2041119-1 Mini PCI Express & mSATA  1
  • DRAM Type Standard
  • Connector System Board-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Row-to-Row Spacing .8
  • Connector Style Receptacle
  • Center Post Without
  • Product Type Connector
  • PCB Mount Orientation Horizontal
  • Module Orientation Right Angle
  • Stackable No
  • Number of Positions 52
  • Number of Keys 1
  • Number of Rows 2
  • Center Key None
  • DRAM Voltage 1.5
  • Ejector Location None
  • PCB Contact Termination Area Plating Material Gold Flash
  • Contact Underplating Material Nickel
  • Contact Base Material Copper Alloy
  • Contact Mating Area Plating Material Gold
  • Contact Current Rating (Max) .5
  • Insertion Style Cam-In
  • PCB Mount Retention Without
  • PCB Mounting Style Surface Mount
  • Boardlock Plating Material Tin
  • Mating Alignment Type Polarization
  • Centerline (Pitch) .8
  • Housing Material Thermoplastic
  • Housing Color Black
  • Stack Height 4
  • Operating Temperature Range -55 – 85
  • High Temperature Housing Yes
  • Circuit Application Signal
  • Bus Type Mini PCI Express
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tape & Reel
  • Packaging Quantity 650
1775838-2 Mini PCI Express & mSATA  1
  • DRAM Type Standard
  • Connector System Board-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Row-to-Row Spacing .8
  • Connector Style Receptacle
  • Center Post Without
  • Product Type Connector
  • PCB Mount Orientation Vertical
  • Module Orientation Right Angle
  • Stackable No
  • Number of Positions 52
  • Number of Keys 1
  • Number of Rows 2
  • Center Key None
  • DRAM Voltage 1.5
  • Ejector Location None
  • PCB Contact Termination Area Plating Material Gold Flash
  • Contact Underplating Material Nickel
  • Contact Base Material Copper Alloy
  • Contact Mating Area Plating Material Gold Flash
  • Contact Current Rating (Max) .5
  • Insertion Style Cam-In
  • PCB Mount Retention Without
  • PCB Mounting Style Surface Mount
  • Boardlock Plating Material Tin
  • Mating Alignment Type Polarization
  • Centerline (Pitch) .8
  • Housing Material Thermoplastic
  • Housing Color Black
  • Stack Height 5.6
  • Operating Temperature Range -55 – 85
  • High Temperature Housing Yes
  • Circuit Application Signal
  • Bus Type Mini PCI Express
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tape & Reel
  • Packaging Quantity 500
2041119-2 Mini PCI Express & mSATA  1
  • DRAM Type Standard
  • Connector System Board-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Row-to-Row Spacing .8
  • Connector Style Receptacle
  • Center Post Without
  • Product Type Connector
  • PCB Mount Orientation Horizontal
  • Module Orientation Right Angle
  • Stackable No
  • Number of Positions 52
  • Number of Keys 1
  • Number of Rows 2
  • Center Key None
  • DRAM Voltage 1.5
  • Ejector Location None
  • PCB Contact Termination Area Plating Material Gold Flash
  • Contact Underplating Material Nickel
  • Contact Base Material Copper Alloy
  • Contact Mating Area Plating Material Gold Flash
  • Contact Current Rating (Max) .5
  • Insertion Style Cam-In
  • PCB Mount Retention Without
  • PCB Mounting Style Surface Mount
  • Boardlock Plating Material Tin
  • Mating Alignment Type Polarization
  • Centerline (Pitch) .8
  • Housing Material Thermoplastic
  • Housing Color Black
  • Stack Height 4
  • Operating Temperature Range -55 – 85
  • High Temperature Housing Yes
  • Circuit Application Signal
  • Bus Type Mini PCI Express
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tape & Reel
  • Packaging Quantity 650
1717831-1 Mini PCI Express & mSATA
  • Connector System Board-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Row-to-Row Spacing 6.2
  • Boss Yes
  • Connector Style Receptacle
  • Product Type Connector
  • PCB Mount Orientation Horizontal
  • Module Orientation Right Angle
  • Stackable No
  • Number of Positions 52
  • Number of Keys 1
  • Number of Rows 2
  • Ejector Type Locking
  • Ejector Location Both Ends
  • PCB Contact Termination Area Plating Material Gold Flash
  • Contact Underplating Material Nickel
  • Contact Base Material Copper Alloy
  • Contact Mating Area Plating Material Gold Flash
  • Contact Current Rating (Max) .5
  • Insertion Style Cam-In
  • PCB Mount Retention Without
  • PCB Mounting Style Surface Mount
  • Boardlock Plating Material Tin
  • Mating Alignment Type Polarization
  • Centerline (Pitch) .8
  • Housing Material High Temperature Thermoplastic
  • Housing Color Black
  • Stack Height 4
  • Operating Temperature Range -55 – 85
  • High Temperature Housing Yes
  • Circuit Application Signal
  • Bus Type Mini PCI Express
  • UL Flammability Rating UL 94V-0
  • Packaging Method Box & Tray
  • Packaging Quantity 70
  • Comment Order Latch 1717832-1 separately.
1717831-2 Mini PCI Express & mSATA
  • Connector System Board-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Row-to-Row Spacing 6.2
  • Boss Yes
  • Connector Style Receptacle
  • Product Type Connector
  • PCB Mount Orientation Horizontal
  • Module Orientation Right Angle
  • Stackable No
  • Number of Positions 52
  • Number of Keys 1
  • Number of Rows 2
  • Ejector Type Locking
  • Ejector Location Both Ends
  • PCB Contact Termination Area Plating Material Gold Flash
  • Contact Underplating Material Nickel
  • Contact Base Material Copper Alloy
  • Contact Mating Area Plating Material Gold Flash
  • Contact Current Rating (Max) .5
  • Insertion Style Cam-In
  • PCB Mount Retention Without
  • PCB Mounting Style Surface Mount
  • Boardlock Plating Material Tin
  • Mating Alignment Type Polarization
  • Centerline (Pitch) .8
  • Housing Material High Temperature Thermoplastic
  • Housing Color Black
  • Stack Height 4
  • Operating Temperature Range -55 – 85
  • High Temperature Housing Yes
  • Circuit Application Signal
  • Bus Type Mini PCI Express
  • UL Flammability Rating UL 94V-0
  • Packaging Method Reel
  • Packaging Quantity 500
  • Comment Order Latch 1717832-2 separately.
1717832-2 Mini PCI Express & mSATA
  • DRAM Type Standard
  • Connector & Contact Terminates To Printed Circuit Board
  • Row-to-Row Spacing .8
  • Connector Style Receptacle
  • Center Post Without
  • Product Type Connector
  • Module Orientation Right Angle
  • Stackable No
  • Number of Positions 52
  • Number of Keys 1
  • Number of Rows 2
  • Center Key None
  • DRAM Voltage 1.5
  • Ejector Location None
  • PCB Contact Termination Area Plating Material Gold Flash
  • Contact Underplating Material Nickel
  • Contact Base Material Copper Alloy
  • Contact Mating Area Plating Material Tin
  • Insertion Style Direct Insert
  • PCB Mount Retention Without
  • PCB Mounting Style Surface Mount
  • Boardlock Plating Material Tin
  • Mating Alignment Type Polarization
  • Centerline (Pitch) .8
  • Housing Material Thermoplastic
  • Housing Color Black
  • Stack Height 4
  • Operating Temperature Range -55 – 85
  • High Temperature Housing Yes
  • Bus Type Mini PCI Express
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tin
  • Packaging Quantity 500
1827682-1 Mini PCI Express & mSATA
  • DRAM Type Standard
  • Connector & Contact Terminates To Printed Circuit Board
  • Row-to-Row Spacing .8
  • Connector Style Receptacle
  • Center Post Without
  • Product Type Connector
  • PCB Mount Orientation Horizontal
  • Module Orientation Right Angle
  • Stackable No
  • Number of Positions 52
  • Number of Keys 1
  • Number of Rows 2
  • Center Key None
  • DRAM Voltage 1.5
  • Ejector Location None
  • PCB Contact Termination Area Plating Material Gold Flash
  • Contact Underplating Material Nickel
  • Contact Base Material Copper Alloy
  • Contact Mating Area Plating Material Tin
  • Insertion Style Direct Insert
  • PCB Mount Retention Without
  • PCB Mounting Style Surface Mount
  • Boardlock Plating Material Tin
  • Mating Alignment Type Polarization
  • Centerline (Pitch) .8
  • Housing Material Thermoplastic
  • Housing Color Black
  • Stack Height 7
  • Operating Temperature Range -55 – 85
  • High Temperature Housing Yes
  • Bus Type Mini PCI Express
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tape & Reel
  • Packaging Quantity 300
1775862-2 Mini PCI Express & mSATA
  • DRAM Type Standard
  • Connector System Board-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Row-to-Row Spacing .8
  • Connector Style Receptacle
  • Center Post Without
  • Product Type Connector
  • PCB Mount Orientation Horizontal
  • Module Orientation Right Angle
  • Stackable No
  • Number of Positions 52
  • Number of Keys 1
  • Number of Rows 2
  • Center Key None
  • DRAM Voltage 1.5
  • Ejector Location None
  • PCB Contact Termination Area Plating Material Gold Flash
  • Contact Underplating Material Nickel
  • Contact Base Material Copper Alloy
  • Contact Mating Area Plating Material Gold Flash
  • Contact Current Rating (Max) .5
  • Insertion Style Cam-In
  • PCB Mount Retention Without
  • PCB Mounting Style Surface Mount
  • Boardlock Plating Material Tin
  • Mating Alignment Type Polarization
  • Centerline (Pitch) .8
  • Housing Material Thermoplastic
  • Housing Color Black
  • Stack Height 5.2
  • Operating Temperature Range -55 – 85
  • High Temperature Housing Yes
  • Circuit Application Signal
  • Bus Type Mini PCI Express
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tape & Reel
  • Packaging Quantity 550
2041262-1 Mini PCI Express & mSATA  1
  • DRAM Type Standard
  • Connector System Board-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Row-to-Row Spacing .8
  • Connector Style Receptacle
  • Center Post Without
  • Product Type Connector
  • PCB Mount Orientation Horizontal
  • Module Orientation Right Angle
  • Stackable No
  • Number of Positions 52
  • Number of Keys 1
  • Number of Rows 2
  • Center Key None
  • DRAM Voltage 1.5
  • Ejector Location None
  • PCB Contact Termination Area Plating Material Gold Flash
  • Contact Underplating Material Nickel
  • Contact Base Material Copper Alloy
  • Contact Mating Area Plating Material Gold Flash
  • Solder Tail Contact Plating Material Finish Bright
  • Contact Current Rating (Max) .5
  • Insertion Style Cam-In
  • PCB Mount Retention Without
  • PCB Mounting Style Surface Mount
  • Boardlock Plating Material Tin
  • Mating Alignment Type Polarization
  • Centerline (Pitch) .8
  • Housing Material Thermoplastic
  • Housing Color Black
  • Stack Height 6.8
  • Operating Temperature Range -55 – 85
  • High Temperature Housing Yes
  • Circuit Application Signal
  • Bus Type Mini PCI Express
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tape & Reel
  • Packaging Quantity 450
3-216446-1 RJ25 Connectors
  • Modular Jack & Plug Interface Type RJ25
  • Modular Jacks & Plugs Products RJ Type Jacks & Plugs
  • Connector Style Jack
  • Connector System Cable-to-Board
  • Grounding Options None
  • Connector & Contact Terminates To Printed Circuit Board
  • Connectors & Connector Components Type Connector
  • Status Indicator None
  • Port Configuration Single Port
  • Port Matrix Configuration 1 x 1
  • Connector Contact Density Standard
  • PCB Mount Orientation Vertical
  • Number of Positions 6
  • Keyed No
  • Profile Low
  • Latch Orientation Standard - Latch Down
  • Contact Underplating Material Nickel
  • Contact Base Material Phosphor Bronze
  • Contact Mating Area Plating Material Gold over Nickel
  • Contact Current Rating (Max) 1.5
  • PCB Contact Termination Area Plating Material Tin-Lead
  • Connector Product Type Connector Assembly
  • Termination Method to Printed Circuit Board Through Hole - Solder
  • Connector Mounting Type Board Mount
  • Panel Mount Feature With
  • Entry Location Bottom
  • Housing Color Black
  • Housing Material Nylon
  • Centerline (Pitch) 1.02
  • Connector Height 12
  • PCB Tail Length 2.79
  • PCB Thickness (Recommended) 1.6
  • Operating Temperature Range -40 – 70
  • Shielded No
  • Circuit Application Signal
  • Performance Category Cat 3
  • UL Flammability Rating UL 94V-HB
  • Packaging Method Loose Piece
  • Packaging Quantity 1000
  • Comment True positioning of the solder tines may be affected by bulk packaging. Solder stop could be loosened during transport.