2134439-2 IC Socket Hardware  1
  • Accessory Type ILM Assembly
  • Product Type Accessory
  • Frame Style Wide
  • Spring Plate Assembly Material Stainless Steel
  • Top Support Plate Material Stainless Steel
  • Insulator Material Polycarbonate Film Plus Acrylic Adhesive Layer
  • Socket Type LGA 2011
  • Operating Temperature Range -25 – 100
  • Packaging Method Bag/Box
  • Comment Wide Type with Cover.
2229339-2 IC Socket Hardware  1
  • Accessory Type ILM Assembly
  • Product Type Accessory
  • Spring Plate Assembly Material Stainless Steel
  • Top Support Plate Material Stainless Steel
  • Socket Type LGA 2011
  • Operating Temperature Range -25 – 100
  • Packaging Method Box & Tray
1554653-1 LGA Sockets  1
  • Connector System Board-to-Board
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Socket
  • Number of Positions 2011
  • Grid Spacing 1.016 x .8814
  • Plating Material Gold
  • Frame Style Square
  • Plating Thickness 15
  • Contact Base Material Copper Alloy
  • Socket Type LGA 2011
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness 15
  • Contact Current Rating (Max) .5
  • PCB Mounting Style Surface Mount Solder Ball
  • Connector Mounting Type Board Mount
  • Heat Sink Attachment Without
  • Centerline (Pitch) 1.016
  • Housing Color Black
  • Housing Material High Temperature Thermoplastic
  • Operating Temperature Range -25 – 100
  • Circuit Application Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tray
  • Tray Color Blue
  • Comment Lead-Free Solderball
2134440-1 IC Socket Hardware  1
  • Accessory Type Backplate
  • Product Type Accessory
  • Plating Material Nickel
  • Backplate Material Steel
  • Spring Plate Assembly Material Stainless Steel
  • Top Support Plate Material Stainless Steel
  • Insulator Material Polycarbonate Film Plus Acrylic Adhesive Layer
  • Socket Type LGA 2011
  • Operating Temperature Range -25 – 100
  • Packaging Method Bag/Box
2201838-2 LGA Sockets  1
  • Connector System Board-to-Board
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Socket
  • Number of Positions 2011
  • Grid Spacing 1.016 x .8814
  • Plating Material Gold
  • Frame Style Square
  • Plating Thickness 30
  • Contact Base Material Copper Alloy
  • Socket Type LGA 2011
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness 30
  • Contact Current Rating (Max) .5
  • PCB Mounting Style Surface Mount Solder Ball
  • Connector Mounting Type Board Mount
  • Heat Sink Attachment Without
  • Centerline (Pitch) 1.016
  • Housing Color Black
  • Housing Material High Temperature Thermoplastic
  • Operating Temperature Range -25 – 100
  • Circuit Application Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tray
  • Tray Color Black
  • Comment Lead-Free Solderball
2201838-1 LGA Sockets  1
  • Connector System Board-to-Board
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Socket
  • Number of Positions 2011
  • Grid Spacing 1.016 x .8814
  • Plating Material Gold
  • Frame Style Square
  • Plating Thickness 15
  • Contact Base Material Copper Alloy
  • Socket Type LGA 2011
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness 15
  • Contact Current Rating (Max) .5
  • PCB Mounting Style Surface Mount Solder Ball
  • Connector Mounting Type Board Mount
  • Heat Sink Attachment Without
  • Centerline (Pitch) 1.016
  • Housing Color Black
  • Housing Material High Temperature Thermoplastic
  • Operating Temperature Range -25 – 100
  • Circuit Application Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tray
  • Tray Color Black
  • Comment Lead-Free Solderball
2229339-1 IC Socket Hardware  1
  • Accessory Type ILM Assembly
  • Product Type Accessory
  • Spring Plate Assembly Material Stainless Steel
  • Top Support Plate Material Stainless Steel
  • Socket Type LGA 2011
  • Operating Temperature Range -25 – 100
  • Packaging Method Box & Tray
2013883-4 IC Socket Hardware
  • Accessory Type Backplate
  • Product Type Accessory
  • Plating Material Nickel
  • Backplate Material Steel
  • Spring Plate Assembly Material Stainless Steel
  • Top Support Plate Material Stainless Steel
  • Insulator Material Polycarbonate Film Plus Acrylic Adhesive Layer
  • Socket Type LGA 1156
  • Operating Temperature Range -25 – 100
  • Packaging Method Bag/Box
2013883-2 IC Socket Hardware
  • Accessory Type Backplate
  • Product Type Accessory
  • Plating Material Nickel
  • Backplate Material Steel
  • Spring Plate Assembly Material Stainless Steel
  • Top Support Plate Material Stainless Steel
  • Insulator Material Polycarbonate Film Plus Acrylic Adhesive Layer
  • Socket Type LGA 1156
  • Operating Temperature Range -25 – 100
  • Packaging Method Bag/Box
2013884-1 IC Socket Hardware
  • Accessory Type Shoulder Screw
  • Product Type Accessory
  • Spring Plate Assembly Material Stainless Steel
  • Top Support Plate Material Stainless Steel
  • Socket Type LGA 1156
  • Operating Temperature Range -25 – 100
  • Packaging Method Bag/Box
2134440-3 LGA Sockets  1
  • Product Type Hardware
  • Plating Material Nickel Plating
  • Frame Style Square
  • Contact Base Material Carbon Steel
  • Socket Type LGA 2011
  • Contact Mating Area Plating Material Nickel Plating
  • Heat Sink Attachment Without
  • Operating Temperature Range -25 – 100
  • UL Flammability Rating UL 94V-0
  • Packaging Method Soft Tray
  • Tray Color White
2134928-1 LGA Sockets  1
  • Connector System Board-to-Board
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Socket
  • Number of Positions 1150
  • Grid Spacing .914 x .914
  • Plating Material Gold
  • Frame Style Square
  • Plating Thickness 15
  • Contact Base Material Copper Alloy
  • Socket Type LGA 1150
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness 15
  • Contact Current Rating (Max) .5
  • PCB Mounting Style Surface Mount Solder Ball
  • Connector Mounting Type Board Mount
  • Heat Sink Attachment Without
  • Centerline (Pitch) .9144
  • Housing Color Black
  • Housing Material High Temperature Thermoplastic
  • Operating Temperature Range -25 – 100
  • Circuit Application Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Method Bag
  • Tray Color Black
  • Comment Lead-Free Solderball
2069965-1 LGA Sockets  1
  • Connector System Board-to-Board
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Socket
  • Number of Positions 1155
  • Grid Spacing .914 x .914
  • Plating Material Gold
  • Frame Style Square
  • Plating Thickness 15
  • Contact Base Material Copper Alloy
  • Socket Type LGA 1155
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness 15
  • Contact Current Rating (Max) .5
  • PCB Mounting Style Surface Mount Solder Ball
  • Connector Mounting Type Board Mount
  • Heat Sink Attachment Without
  • Centerline (Pitch) .9144
  • Housing Color Black
  • Housing Material High Temperature Thermoplastic
  • Operating Temperature Range -25 – 100
  • Circuit Application Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tray
  • Tray Color Black
  • Comment Lead-Free Solderball
1-1554653-1 LGA Sockets  1
  • Connector System Board-to-Board
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Socket
  • Number of Positions 2011
  • Grid Spacing 1.016 x .8814
  • Plating Material Gold
  • Frame Style Square
  • Plating Thickness 30
  • Contact Base Material Copper Alloy
  • Socket Type LGA 2011
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness 30
  • Contact Current Rating (Max) .5
  • PCB Mounting Style Surface Mount Solder Ball
  • Connector Mounting Type Board Mount
  • Heat Sink Attachment Without
  • Centerline (Pitch) 1.016
  • Housing Color Black
  • Housing Material High Temperature Thermoplastic
  • Operating Temperature Range -25 – 100
  • Circuit Application Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tray
  • Tray Color Blue
  • Comment Lead-Free Solderball
1-2134784-1 IC Socket Covers
  • Accessory Type Dust Cover
  • Product Type Accessory
  • PQFP Type Standard
  • Cover Material Polycarbonate
  • Color Black
  • Socket Type LGA 2011
  • Operating Temperature Range -25 – 100
  • Cover Flammability Rating UL 94V-0
  • Packaging Method Bag
2013882-1 IC Socket Hardware
  • Accessory Type ILM Assembly
  • Product Type Accessory
  • Spring Plate Assembly Material Stainless Steel
  • Top Support Plate Material Stainless Steel
  • Socket Type LGA 115X
  • Operating Temperature Range -25 – 100
  • Packaging Method Bag/Box
2040979-1 IC Socket Hardware
  • Accessory Type ILM Screw
  • Product Type Accessory
  • Spring Plate Assembly Material Stainless Steel
  • Top Support Plate Material Stainless Steel
  • Socket Type LGA 1156
  • Operating Temperature Range -25 – 100
  • Packaging Method Bag/Box
2134928-2 LGA Sockets
  • Connector System Board-to-Board
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Socket
  • Number of Positions 1150
  • Grid Spacing .914 x .914
  • Plating Material Gold
  • Frame Style Square
  • Plating Thickness 4
  • Contact Base Material Copper Alloy
  • Socket Type LGA 1150
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness 4
  • Contact Current Rating (Max) .5
  • PCB Mounting Style Surface Mount Solder Ball
  • Connector Mounting Type Board Mount
  • Heat Sink Attachment Without
  • Centerline (Pitch) .9144
  • Housing Color Black
  • Housing Material High Temperature Thermoplastic
  • Operating Temperature Range -25 – 100
  • Circuit Application Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Method Bag
  • Tray Color Black
  • Comment Lead-Free Solderball
1-2229348-1 LGA Sockets
  • Product Type Accessory
  • Number of Positions 2011
  • Grid Spacing 1.016 x .8814
  • Plating Material Gold
  • Frame Style Square
  • Contact Base Material Copper Alloy
  • Socket Type LGA 2011
  • Contact Mating Area Plating Material No Plating
  • PCB Mounting Style Surface Mount Solder Ball
  • Heat Sink Attachment Without
  • Housing Color Without
  • Housing Material High Temperature Thermoplastic
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tray
  • Tray Color Black
  • Comment Lead-Free Solderball
2013882-2 IC Socket Hardware
  • Accessory Type ILM Assembly with Screws
  • Product Type Accessory
  • Spring Plate Assembly Material Stainless Steel
  • Top Support Plate Material Stainless Steel
  • Socket Type LGA 115X
  • Operating Temperature Range -25 – 100
  • Packaging Method Bag/Box