182198-1 Board-to-Board Connector Contacts
PRODUCT
  1. Connectors
  2. Board-to-Board Connector Contacts
  1. MOD 1 CONTACT 182198-1
active
  • Applied Pressure High
  • Connector System Board-to-Board
  • Connector & Contact Terminates To Wire & Cable
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin
  • Contact Mating Area Plating Material Thickness .762
  • PCB Contact Termination Area Plating Material Thickness .762
  • Contact Type Socket
  • Contact Mating Area Plating Material Tin
  • Contact Orientation Straight
  • Contact Current Rating (Max) 5
  • PCB Mount Retention Without
  • Wire Insulation Support With
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) 3.81
  • Accepts Wire Insulation Diameter Range 1.8 – 2.3
  • Wire Size 22 – 18
  • Wire Size .3 – .9
  • Operating Temperature Range -40 – 105
  • Circuit Application Signal
  • Packaging Method Loose Piece
  • Packaging Quantity 2000
102099-5 Board-to-Board Connector Contacts
PRODUCT
  1. Connectors
  2. Board-to-Board Connector Contacts
  1. MOD I RECP STMPD 102099-5
active
  • Applied Pressure Standard
  • Connector System Board-to-Board
  • Connector & Contact Terminates To Wire & Cable
  • Contact Resistance 12
  • Insulation Resistance 5000
  • Dielectric Withstanding Voltage (Max) 1200
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin
  • Contact Mating Area Plating Material Thickness .4064
  • PCB Contact Termination Area Plating Material Thickness .4064
  • Contact Type Socket
  • Contact Mating Area Plating Material Tin
  • Contact Orientation Straight
  • Contact Current Rating (Max) 5
  • PCB Mount Retention Without
  • Wire Insulation Support With
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) 3.81
  • Accepts Wire Insulation Diameter Range 1.3 – 2.29
  • Wire Size 22 – 18
  • Wire Size .3 – .9
  • Operating Temperature Range -65 – 105
  • Circuit Application Signal
  • Packaging Method Reel
  • Packaging Quantity 5000
  • Comment Applicators also available for AMPOMATOR Lead Making Machines and Stripper/Crimper Machines. Consult AMP, Inc.
166722-1 Board-to-Board Connector Contacts 1
PRODUCT
  1. Connectors
  2. Board-to-Board Connector Contacts
  1. TANDEM SPR.REC.F 166722-1
active
  • Applied Pressure Standard
  • Connector System Cable-to-Cable
  • Sealable No
  • Connector & Contact Terminates To Wire & Cable
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin-Lead
  • Contact Mating Area Plating Material Thickness .8
  • Contact Type Socket
  • Contact Mating Area Plating Material Gold
  • Contact Orientation Straight
  • Contact Current Rating (Max) 3
  • Termination Method to Wire & Cable Crimp
  • PCB Mount Retention Without
  • Wire Insulation Support With
  • Connector Mounting Type Cable Mount (Free-Hanging)
  • Accepts Wire Insulation Diameter Range .91 – 1.37
  • Wire Size 24 – 20
  • Wire Size .21 – .51
  • Operating Temperature Range -65 – 105
  • Circuit Application Power & Signal
  • Packaging Method Loose Piece
  • Packaging Quantity 200
167042-1 Board-to-Board Connector Contacts 1
PRODUCT
  1. Connectors
  2. Board-to-Board Connector Contacts
  1. TANDEM-SPRING BU 167042-1
active
  • Applied Pressure Standard
  • Connector System Cable-to-Cable
  • Sealable No
  • Connector & Contact Terminates To Wire & Cable
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin-Lead
  • Contact Mating Area Plating Material Thickness .8
  • Contact Type Socket
  • Contact Mating Area Plating Material Gold
  • Contact Orientation Straight
  • Contact Current Rating (Max) 3
  • Termination Method to Wire & Cable Crimp
  • PCB Mount Retention Without
  • Wire Insulation Support With
  • Connector Mounting Type Cable Mount (Free-Hanging)
  • Accepts Wire Insulation Diameter Range .5 – 1.02
  • Wire Size 32 – 28
  • Wire Size .03 – .09
  • Operating Temperature Range -65 – 105
  • Circuit Application Power & Signal
  • Packaging Method Loose Piece
  • Packaging Quantity 200
280621-2 Board-to-Board Connector Contacts
PRODUCT
  1. Connectors
  2. Board-to-Board Connector Contacts
  1. MOD I CONT STRIP 280621-2
active
  • Applied Pressure Standard
  • Connector System Board-to-Board
  • Connector & Contact Terminates To Wire & Cable
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Gold Flash
  • Contact Mating Area Plating Material Thickness .4
  • Contact Type Socket
  • Contact Mating Area Plating Material Gold
  • Contact Orientation Straight
  • Contact Current Rating (Max) 5
  • PCB Mount Retention Without
  • Wire Insulation Support With
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) 3.81
  • Accepts Wire Insulation Diameter Range 1.8 – 2.3
  • Wire Size 22 – 18
  • Wire Size .3 – .9
  • Operating Temperature Range -40 – 105
  • Circuit Application Signal
  • Packaging Method Package
  • Packaging Quantity 5000
281423-1 Board-to-Board Connector Contacts
PRODUCT
  1. Connectors
  2. Board-to-Board Connector Contacts
  1. MODU I REC. 281423-1
active
  • Applied Pressure High
  • Connector System Board-to-Board
  • Connector & Contact Terminates To Wire & Cable
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin
  • Contact Mating Area Plating Material Thickness .8
  • PCB Contact Termination Area Plating Material Thickness .8
  • Contact Type Socket
  • Contact Mating Area Plating Material Tin
  • Contact Orientation Straight
  • Contact Current Rating (Max) 5
  • PCB Mount Retention Without
  • Wire Insulation Support With
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) 3.81
  • Accepts Wire Insulation Diameter Range 2.2 – 2.8
  • Wire Size 20 – 17
  • Wire Size .5 – 1
  • Operating Temperature Range -40 – 105
  • Circuit Application Signal
  • Packaging Method Reel
  • Packaging Quantity 5000
3-61668-1 Board-to-Board Connector Contacts
PRODUCT
  1. Connectors
  2. Board-to-Board Connector Contacts
  1. BIF-LEAF CONT CR/SNAP SN/BR 3-61668-1
active
  • Connector System Wire-to-Board
  • Connector & Contact Terminates To Wire & Cable
  • Contact Base Material Brass
  • PCB Contact Termination Area Plating Material Tin
  • Contact Underplating Material Nickel
  • Contact Mating Area Plating Material Thickness 2.032 – 5.08
  • PCB Contact Termination Area Plating Material Thickness 2.032 – 5.08
  • Contact Type Hermaphroditic
  • Contact Mating Area Plating Material Tin
  • Contact Orientation Straight
  • Contact Current Rating (Max) 6
  • Termination Method to Wire & Cable Crimp
  • PCB Mount Retention Without
  • Wire Insulation Support With
  • Contact Retention Type Within Housing Snap-In
  • Connector Mounting Type Board Mount
  • Accepts Wire Insulation Diameter Range 2.79
  • Wire Size 24 – 18
  • Wire Size .2 – .8
  • Operating Temperature Range -55 – 105
  • Circuit Application Signal
  • Packaging Method Reel
  • Packaging Quantity 6000
280702-1 Board-to-Board Connector Contacts
PRODUCT
  1. Connectors
  2. Board-to-Board Connector Contacts
  1. AMPMODU CONT. 280702-1
active
  • Applied Pressure High
  • Connector System Board-to-Board
  • Connector & Contact Terminates To Wire & Cable
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin
  • Contact Mating Area Plating Material Thickness .8
  • PCB Contact Termination Area Plating Material Thickness .8
  • Contact Type Socket
  • Contact Mating Area Plating Material Tin
  • Contact Orientation Straight
  • Contact Current Rating (Max) 5
  • PCB Mount Retention Without
  • Wire Insulation Support With
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) 3.81
  • Accepts Wire Insulation Diameter Range 1.8 – 2.3
  • Wire Size 22 – 18
  • Wire Size .3 – .9
  • Operating Temperature Range -40 – 105
  • Circuit Application Signal
  • Packaging Method Reel
  • Packaging Quantity 5000
350011-2 Board-to-Board Connector Contacts
PRODUCT
  1. Connectors
  2. Board-to-Board Connector Contacts
  1. BIF-LEAF CONT AUPHBZ LP 24-18 350011-2
active
  • Connector System Wire-to-Board
  • Connector & Contact Terminates To Wire & Cable
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Nickel
  • Contact Mating Area Plating Material Thickness .762
  • Contact Type Hermaphroditic
  • Contact Mating Area Plating Material Gold
  • Contact Orientation Straight
  • Contact Current Rating (Max) 6
  • Termination Method to Wire & Cable Crimp
  • PCB Mount Retention Without
  • Wire Insulation Support With
  • Contact Retention Type Within Housing Snap-In
  • Connector Mounting Type Board Mount
  • Accepts Wire Insulation Diameter Range 2.54
  • Wire Size 24 – 18
  • Wire Size .2 – .8
  • Operating Temperature Range -55 – 105
  • Circuit Application Signal
  • Packaging Method Loose Piece
  • Packaging Quantity 1000
61668-2 Board-to-Board Connector Contacts
PRODUCT
  1. Connectors
  2. Board-to-Board Connector Contacts
  1. BIF-LEAF CONT CR/SNAP PTPPHBZ 61668-2
active
  • Connector System Wire-to-Board
  • Connector & Contact Terminates To Wire & Cable
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Pre-Tin
  • Contact Type Hermaphroditic
  • Contact Mating Area Plating Material Pre-Tin
  • Contact Orientation Straight
  • Contact Current Rating (Max) 6
  • Termination Method to Wire & Cable Crimp
  • PCB Mount Retention Without
  • Wire Insulation Support With
  • Contact Retention Type Within Housing Snap-In
  • Connector Mounting Type Board Mount
  • Accepts Wire Insulation Diameter Range 2.79
  • Wire Size 24 – 18
  • Wire Size .2 – .8
  • Operating Temperature Range -55 – 105
  • Circuit Application Signal
  • Packaging Method Box
  • Packaging Quantity 6000
61668-4 Board-to-Board Connector Contacts
PRODUCT
  1. Connectors
  2. Board-to-Board Connector Contacts
  1. BIF-LEAF CONT CR/SNAP AUPHBZ 61668-4
active
  • Connector System Wire-to-Board
  • Connector & Contact Terminates To Wire & Cable
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Nickel
  • Contact Mating Area Plating Material Thickness .762
  • PCB Contact Termination Area Plating Material Thickness .762
  • Contact Type Hermaphroditic
  • Contact Mating Area Plating Material Gold
  • Contact Orientation Straight
  • Contact Current Rating (Max) 6
  • Termination Method to Wire & Cable Crimp
  • PCB Mount Retention Without
  • Wire Insulation Support With
  • Contact Retention Type Within Housing Snap-In
  • Connector Mounting Type Board Mount
  • Accepts Wire Insulation Diameter Range 2.79
  • Wire Size 24 – 18
  • Wire Size .2 – .8
  • Operating Temperature Range -55 – 105
  • Circuit Application Signal
  • Packaging Method Package
  • Packaging Quantity 6000
1-86182-5 Board-to-Board Connector Contacts
PRODUCT
  1. Connectors
  2. Board-to-Board Connector Contacts
  1. MOD I POST LP 1-86182-5
active
  • Connector & Contact Terminates To Printed Circuit Board
  • Contact Resistance 12
  • Insulation Resistance 5000
  • Dielectric Withstanding Voltage (Max) 1200
  • Contact Base Material Brass
  • PCB Contact Termination Area Plating Material Gold
  • Contact Underplating Material Nickel
  • Contact Type Pin
  • Contact Mating Area Plating Material Gold
  • Contact Orientation Straight
  • Contact Current Rating (Max) 5
  • Contact Mating Area Length 9.65
  • Termination Post & Tail Length 8.13
  • Wire Insulation Support Without
  • Operating Temperature Range -65 – 105
  • Packaging Method Loose Piece
  • Packaging Quantity 1000
  • Comment Minimum nominal centerline spacing between adjacent contacts is .125.
102100-2 Board-to-Board Connector Contacts
PRODUCT
  1. Connectors
  2. Board-to-Board Connector Contacts
  1. MOD I RECP PLTD 30 SEL 102100-2
active
  • Applied Pressure High
  • Connector System Board-to-Board
  • Connector & Contact Terminates To Wire & Cable
  • Contact Resistance 12
  • Insulation Resistance 5000
  • Dielectric Withstanding Voltage (Max) 1200
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Gold Flash
  • Contact Mating Area Plating Material Thickness .762
  • Contact Type Socket
  • Contact Mating Area Plating Material Gold
  • Contact Orientation Straight
  • Contact Current Rating (Max) 5
  • PCB Mount Retention Without
  • Wire Insulation Support With
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) 3.81
  • Accepts Wire Insulation Diameter Range 1.3 – 2.29
  • Wire Size 22 – 18
  • Wire Size .3 – .9
  • Operating Temperature Range -65 – 105
  • Circuit Application Signal
  • Packaging Method Reel
  • Packaging Quantity 5000
  • Comment Applicators also available for AMPOMATOR Lead Making Machines and Stripper/Crimper Machines. Consult AMP, Inc.
102100-5 Board-to-Board Connector Contacts
PRODUCT
  1. Connectors
  2. Board-to-Board Connector Contacts
  1. MOD I RECP STMPD 102100-5
active
  • Applied Pressure High
  • Connector System Board-to-Board
  • Connector & Contact Terminates To Wire & Cable
  • Contact Resistance 12
  • Insulation Resistance 5000
  • Dielectric Withstanding Voltage (Max) 1200
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin
  • Contact Mating Area Plating Material Thickness .4064
  • PCB Contact Termination Area Plating Material Thickness .4064
  • Contact Type Socket
  • Contact Mating Area Plating Material Tin
  • Contact Orientation Straight
  • Contact Current Rating (Max) 5
  • PCB Mount Retention Without
  • Wire Insulation Support With
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) 3.81
  • Accepts Wire Insulation Diameter Range 1.3 – 2.29
  • Wire Size 22 – 18
  • Wire Size .3 – .9
  • Operating Temperature Range -65 – 105
  • Circuit Application Signal
  • Packaging Method Reel
  • Packaging Quantity 5000
  • Comment Applicators also available for AMPOMATOR Lead Making Machines and Stripper/Crimper Machines. Consult AMP, Inc.
3-86147-7 Board-to-Board Connector Contacts
PRODUCT
  1. Connectors
  2. Board-to-Board Connector Contacts
  1. MOD I POST PLTD SN 3-86147-7
active
  • Connector & Contact Terminates To Printed Circuit Board
  • Contact Resistance 12
  • Insulation Resistance 5000
  • Dielectric Withstanding Voltage (Max) 1200
  • Contact Base Material Brass
  • PCB Contact Termination Area Plating Material Tin-Lead
  • Contact Mating Area Plating Material Finish Bright
  • Contact Type Pin
  • Contact Mating Area Plating Material Tin-Lead
  • Contact Orientation Straight
  • Contact Current Rating (Max) 5
  • Contact Mating Area Length 10.16
  • Termination Post & Tail Length 3.18
  • Operating Temperature Range -65 – 60
  • Packaging Method Strip
  • Packaging Quantity 20000
  • Comment Minimum nominal centerline spacing between adjacent contacts is .125.
5531216-2 Board-to-Board Connector Contacts 1
PRODUCT
  1. Connectors
  2. Board-to-Board Connector Contacts
  1. T/SPRING LP 5531216-2
active
  • Connector System Cable-to-Cable
  • Sealable No
  • Connector & Contact Terminates To Wire & Cable
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin
  • Contact Mating Area Plating Material Thickness .762
  • PCB Contact Termination Area Plating Material Thickness 1.27
  • Contact Type Socket
  • Contact Mating Area Plating Material Gold
  • Contact Orientation Straight
  • Contact Current Rating (Max) 3
  • Termination Method to Wire & Cable Crimp
  • PCB Mount Retention Without
  • Wire Insulation Support With
  • Connector Mounting Type Cable Mount (Free-Hanging)
  • Wire Size 26 – 22
  • Wire Size .12 – .4
  • Operating Temperature Range -65 – 105
  • Circuit Application Signal
  • Packaging Method Loose Piece
  • Packaging Quantity 500
86432-1 Board-to-Board Connector Contacts
PRODUCT
  1. Connectors
  2. Board-to-Board Connector Contacts
  1. AMP-0-0086432-1 86432-1
active
  • Applied Pressure High
  • Connector System Board-to-Board
  • Connector & Contact Terminates To Printed Circuit Board
  • Contact Resistance 12
  • Insulation Resistance 5000
  • Dielectric Withstanding Voltage (Max) 1200
  • Printed Circuit Board Hole Shape Round
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin
  • Contact Mating Area Plating Material Thickness 2.0066
  • PCB Contact Termination Area Plating Material Thickness 2.0066
  • Contact Type Socket
  • Contact Mating Area Plating Material Tin
  • Contact Orientation Horizontal
  • Contact Current Rating (Max) 5
  • Termination Post & Tail Length 3.68
  • PCB Mount Retention Without
  • Wire Insulation Support Without
  • Connector Mounting Type Board Mount
  • Mating Entry Location Side
  • Centerline (Pitch) 3.81
  • PCB Thickness (Recommended) 1.4 – 2.62
  • Operating Temperature Range -65 – 105
  • Circuit Application Signal
  • Packaging Method Reel
  • Packaging Quantity 5000
102437-1 Board-to-Board Connector Contacts
PRODUCT
  1. Connectors
  2. Board-to-Board Connector Contacts
  1. MOD IV L.P. 102437-1
active
  • Applied Pressure Standard
  • Connector & Contact Terminates To Wire & Cable
  • Operating Voltage 250
  • Insulation Resistance 5000
  • Termination Resistance 12
  • PCB Contact Termination Area Plating Material Tin-Lead
  • Contact Underplating Material Nickel
  • Contact Mating Area Plating Material Thickness .381
  • PCB Contact Termination Area Plating Material Thickness 2.54 – 5.08
  • Contact Type Socket
  • Contact Mating Area Plating Material Gold
  • Contact Orientation Straight
  • Contact Current Rating (Max) 3
  • Termination Method to Wire & Cable Crimp
  • PCB Mount Retention Without
  • Wire Insulation Support Without
  • Accepts Wire Insulation Diameter Range 1.75
  • Wire Size 24 – 20
  • Wire Size .2 – .6
  • Operating Temperature Range -65 – 125
  • Circuit Application Signal
  • Packaging Method Loose Piece
  • Packaging Quantity 5000
533082-4 Board-to-Board Connector Contacts 1
PRODUCT
  1. Connectors
  2. Board-to-Board Connector Contacts
  1. HDI KEYING POWER PIN PLTD 533082-4
active
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Contact Base Material Brass
  • PCB Contact Termination Area Plating Material Gold
  • PCB Contact Termination Area Plating Material Thickness .76
  • Contact Type Pin
  • Contact Mating Area Plating Material Gold
  • Contact Orientation Straight
  • Contact Current Rating (Max) 3
  • Termination Method to Printed Circuit Board Through Hole - Screw
  • PCB Mount Retention Without
  • Wire Insulation Support Without
  • Connector Mounting Type Board Mount
  • Thread Length 9.52
  • Operating Temperature Range -65 – 125
  • Circuit Application Signal
  • Packaging Method Carton
  • Packaging Quantity 1000
5531216-4 Board-to-Board Connector Contacts 1
PRODUCT
  1. Connectors
  2. Board-to-Board Connector Contacts
  1. T/SPRING LP 5531216-4
active
  • Connector System Cable-to-Cable
  • Sealable No
  • Connector & Contact Terminates To Wire & Cable
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin
  • Contact Mating Area Plating Material Thickness 1.27
  • PCB Contact Termination Area Plating Material Thickness 1.27
  • Contact Type Socket
  • Contact Mating Area Plating Material Gold
  • Contact Orientation Straight
  • Contact Current Rating (Max) 3
  • Termination Method to Wire & Cable Crimp
  • PCB Mount Retention Without
  • Wire Insulation Support With
  • Connector Mounting Type Cable Mount (Free-Hanging)
  • Wire Size 26 – 22
  • Wire Size .12 – .4
  • Operating Temperature Range -65 – 105
  • Circuit Application Signal
  • Packaging Method Loose Piece
  • Packaging Quantity 500