickel
  • Contact Current Rating (Max) .5
  • Socket Style DIMM
  • Contact Mating Area Plating Thickness .38
  • Solder Tail Contact Plating Thickness 3
  • Contact Mating Area Plating Material Gold
  • Socket Type Memory Card
  • Termination Post Length 3.18
  • Insertion Style Direct Insert
  • PCB Mount Retention Type Boardlock
  • PCB Mount Retention With
  • PCB Mounting Style Surface Mount
  • Connector Mounting Type Board Mount
  • Mounting Angle Vertical
  • Boardlock Material Brass
  • Centerline (Pitch) 1
  • Housing Material High Temperature Nylon
  • Housing Color Black
  • Height Above PC Board 21
  • Row-to-Row Spacing .95
  • Center Retention Hole Diameter 1.8
  • Operating Temperature Range -55 – 105
  • Circuit Application Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Method Box & Tray
  • Packaging Quantity 50
CAT-H744-SO1399 DIP Sockets  1
  • Leg Style Straight
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Socket
  • Number of Positions 1
  • PCB Mount Orientation Vertical
  • Number of Rows 2
  • Contact Resistance 10
  • Insulation Resistance 1000
  • Connector Profile Zero
  • Carrier Strip Material Mylar
  • Frame Style Film Carrier
  • Contact Base Material Beryllium Copper
  • PCB Contact Termination Area Plating Material Gold
  • Contact Fabrication Screw Machine
  • Contact Mating Area Plating Material Gold
  • Contact Current Rating (Max) 3
  • Socket Style Standard
  • Mating Contact Type Four-Fingered
  • Socket Type DIP
  • Contact Type Socket
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • Termination Post Length 3.18
  • PCB Mount Retention Without
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) 2.54
  • Height Above PC Board 0
  • Row-to-Row Spacing 10.16
  • Operating Temperature Range -55 – 105
  • Circuit Application Signal
  • Packaging Quantity 5000
  • Packaging Method Reel
  • Patterns Per Reel 1
5-1542000-6 Heat Sinks  1
  • Device Type BGA
  • Accessory Type Clip
  • Number of Fins 2
  • Power 5
  • Fin Style Radial
  • Material Aluminum
  • Plating Material Black Anodized
  • Comment Heat sink assembly includes Two Leg Standard Clip, Part Number 1542367-1.
5050871-6 Pin Sockets  1
  • Socket Sleeve Style Open Bottom
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Contact
  • Profile Zero
  • Wire/Cable Type Discrete Wire
  • Sleeve Material Copper
  • Sleeve Plating Material Tin
  • Contact Base Material Beryllium Copper
  • Contact Current Rating (Max) 7.5
  • Contact Spring Plating Thickness 2.54
  • Contact Type Socket
  • Contact Spring Plating Material Tin
  • Socket Type Discrete
  • Contact Transmits (Typical) Signal (Data)/Power
  • Contact Mating Area Plating Thickness 2.54
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • Termination Method to Wire & Cable Solder
  • Insertion Method Hand/Semi-Automatic
  • Socket Length 7.32
  • Hole Size (Recommended) 2.56
  • Wire Size 18 – 17
  • Wire Size .823 – 1.04
  • Mating Pin Diameter Range 1.07 – 1.24
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Solder Process Feature None
  • Circuit Application Power & Signal
  • Packaging Method Bag
  • Packaging Quantity 2000
  • Spring Material Beryllium Copper
8080-1G15 Transistor Sockets  1
  • Terminal Configuration Contact
  • Package Outline Dimensions TO-3
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Socket
  • Number of Positions 3
  • Number of Solder Lugs 2
  • Connector Profile Low
  • Lead Size (Accepted) 1.52
  • Color Black
  • Insulator Material Phenolic
  • Terminal Plating Tin
  • Termination Method Solder
  • Contact Current Rating (Max) 10
  • Socket Type Transistor
  • Terminal Material Beryllium Copper
  • Termination Method to Printed Circuit Board Through Hole - Solder
  • Connector Mounting Type Board Mount
  • Operating Temperature Range -55 – 125
  • Circuit Application Signal
  • Insulator Flammability Rating UL 94V-0
816-AG11D-ES DIP Sockets  1
  • Leg Style Straight
  • Connector & Contact Terminates To Printed Circuit Board
  • Number of Positions 16
  • PCB Mount Orientation Vertical
  • Connector Profile Standard
  • Frame Style Open
  • Contact Fabrication Stamped & Formed
  • Contact Mating Area Plating Material Gold
  • Contact Current Rating (Max) 3
  • Termination Method to Printed Circuit Board Through Hole - Solder
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) 2.54
  • Row-to-Row Spacing 7.62
  • Operating Temperature Range -55 – 125
  • Circuit Application Signal
540-AG10D-ES DIP Sockets  1
  • Leg Style Straight
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Socket
  • Number of Positions 40
  • PCB Mount Orientation Vertical
  • Number of Rows 2
  • Contact Resistance 10
  • Insulation Resistance 5000
  • Connector Profile Standard
  • Sleeve Material Brass/Copper
  • Frame Style Closed
  • Sleeve Plating Material Tin/Lead
  • Contact Base Material Beryllium Copper
  • PCB Contact Termination Area Plating Material Gold
  • Contact Fabrication Stamped & Formed
  • Contact Mating Area Plating Material Gold
  • Contact Current Rating (Max) 3
  • Socket Style Standard
  • Mating Contact Type Four-Fingered
  • Socket Type DIP
  • Contact Type Pin
  • Termination Method to Printed Circuit Board Through Hole - Solder
  • Termination Post Length 3.18
  • PCB Mount Retention Without
  • Connector Mounting Type Board Mount
  • Mating Alignment Type Polarization
  • Mating Alignment With
  • Centerline (Pitch) 2.54
  • Housing Material Polyester
  • Height Above PC Board 4.57
  • Row-to-Row Spacing 15.24
  • Operating Temperature Range -55 – 125
  • Circuit Application Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Quantity 12
  • Tubes per Box 100
  • Packaging Method Box & Tube
  • Quantity per Tube 12
3-2330550-2 IC Socket Hardware  1
  • Card & Socket Accessory Type Bolster Assembly
  • Insulator Material Polycarbonate Film Plus Acrylic Adhesive Layer
  • Bolster Plate Assembly Material Stainless Steel
  • Operating Temperature Range -25 – 100
  • Packaging Method Box & Tray
  • Comment Bolster assembly with dust cover
840-AG12D-ES-LF DIP Sockets  1
  • Leg Style Straight
  • Connector & Contact Terminates To Printed Circuit Board
  • Number of Positions 40
  • PCB Mount Orientation Vertical
  • Connector Profile Standard
  • Frame Style Open
  • Contact Fabrication Stamped & Formed
  • Contact Mating Area Plating Material Gold Flash
  • Contact Current Rating (Max) 3
  • Termination Method to Printed Circuit Board Through Hole - Solder
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) 2.54
  • Row-to-Row Spacing 15.24
  • Operating Temperature Range -55 – 105
  • Circuit Application Signal
8059-2G1 Transistor Sockets  1
  • Terminal Configuration Contact
  • Package Outline Dimensions TO-5
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Socket
  • Number of Positions 3
  • Connector Profile Ultra-Low
  • Lead Size (Accepted) .41
  • Color Red
  • Insulator Material Glass-Filled Polyamide Nylon
  • Sleeve Material Brass
  • Sleeve Plating Material Gold
  • Terminal Plating Gold
  • Termination Method Printed Circuit
  • Contact Current Rating (Max) 3
  • Pin Diameter 5.08
  • Socket Type Transistor
  • Terminal Material Beryllium Copper
  • Termination Method to Printed Circuit Board Through Hole - Solder
  • Connector Mounting Type Board Mount
  • Operating Temperature Range -55 – 125
  • Circuit Application Signal
  • Insulator Flammability Rating UL 94V-0
508-AG11D-ES DIP Sockets  1
  • Leg Style Straight
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Socket
  • Number of Positions 8
  • PCB Mount Orientation Vertical
  • Number of Rows 2
  • Contact Resistance 10
  • Insulation Resistance 5000
  • Connector Profile Standard
  • Sleeve Material Brass/Copper
  • Frame Style Closed
  • Sleeve Plating Material Tin/Lead
  • Contact Base Material Beryllium Copper
  • PCB Contact Termination Area Plating Material Tin-Lead
  • Contact Fabrication Stamped & Formed
  • Contact Mating Area Plating Material Gold
  • Contact Current Rating (Max) 3
  • Socket Style Standard
  • Mating Contact Type Four-Fingered
  • Socket Type DIP
  • Contact Type Pin
  • Termination Method to Printed Circuit Board Through Hole - Solder
  • Termination Post Length 3.18
  • PCB Mount Retention Without
  • Connector Mounting Type Board Mount
  • Mating Alignment Type Polarization
  • Mating Alignment With
  • Centerline (Pitch) 2.54
  • Housing Material Polyester
  • Height Above PC Board 3.43
  • Row-to-Row Spacing 7.62
  • Operating Temperature Range -55 – 125
  • Circuit Application Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Quantity 60
  • Tubes per Box 160
  • Packaging Method Box & Tube
  • Quantity per Tube 60
1-1571550-0 DIP Sockets  1
  • Leg Style Straight
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Socket
  • Number of Positions 32
  • PCB Mount Orientation Vertical
  • Number of Rows 2
  • Contact Resistance 10
  • Insulation Resistance 5000
  • Connector Profile Standard
  • Sleeve Material Brass/Copper
  • Color Black
  • Frame Style Closed
  • Sleeve Plating Material Tin
  • Contact Base Material Beryllium Copper
  • PCB Contact Termination Area Plating Material Tin
  • Contact Fabrication Screw Machine
  • Contact Mating Area Plating Material Tin
  • Contact Current Rating (Max) 3
  • Socket Style Standard
  • Mating Contact Type Four-Fingered
  • Socket Type DIP
  • Contact Type Pin
  • Termination Method to Printed Circuit Board Through Hole - Solder
  • Termination Post Length 3.18
  • PCB Mount Retention Without
  • Connector Mounting Type Board Mount
  • Mating Alignment Type Polarization
  • Mating Alignment With
  • Centerline (Pitch) 2.54
  • Housing Material Thermoplastic Polyester
  • Height Above PC Board 4.57
  • Row-to-Row Spacing 15.24
  • Operating Temperature Range -55 – 105
  • Circuit Application Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Quantity 15
  • Packaging Method Box & Tube