533082-6 Board-to-Board Connector Contacts 1
PRODUCT
  1. Connectors
  2. Board-to-Board Connector Contacts
  1. HDI KEYING POWER PIN PLTD 533082-6
active
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Contact Base Material Brass
  • PCB Contact Termination Area Plating Material Gold
  • PCB Contact Termination Area Plating Material Thickness .76
  • Contact Type Pin
  • Contact Mating Area Plating Material Gold
  • Contact Orientation Straight
  • Contact Current Rating (Max) 3
  • Termination Method to Printed Circuit Board Through Hole - Screw
  • PCB Mount Retention Without
  • Wire Insulation Support Without
  • Connector Mounting Type Board Mount
  • Thread Length 12.07
  • Operating Temperature Range -65 – 125
  • Circuit Application Signal
  • Packaging Method Carton
  • Packaging Quantity 1000
533082-9 Board-to-Board Connector Contacts 1
PRODUCT
  1. Connectors
  2. Board-to-Board Connector Contacts
  1. HDI KEYING POWER PIN PLTD 533082-9
active
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Contact Base Material Brass
  • PCB Contact Termination Area Plating Material Gold
  • PCB Contact Termination Area Plating Material Thickness .76
  • Contact Type Pin
  • Contact Mating Area Plating Material Gold
  • Contact Orientation Straight
  • Contact Current Rating (Max) 3
  • Termination Method to Printed Circuit Board Through Hole - Screw
  • PCB Mount Retention Without
  • Wire Insulation Support Without
  • Connector Mounting Type Board Mount
  • Thread Length 12.07
  • Operating Temperature Range -65 – 125
  • Circuit Application Signal
  • Packaging Method Package
  • Packaging Quantity 1000
350011-2 Board-to-Board Connector Contacts
PRODUCT
  1. Connectors
  2. Board-to-Board Connector Contacts
  1. BIF-LEAF CONT AUPHBZ LP 24-18 350011-2
active
  • Connector System Wire-to-Board
  • Connector & Contact Terminates To Wire & Cable
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Nickel
  • Contact Mating Area Plating Material Thickness .762
  • Contact Type Hermaphroditic
  • Contact Mating Area Plating Material Gold
  • Contact Orientation Straight
  • Contact Current Rating (Max) 6
  • Termination Method to Wire & Cable Crimp
  • PCB Mount Retention Without
  • Wire Insulation Support With
  • Contact Retention Type Within Housing Snap-In
  • Connector Mounting Type Board Mount
  • Accepts Wire Insulation Diameter Range 2.54
  • Wire Size 24 – 18
  • Wire Size .2 – .8
  • Operating Temperature Range -55 – 105
  • Circuit Application Signal
  • Packaging Method Loose Piece
  • Packaging Quantity 1000
86432-1 Board-to-Board Connector Contacts
PRODUCT
  1. Connectors
  2. Board-to-Board Connector Contacts
  1. AMP-0-0086432-1 86432-1
active
  • Applied Pressure High
  • Connector System Board-to-Board
  • Connector & Contact Terminates To Printed Circuit Board
  • Contact Resistance 12
  • Insulation Resistance 5000
  • Dielectric Withstanding Voltage (Max) 1200
  • Printed Circuit Board Hole Shape Round
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin
  • Contact Mating Area Plating Material Thickness 2.0066
  • PCB Contact Termination Area Plating Material Thickness 2.0066
  • Contact Type Socket
  • Contact Mating Area Plating Material Tin
  • Contact Orientation Horizontal
  • Contact Current Rating (Max) 5
  • Termination Post & Tail Length 3.68
  • PCB Mount Retention Without
  • Wire Insulation Support Without
  • Connector Mounting Type Board Mount
  • Mating Entry Location Side
  • Centerline (Pitch) 3.81
  • PCB Thickness (Recommended) 1.4 – 2.62
  • Operating Temperature Range -65 – 105
  • Circuit Application Signal
  • Packaging Method Reel
  • Packaging Quantity 5000
167042-1 Board-to-Board Connector Contacts 1
PRODUCT
  1. Connectors
  2. Board-to-Board Connector Contacts
  1. TANDEM-SPRING BU 167042-1
active
  • Applied Pressure Standard
  • Connector System Cable-to-Cable
  • Sealable No
  • Connector & Contact Terminates To Wire & Cable
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin-Lead
  • Contact Mating Area Plating Material Thickness .8
  • Contact Type Socket
  • Contact Mating Area Plating Material Gold
  • Contact Orientation Straight
  • Contact Current Rating (Max) 3
  • Termination Method to Wire & Cable Crimp
  • PCB Mount Retention Without
  • Wire Insulation Support With
  • Connector Mounting Type Cable Mount (Free-Hanging)
  • Accepts Wire Insulation Diameter Range .5 – 1.02
  • Wire Size 32 – 28
  • Wire Size .03 – .09
  • Operating Temperature Range -65 – 105
  • Circuit Application Power & Signal
  • Packaging Method Loose Piece
  • Packaging Quantity 200
102100-5 Board-to-Board Connector Contacts
PRODUCT
  1. Connectors
  2. Board-to-Board Connector Contacts
  1. MOD I RECP STMPD 102100-5
active
  • Applied Pressure High
  • Connector System Board-to-Board
  • Connector & Contact Terminates To Wire & Cable
  • Contact Resistance 12
  • Insulation Resistance 5000
  • Dielectric Withstanding Voltage (Max) 1200
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin
  • Contact Mating Area Plating Material Thickness .4064
  • PCB Contact Termination Area Plating Material Thickness .4064
  • Contact Type Socket
  • Contact Mating Area Plating Material Tin
  • Contact Orientation Straight
  • Contact Current Rating (Max) 5
  • PCB Mount Retention Without
  • Wire Insulation Support With
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) 3.81
  • Accepts Wire Insulation Diameter Range 1.3 – 2.29
  • Wire Size 22 – 18
  • Wire Size .3 – .9
  • Operating Temperature Range -65 – 105
  • Circuit Application Signal
  • Packaging Method Reel
  • Packaging Quantity 5000
  • Comment Applicators also available for AMPOMATOR Lead Making Machines and Stripper/Crimper Machines. Consult AMP, Inc.
5531216-2 Board-to-Board Connector Contacts 1
PRODUCT
  1. Connectors
  2. Board-to-Board Connector Contacts
  1. T/SPRING LP 5531216-2
active
  • Connector System Cable-to-Cable
  • Sealable No
  • Connector & Contact Terminates To Wire & Cable
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin
  • Contact Mating Area Plating Material Thickness .762
  • PCB Contact Termination Area Plating Material Thickness 1.27
  • Contact Type Socket
  • Contact Mating Area Plating Material Gold
  • Contact Orientation Straight
  • Contact Current Rating (Max) 3
  • Termination Method to Wire & Cable Crimp
  • PCB Mount Retention Without
  • Wire Insulation Support With
  • Connector Mounting Type Cable Mount (Free-Hanging)
  • Wire Size 26 – 22
  • Wire Size .12 – .4
  • Operating Temperature Range -65 – 105
  • Circuit Application Signal
  • Packaging Method Loose Piece
  • Packaging Quantity 500
2-532828-5 Board-to-Board Connector Contacts 1
PRODUCT
  1. Connectors
  2. Board-to-Board Connector Contacts
  1. HDI STATIC CHRGE GDE PIN PLTD 2-532828-5
active
  • Sealable No
  • Contact Orientation Straight
  • Operating Temperature Range -65 – 125
532924-3 Board-to-Board Connector Contacts 1
PRODUCT
  1. Connectors
  2. Board-to-Board Connector Contacts
  1. HDI POWER CONTACT ASSY 532924-3
active
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Gold Flash
  • Contact Mating Area Plating Material Thickness .762
  • Contact Type Socket
  • Contact Mating Area Plating Material Gold
  • Contact Orientation Straight
  • Contact Current Rating (Max) 3
  • Termination Method to Printed Circuit Board Through Hole - Solder
  • PCB Mount Retention Without
  • Wire Insulation Support Without
  • Connector Mounting Type Board Mount
  • Thread Length 8.25
  • Operating Temperature Range -65 – 125
  • Circuit Application Signal
  • Packaging Method Package
  • Packaging Quantity 25
102099-5 Board-to-Board Connector Contacts
PRODUCT
  1. Connectors
  2. Board-to-Board Connector Contacts
  1. MOD I RECP STMPD 102099-5
active
  • Applied Pressure Standard
  • Connector System Board-to-Board
  • Connector & Contact Terminates To Wire & Cable
  • Contact Resistance 12
  • Insulation Resistance 5000
  • Dielectric Withstanding Voltage (Max) 1200
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin
  • Contact Mating Area Plating Material Thickness .4064
  • PCB Contact Termination Area Plating Material Thickness .4064
  • Contact Type Socket
  • Contact Mating Area Plating Material Tin
  • Contact Orientation Straight
  • Contact Current Rating (Max) 5
  • PCB Mount Retention Without
  • Wire Insulation Support With
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) 3.81
  • Accepts Wire Insulation Diameter Range 1.3 – 2.29
  • Wire Size 22 – 18
  • Wire Size .3 – .9
  • Operating Temperature Range -65 – 105
  • Circuit Application Signal
  • Packaging Method Reel
  • Packaging Quantity 5000
  • Comment Applicators also available for AMPOMATOR Lead Making Machines and Stripper/Crimper Machines. Consult AMP, Inc.
182198-1 Board-to-Board Connector Contacts
PRODUCT
  1. Connectors
  2. Board-to-Board Connector Contacts
  1. MOD 1 CONTACT 182198-1
active
  • Applied Pressure High
  • Connector System Board-to-Board
  • Connector & Contact Terminates To Wire & Cable
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin
  • Contact Mating Area Plating Material Thickness .762
  • PCB Contact Termination Area Plating Material Thickness .762
  • Contact Type Socket
  • Contact Mating Area Plating Material Tin
  • Contact Orientation Straight
  • Contact Current Rating (Max) 5
  • PCB Mount Retention Without
  • Wire Insulation Support With
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) 3.81
  • Accepts Wire Insulation Diameter Range 1.8 – 2.3
  • Wire Size 22 – 18
  • Wire Size .3 – .9
  • Operating Temperature Range -40 – 105
  • Circuit Application Signal
  • Packaging Method Loose Piece
  • Packaging Quantity 2000
166722-1 Board-to-Board Connector Contacts 1
PRODUCT
  1. Connectors
  2. Board-to-Board Connector Contacts
  1. TANDEM SPR.REC.F 166722-1
active
  • Applied Pressure Standard
  • Connector System Cable-to-Cable
  • Sealable No
  • Connector & Contact Terminates To Wire & Cable
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin-Lead
  • Contact Mating Area Plating Material Thickness .8
  • Contact Type Socket
  • Contact Mating Area Plating Material Gold
  • Contact Orientation Straight
  • Contact Current Rating (Max) 3
  • Termination Method to Wire & Cable Crimp
  • PCB Mount Retention Without
  • Wire Insulation Support With
  • Connector Mounting Type Cable Mount (Free-Hanging)
  • Accepts Wire Insulation Diameter Range .91 – 1.37
  • Wire Size 24 – 20
  • Wire Size .21 – .51
  • Operating Temperature Range -65 – 105
  • Circuit Application Power & Signal
  • Packaging Method Loose Piece
  • Packaging Quantity 200
533082-4 Board-to-Board Connector Contacts 1
PRODUCT
  1. Connectors
  2. Board-to-Board Connector Contacts
  1. HDI KEYING POWER PIN PLTD 533082-4
active
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Contact Base Material Brass
  • PCB Contact Termination Area Plating Material Gold
  • PCB Contact Termination Area Plating Material Thickness .76
  • Contact Type Pin
  • Contact Mating Area Plating Material Gold
  • Contact Orientation Straight
  • Contact Current Rating (Max) 3
  • Termination Method to Printed Circuit Board Through Hole - Screw
  • PCB Mount Retention Without
  • Wire Insulation Support Without
  • Connector Mounting Type Board Mount
  • Thread Length 9.52
  • Operating Temperature Range -65 – 125
  • Circuit Application Signal
  • Packaging Method Carton
  • Packaging Quantity 1000
280621-2 Board-to-Board Connector Contacts
PRODUCT
  1. Connectors
  2. Board-to-Board Connector Contacts
  1. MOD I CONT STRIP 280621-2
active
  • Applied Pressure Standard
  • Connector System Board-to-Board
  • Connector & Contact Terminates To Wire & Cable
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Gold Flash
  • Contact Mating Area Plating Material Thickness .4
  • Contact Type Socket
  • Contact Mating Area Plating Material Gold
  • Contact Orientation Straight
  • Contact Current Rating (Max) 5
  • PCB Mount Retention Without
  • Wire Insulation Support With
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) 3.81
  • Accepts Wire Insulation Diameter Range 1.8 – 2.3
  • Wire Size 22 – 18
  • Wire Size .3 – .9
  • Operating Temperature Range -40 – 105
  • Circuit Application Signal
  • Packaging Method Package
  • Packaging Quantity 5000
102100-1 Board-to-Board Connector Contacts
PRODUCT
  1. Connectors
  2. Board-to-Board Connector Contacts
  1. MOD I RECP PLTD 15 SEL 102100-1
active
  • Applied Pressure High
  • Connector System Board-to-Board
  • Connector & Contact Terminates To Wire & Cable
  • Contact Resistance 12
  • Insulation Resistance 5000
  • Dielectric Withstanding Voltage (Max) 1200
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Gold Flash
  • Contact Mating Area Plating Material Thickness .381
  • Contact Type Socket
  • Contact Mating Area Plating Material Gold
  • Contact Orientation Straight
  • Contact Current Rating (Max) 5
  • PCB Mount Retention Without
  • Wire Insulation Support With
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) 3.81
  • Accepts Wire Insulation Diameter Range 1.3 – 2.29
  • Wire Size 22 – 18
  • Wire Size .3 – .9
  • Operating Temperature Range -65 – 105
  • Circuit Application Signal
  • Packaging Method Reel
  • Packaging Quantity 5000
  • Comment Applicators also available for AMPOMATOR Lead Making Machines and Stripper/Crimper Machines. Consult AMP, Inc.
61668-2 Board-to-Board Connector Contacts
PRODUCT
  1. Connectors
  2. Board-to-Board Connector Contacts
  1. BIF-LEAF CONT CR/SNAP PTPPHBZ 61668-2
active
  • Connector System Wire-to-Board
  • Connector & Contact Terminates To Wire & Cable
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Pre-Tin
  • Contact Type Hermaphroditic
  • Contact Mating Area Plating Material Pre-Tin
  • Contact Orientation Straight
  • Contact Current Rating (Max) 6
  • Termination Method to Wire & Cable Crimp
  • PCB Mount Retention Without
  • Wire Insulation Support With
  • Contact Retention Type Within Housing Snap-In
  • Connector Mounting Type Board Mount
  • Accepts Wire Insulation Diameter Range 2.79
  • Wire Size 24 – 18
  • Wire Size .2 – .8
  • Operating Temperature Range -55 – 105
  • Circuit Application Signal
  • Packaging Method Box
  • Packaging Quantity 6000
61668-4 Board-to-Board Connector Contacts
PRODUCT
  1. Connectors
  2. Board-to-Board Connector Contacts
  1. BIF-LEAF CONT CR/SNAP AUPHBZ 61668-4
active
  • Connector System Wire-to-Board
  • Connector & Contact Terminates To Wire & Cable
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Nickel
  • Contact Mating Area Plating Material Thickness .762
  • PCB Contact Termination Area Plating Material Thickness .762
  • Contact Type Hermaphroditic
  • Contact Mating Area Plating Material Gold
  • Contact Orientation Straight
  • Contact Current Rating (Max) 6
  • Termination Method to Wire & Cable Crimp
  • PCB Mount Retention Without
  • Wire Insulation Support With
  • Contact Retention Type Within Housing Snap-In
  • Connector Mounting Type Board Mount
  • Accepts Wire Insulation Diameter Range 2.79
  • Wire Size 24 – 18
  • Wire Size .2 – .8
  • Operating Temperature Range -55 – 105
  • Circuit Application Signal
  • Packaging Method Package
  • Packaging Quantity 6000
281423-1 Board-to-Board Connector Contacts
PRODUCT
  1. Connectors
  2. Board-to-Board Connector Contacts
  1. MODU I REC. 281423-1
active
  • Applied Pressure High
  • Connector System Board-to-Board
  • Connector & Contact Terminates To Wire & Cable
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin
  • Contact Mating Area Plating Material Thickness .8
  • PCB Contact Termination Area Plating Material Thickness .8
  • Contact Type Socket
  • Contact Mating Area Plating Material Tin
  • Contact Orientation Straight
  • Contact Current Rating (Max) 5
  • PCB Mount Retention Without
  • Wire Insulation Support With
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) 3.81
  • Accepts Wire Insulation Diameter Range 2.2 – 2.8
  • Wire Size 20 – 17
  • Wire Size .5 – 1
  • Operating Temperature Range -40 – 105
  • Circuit Application Signal
  • Packaging Method Reel
  • Packaging Quantity 5000
3-61668-1 Board-to-Board Connector Contacts
PRODUCT
  1. Connectors
  2. Board-to-Board Connector Contacts
  1. BIF-LEAF CONT CR/SNAP SN/BR 3-61668-1
active
  • Connector System Wire-to-Board
  • Connector & Contact Terminates To Wire & Cable
  • Contact Base Material Brass
  • PCB Contact Termination Area Plating Material Tin
  • Contact Underplating Material Nickel
  • Contact Mating Area Plating Material Thickness 2.032 – 5.08
  • PCB Contact Termination Area Plating Material Thickness 2.032 – 5.08
  • Contact Type Hermaphroditic
  • Contact Mating Area Plating Material Tin
  • Contact Orientation Straight
  • Contact Current Rating (Max) 6
  • Termination Method to Wire & Cable Crimp
  • PCB Mount Retention Without
  • Wire Insulation Support With
  • Contact Retention Type Within Housing Snap-In
  • Connector Mounting Type Board Mount
  • Accepts Wire Insulation Diameter Range 2.79
  • Wire Size 24 – 18
  • Wire Size .2 – .8
  • Operating Temperature Range -55 – 105
  • Circuit Application Signal
  • Packaging Method Reel
  • Packaging Quantity 6000
85487-5 Board-to-Board Connector Contacts 1
PRODUCT
  1. Connectors
  2. Board-to-Board Connector Contacts
  1. MOD I RECP PLTD 15 SEL 85487-5
active
  • Applied Pressure Standard
  • Connector System Board-to-Board
  • Connector & Contact Terminates To Printed Circuit Board
  • Contact Resistance 12
  • Insulation Resistance 5000
  • Dielectric Withstanding Voltage (Max) 1200
  • Printed Circuit Board Hole Shape Round
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Gold
  • Contact Mating Area Plating Material Thickness .381
  • Contact Type Socket
  • Contact Mating Area Plating Material Gold
  • Contact Orientation Horizontal
  • Contact Current Rating (Max) 5
  • Termination Post & Tail Length 3.68
  • PCB Mount Retention Without
  • Wire Insulation Support Without
  • Connector Mounting Type Board Mount
  • Mating Entry Location Side
  • Centerline (Pitch) 3.81
  • PCB Thickness (Recommended) 1.4 – 2.62
  • Operating Temperature Range -65 – 105
  • Circuit Application Signal
  • Packaging Method Reel
  • Packaging Quantity 5000