
PRODUCT
- MOD 1 CONTACT 182198-1
- Applied Pressure High
- Connector System Board-to-Board
- Connector & Contact Terminates To Wire & Cable
- Contact Base Material Phosphor Bronze
- PCB Contact Termination Area Plating Material Tin
- Contact Mating Area Plating Material Thickness .762
- PCB Contact Termination Area Plating Material Thickness .762
- Contact Type Socket
- Contact Mating Area Plating Material Tin
- Contact Orientation Straight
- Contact Current Rating (Max) 5
- PCB Mount Retention Without
- Wire Insulation Support With
- Connector Mounting Type Board Mount
- Centerline (Pitch) 3.81
- Accepts Wire Insulation Diameter Range 1.8 – 2.3
- Wire Size 22 – 18
- Wire Size .3 – .9
- Operating Temperature Range -40 – 105
- Circuit Application Signal
- Packaging Method Loose Piece
- Packaging Quantity 2000

PRODUCT
- MOD I RECP STMPD 102099-5
- Applied Pressure Standard
- Connector System Board-to-Board
- Connector & Contact Terminates To Wire & Cable
- Contact Resistance 12
- Insulation Resistance 5000
- Dielectric Withstanding Voltage (Max) 1200
- Contact Base Material Phosphor Bronze
- PCB Contact Termination Area Plating Material Tin
- Contact Mating Area Plating Material Thickness .4064
- PCB Contact Termination Area Plating Material Thickness .4064
- Contact Type Socket
- Contact Mating Area Plating Material Tin
- Contact Orientation Straight
- Contact Current Rating (Max) 5
- PCB Mount Retention Without
- Wire Insulation Support With
- Connector Mounting Type Board Mount
- Centerline (Pitch) 3.81
- Accepts Wire Insulation Diameter Range 1.3 – 2.29
- Wire Size 22 – 18
- Wire Size .3 – .9
- Operating Temperature Range -65 – 105
- Circuit Application Signal
- Packaging Method Reel
- Packaging Quantity 5000
- Comment Applicators also available for AMPOMATOR Lead Making Machines and Stripper/Crimper Machines. Consult AMP, Inc.

PRODUCT
- TANDEM SPR.REC.F 166722-1
- Applied Pressure Standard
- Connector System Cable-to-Cable
- Sealable No
- Connector & Contact Terminates To Wire & Cable
- Contact Base Material Phosphor Bronze
- PCB Contact Termination Area Plating Material Tin-Lead
- Contact Mating Area Plating Material Thickness .8
- Contact Type Socket
- Contact Mating Area Plating Material Gold
- Contact Orientation Straight
- Contact Current Rating (Max) 3
- Termination Method to Wire & Cable Crimp
- PCB Mount Retention Without
- Wire Insulation Support With
- Connector Mounting Type Cable Mount (Free-Hanging)
- Accepts Wire Insulation Diameter Range .91 – 1.37
- Wire Size 24 – 20
- Wire Size .21 – .51
- Operating Temperature Range -65 – 105
- Circuit Application Power & Signal
- Packaging Method Loose Piece
- Packaging Quantity 200

PRODUCT
- TANDEM-SPRING BU 167042-1
- Applied Pressure Standard
- Connector System Cable-to-Cable
- Sealable No
- Connector & Contact Terminates To Wire & Cable
- Contact Base Material Phosphor Bronze
- PCB Contact Termination Area Plating Material Tin-Lead
- Contact Mating Area Plating Material Thickness .8
- Contact Type Socket
- Contact Mating Area Plating Material Gold
- Contact Orientation Straight
- Contact Current Rating (Max) 3
- Termination Method to Wire & Cable Crimp
- PCB Mount Retention Without
- Wire Insulation Support With
- Connector Mounting Type Cable Mount (Free-Hanging)
- Accepts Wire Insulation Diameter Range .5 – 1.02
- Wire Size 32 – 28
- Wire Size .03 – .09
- Operating Temperature Range -65 – 105
- Circuit Application Power & Signal
- Packaging Method Loose Piece
- Packaging Quantity 200

PRODUCT
- MOD I CONT STRIP 280621-2
- Applied Pressure Standard
- Connector System Board-to-Board
- Connector & Contact Terminates To Wire & Cable
- Contact Base Material Phosphor Bronze
- PCB Contact Termination Area Plating Material Gold Flash
- Contact Mating Area Plating Material Thickness .4
- Contact Type Socket
- Contact Mating Area Plating Material Gold
- Contact Orientation Straight
- Contact Current Rating (Max) 5
- PCB Mount Retention Without
- Wire Insulation Support With
- Connector Mounting Type Board Mount
- Centerline (Pitch) 3.81
- Accepts Wire Insulation Diameter Range 1.8 – 2.3
- Wire Size 22 – 18
- Wire Size .3 – .9
- Operating Temperature Range -40 – 105
- Circuit Application Signal
- Packaging Method Package
- Packaging Quantity 5000

PRODUCT
- MODU I REC. 281423-1
- Applied Pressure High
- Connector System Board-to-Board
- Connector & Contact Terminates To Wire & Cable
- Contact Base Material Phosphor Bronze
- PCB Contact Termination Area Plating Material Tin
- Contact Mating Area Plating Material Thickness .8
- PCB Contact Termination Area Plating Material Thickness .8
- Contact Type Socket
- Contact Mating Area Plating Material Tin
- Contact Orientation Straight
- Contact Current Rating (Max) 5
- PCB Mount Retention Without
- Wire Insulation Support With
- Connector Mounting Type Board Mount
- Centerline (Pitch) 3.81
- Accepts Wire Insulation Diameter Range 2.2 – 2.8
- Wire Size 20 – 17
- Wire Size .5 – 1
- Operating Temperature Range -40 – 105
- Circuit Application Signal
- Packaging Method Reel
- Packaging Quantity 5000

PRODUCT
- BIF-LEAF CONT CR/SNAP SN/BR 3-61668-1
- Connector System Wire-to-Board
- Connector & Contact Terminates To Wire & Cable
- Contact Base Material Brass
- PCB Contact Termination Area Plating Material Tin
- Contact Underplating Material Nickel
- Contact Mating Area Plating Material Thickness 2.032 – 5.08
- PCB Contact Termination Area Plating Material Thickness 2.032 – 5.08
- Contact Type Hermaphroditic
- Contact Mating Area Plating Material Tin
- Contact Orientation Straight
- Contact Current Rating (Max) 6
- Termination Method to Wire & Cable Crimp
- PCB Mount Retention Without
- Wire Insulation Support With
- Contact Retention Type Within Housing Snap-In
- Connector Mounting Type Board Mount
- Accepts Wire Insulation Diameter Range 2.79
- Wire Size 24 – 18
- Wire Size .2 – .8
- Operating Temperature Range -55 – 105
- Circuit Application Signal
- Packaging Method Reel
- Packaging Quantity 6000

PRODUCT
- AMPMODU CONT. 280702-1
- Applied Pressure High
- Connector System Board-to-Board
- Connector & Contact Terminates To Wire & Cable
- Contact Base Material Phosphor Bronze
- PCB Contact Termination Area Plating Material Tin
- Contact Mating Area Plating Material Thickness .8
- PCB Contact Termination Area Plating Material Thickness .8
- Contact Type Socket
- Contact Mating Area Plating Material Tin
- Contact Orientation Straight
- Contact Current Rating (Max) 5
- PCB Mount Retention Without
- Wire Insulation Support With
- Connector Mounting Type Board Mount
- Centerline (Pitch) 3.81
- Accepts Wire Insulation Diameter Range 1.8 – 2.3
- Wire Size 22 – 18
- Wire Size .3 – .9
- Operating Temperature Range -40 – 105
- Circuit Application Signal
- Packaging Method Reel
- Packaging Quantity 5000

PRODUCT
- BIF-LEAF CONT AUPHBZ LP 24-18 350011-2
- Connector System Wire-to-Board
- Connector & Contact Terminates To Wire & Cable
- Contact Base Material Phosphor Bronze
- PCB Contact Termination Area Plating Material Nickel
- Contact Mating Area Plating Material Thickness .762
- Contact Type Hermaphroditic
- Contact Mating Area Plating Material Gold
- Contact Orientation Straight
- Contact Current Rating (Max) 6
- Termination Method to Wire & Cable Crimp
- PCB Mount Retention Without
- Wire Insulation Support With
- Contact Retention Type Within Housing Snap-In
- Connector Mounting Type Board Mount
- Accepts Wire Insulation Diameter Range 2.54
- Wire Size 24 – 18
- Wire Size .2 – .8
- Operating Temperature Range -55 – 105
- Circuit Application Signal
- Packaging Method Loose Piece
- Packaging Quantity 1000

PRODUCT
- BIF-LEAF CONT CR/SNAP PTPPHBZ 61668-2
- Connector System Wire-to-Board
- Connector & Contact Terminates To Wire & Cable
- Contact Base Material Phosphor Bronze
- PCB Contact Termination Area Plating Material Pre-Tin
- Contact Type Hermaphroditic
- Contact Mating Area Plating Material Pre-Tin
- Contact Orientation Straight
- Contact Current Rating (Max) 6
- Termination Method to Wire & Cable Crimp
- PCB Mount Retention Without
- Wire Insulation Support With
- Contact Retention Type Within Housing Snap-In
- Connector Mounting Type Board Mount
- Accepts Wire Insulation Diameter Range 2.79
- Wire Size 24 – 18
- Wire Size .2 – .8
- Operating Temperature Range -55 – 105
- Circuit Application Signal
- Packaging Method Box
- Packaging Quantity 6000

PRODUCT
- BIF-LEAF CONT CR/SNAP AUPHBZ 61668-4
- Connector System Wire-to-Board
- Connector & Contact Terminates To Wire & Cable
- Contact Base Material Phosphor Bronze
- PCB Contact Termination Area Plating Material Nickel
- Contact Mating Area Plating Material Thickness .762
- PCB Contact Termination Area Plating Material Thickness .762
- Contact Type Hermaphroditic
- Contact Mating Area Plating Material Gold
- Contact Orientation Straight
- Contact Current Rating (Max) 6
- Termination Method to Wire & Cable Crimp
- PCB Mount Retention Without
- Wire Insulation Support With
- Contact Retention Type Within Housing Snap-In
- Connector Mounting Type Board Mount
- Accepts Wire Insulation Diameter Range 2.79
- Wire Size 24 – 18
- Wire Size .2 – .8
- Operating Temperature Range -55 – 105
- Circuit Application Signal
- Packaging Method Package
- Packaging Quantity 6000

PRODUCT
- MOD I POST LP 1-86182-5
- Connector & Contact Terminates To Printed Circuit Board
- Contact Resistance 12
- Insulation Resistance 5000
- Dielectric Withstanding Voltage (Max) 1200
- Contact Base Material Brass
- PCB Contact Termination Area Plating Material Gold
- Contact Underplating Material Nickel
- Contact Type Pin
- Contact Mating Area Plating Material Gold
- Contact Orientation Straight
- Contact Current Rating (Max) 5
- Contact Mating Area Length 9.65
- Termination Post & Tail Length 8.13
- Wire Insulation Support Without
- Operating Temperature Range -65 – 105
- Packaging Method Loose Piece
- Packaging Quantity 1000
- Comment Minimum nominal centerline spacing between adjacent contacts is .125.

PRODUCT
- MOD I RECP PLTD 30 SEL 102100-2
- Applied Pressure High
- Connector System Board-to-Board
- Connector & Contact Terminates To Wire & Cable
- Contact Resistance 12
- Insulation Resistance 5000
- Dielectric Withstanding Voltage (Max) 1200
- Contact Base Material Phosphor Bronze
- PCB Contact Termination Area Plating Material Gold Flash
- Contact Mating Area Plating Material Thickness .762
- Contact Type Socket
- Contact Mating Area Plating Material Gold
- Contact Orientation Straight
- Contact Current Rating (Max) 5
- PCB Mount Retention Without
- Wire Insulation Support With
- Connector Mounting Type Board Mount
- Centerline (Pitch) 3.81
- Accepts Wire Insulation Diameter Range 1.3 – 2.29
- Wire Size 22 – 18
- Wire Size .3 – .9
- Operating Temperature Range -65 – 105
- Circuit Application Signal
- Packaging Method Reel
- Packaging Quantity 5000
- Comment Applicators also available for AMPOMATOR Lead Making Machines and Stripper/Crimper Machines. Consult AMP, Inc.

PRODUCT
- MOD I RECP STMPD 102100-5
- Applied Pressure High
- Connector System Board-to-Board
- Connector & Contact Terminates To Wire & Cable
- Contact Resistance 12
- Insulation Resistance 5000
- Dielectric Withstanding Voltage (Max) 1200
- Contact Base Material Phosphor Bronze
- PCB Contact Termination Area Plating Material Tin
- Contact Mating Area Plating Material Thickness .4064
- PCB Contact Termination Area Plating Material Thickness .4064
- Contact Type Socket
- Contact Mating Area Plating Material Tin
- Contact Orientation Straight
- Contact Current Rating (Max) 5
- PCB Mount Retention Without
- Wire Insulation Support With
- Connector Mounting Type Board Mount
- Centerline (Pitch) 3.81
- Accepts Wire Insulation Diameter Range 1.3 – 2.29
- Wire Size 22 – 18
- Wire Size .3 – .9
- Operating Temperature Range -65 – 105
- Circuit Application Signal
- Packaging Method Reel
- Packaging Quantity 5000
- Comment Applicators also available for AMPOMATOR Lead Making Machines and Stripper/Crimper Machines. Consult AMP, Inc.

PRODUCT
- MOD I POST PLTD SN 3-86147-7
- Connector & Contact Terminates To Printed Circuit Board
- Contact Resistance 12
- Insulation Resistance 5000
- Dielectric Withstanding Voltage (Max) 1200
- Contact Base Material Brass
- PCB Contact Termination Area Plating Material Tin-Lead
- Contact Mating Area Plating Material Finish Bright
- Contact Type Pin
- Contact Mating Area Plating Material Tin-Lead
- Contact Orientation Straight
- Contact Current Rating (Max) 5
- Contact Mating Area Length 10.16
- Termination Post & Tail Length 3.18
- Operating Temperature Range -65 – 60
- Packaging Method Strip
- Packaging Quantity 20000
- Comment Minimum nominal centerline spacing between adjacent contacts is .125.

PRODUCT
- T/SPRING LP 5531216-2
- Connector System Cable-to-Cable
- Sealable No
- Connector & Contact Terminates To Wire & Cable
- Contact Base Material Phosphor Bronze
- PCB Contact Termination Area Plating Material Tin
- Contact Mating Area Plating Material Thickness .762
- PCB Contact Termination Area Plating Material Thickness 1.27
- Contact Type Socket
- Contact Mating Area Plating Material Gold
- Contact Orientation Straight
- Contact Current Rating (Max) 3
- Termination Method to Wire & Cable Crimp
- PCB Mount Retention Without
- Wire Insulation Support With
- Connector Mounting Type Cable Mount (Free-Hanging)
- Wire Size 26 – 22
- Wire Size .12 – .4
- Operating Temperature Range -65 – 105
- Circuit Application Signal
- Packaging Method Loose Piece
- Packaging Quantity 500

PRODUCT
- AMP-0-0086432-1 86432-1
- Applied Pressure High
- Connector System Board-to-Board
- Connector & Contact Terminates To Printed Circuit Board
- Contact Resistance 12
- Insulation Resistance 5000
- Dielectric Withstanding Voltage (Max) 1200
- Printed Circuit Board Hole Shape Round
- Contact Base Material Phosphor Bronze
- PCB Contact Termination Area Plating Material Tin
- Contact Mating Area Plating Material Thickness 2.0066
- PCB Contact Termination Area Plating Material Thickness 2.0066
- Contact Type Socket
- Contact Mating Area Plating Material Tin
- Contact Orientation Horizontal
- Contact Current Rating (Max) 5
- Termination Post & Tail Length 3.68
- PCB Mount Retention Without
- Wire Insulation Support Without
- Connector Mounting Type Board Mount
- Mating Entry Location Side
- Centerline (Pitch) 3.81
- PCB Thickness (Recommended) 1.4 – 2.62
- Operating Temperature Range -65 – 105
- Circuit Application Signal
- Packaging Method Reel
- Packaging Quantity 5000

PRODUCT
- MOD IV L.P. 102437-1
- Applied Pressure Standard
- Connector & Contact Terminates To Wire & Cable
- Operating Voltage 250
- Insulation Resistance 5000
- Termination Resistance 12
- PCB Contact Termination Area Plating Material Tin-Lead
- Contact Underplating Material Nickel
- Contact Mating Area Plating Material Thickness .381
- PCB Contact Termination Area Plating Material Thickness 2.54 – 5.08
- Contact Type Socket
- Contact Mating Area Plating Material Gold
- Contact Orientation Straight
- Contact Current Rating (Max) 3
- Termination Method to Wire & Cable Crimp
- PCB Mount Retention Without
- Wire Insulation Support Without
- Accepts Wire Insulation Diameter Range 1.75
- Wire Size 24 – 20
- Wire Size .2 – .6
- Operating Temperature Range -65 – 125
- Circuit Application Signal
- Packaging Method Loose Piece
- Packaging Quantity 5000

PRODUCT
- HDI KEYING POWER PIN PLTD 533082-4
- Connector System Cable-to-Board
- Sealable No
- Connector & Contact Terminates To Printed Circuit Board
- Contact Base Material Brass
- PCB Contact Termination Area Plating Material Gold
- PCB Contact Termination Area Plating Material Thickness .76
- Contact Type Pin
- Contact Mating Area Plating Material Gold
- Contact Orientation Straight
- Contact Current Rating (Max) 3
- Termination Method to Printed Circuit Board Through Hole - Screw
- PCB Mount Retention Without
- Wire Insulation Support Without
- Connector Mounting Type Board Mount
- Thread Length 9.52
- Operating Temperature Range -65 – 125
- Circuit Application Signal
- Packaging Method Carton
- Packaging Quantity 1000

PRODUCT
- T/SPRING LP 5531216-4
- Connector System Cable-to-Cable
- Sealable No
- Connector & Contact Terminates To Wire & Cable
- Contact Base Material Phosphor Bronze
- PCB Contact Termination Area Plating Material Tin
- Contact Mating Area Plating Material Thickness 1.27
- PCB Contact Termination Area Plating Material Thickness 1.27
- Contact Type Socket
- Contact Mating Area Plating Material Gold
- Contact Orientation Straight
- Contact Current Rating (Max) 3
- Termination Method to Wire & Cable Crimp
- PCB Mount Retention Without
- Wire Insulation Support With
- Connector Mounting Type Cable Mount (Free-Hanging)
- Wire Size 26 – 22
- Wire Size .12 – .4
- Operating Temperature Range -65 – 105
- Circuit Application Signal
- Packaging Method Loose Piece
- Packaging Quantity 500