510-AG90D-10 SIP Sockets  1
  • Leg Style Standard
  • Connector & Contact Terminates To Printed Circuit Board
  • Number of Positions 10
  • Contact Base Material Beryllium Copper
  • Contact Fabrication Screw Machine
  • Contact Current Rating (Max) 3
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) 2.54
  • Height Above PC Board 4.57
  • Operating Temperature Range -55 – 125
  • Circuit Application Signal
2-1571550-6 DIP Sockets  1
  • DIP Socket Type Closed Frame
  • Profile Standard
  • Row-to-Row Spacing 7.62
  • Leg Style Straight
  • Connector & Contact Terminates To Printed Circuit Board
  • Number of Positions 20
  • Contact Resistance 10
  • Contact Base Material Beryllium Copper
  • PCB Contact Termination Area Plating Material Tin
  • Contact Fabrication Screw Machine
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness 25
  • Contact Current Rating (Max) 3
  • Contact Termination Type Through Hole
  • PCB Mount Retention Without
  • Mounting Angle Vertical
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) 2.54
  • Height Above PC Board 3.43
  • Operating Temperature Range -55 – 105
  • Circuit Application Signal
508-AG10D DIP Sockets  1
  • DIP Socket Type Closed Frame
  • Profile Standard
  • Row-to-Row Spacing 7.62
  • Leg Style Straight
  • Connector & Contact Terminates To Printed Circuit Board
  • Number of Positions 8
  • Contact Resistance 10
  • Contact Base Material Beryllium Copper
  • PCB Contact Termination Area Plating Material Gold
  • Contact Fabrication Screw Machine
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness 25
  • Contact Current Rating (Max) 3
  • Contact Termination Type Through Hole
  • PCB Mount Retention Without
  • Mounting Angle Vertical
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) 2.54
  • Height Above PC Board 3.43
  • Operating Temperature Range -55 – 125
  • Circuit Application Signal
540-AG10D-ES DIP Sockets  1
  • DIP Socket Type Closed Frame
  • Profile Standard
  • Row-to-Row Spacing 15.24
  • Leg Style Straight
  • Connector & Contact Terminates To Printed Circuit Board
  • Number of Positions 40
  • Contact Resistance 10
  • Contact Base Material Beryllium Copper
  • PCB Contact Termination Area Plating Material Gold
  • Contact Fabrication Stamped & Formed
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness 25
  • Contact Current Rating (Max) 3
  • Contact Termination Type Through Hole
  • PCB Mount Retention Without
  • Mounting Angle Vertical
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) 2.54
  • Height Above PC Board 4.57
  • Operating Temperature Range -55 – 125
  • Circuit Application Signal
8058-1G24 Transistor Sockets  1
  • Terminal Configuration Contact
  • Profile Low
  • Package TO-5
  • Connector & Contact Terminates To Printed Circuit Board
  • Number of Positions 4
  • Lead Size Accepted .41
  • Terminal Plating Gold
  • Termination Method Printed Circuit
  • Contact Current Rating (Max) 3
  • Connector Mounting Type Board Mount
  • Operating Temperature Range -55 – 125
  • Circuit Application Signal
2-1571550-9 DIP Sockets  1
  • DIP Socket Type Closed Frame
  • Profile Standard
  • Row-to-Row Spacing 15.24
  • Leg Style Straight
  • Connector & Contact Terminates To Printed Circuit Board
  • Number of Positions 28
  • Contact Resistance 10
  • Contact Base Material Beryllium Copper
  • PCB Contact Termination Area Plating Material Tin
  • Contact Fabrication Screw Machine
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness 25
  • Contact Current Rating (Max) 3
  • Contact Termination Type Through Hole
  • PCB Mount Retention Without
  • Mounting Angle Vertical
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) 2.54
  • Height Above PC Board 3.43
  • Operating Temperature Range -55 – 105
  • Circuit Application Signal
8060-1G3 Transistor Sockets  1
  • Terminal Configuration Contact
  • Profile Low
  • Package TO-5
  • Connector & Contact Terminates To Printed Circuit Board
  • Number of Positions 3
  • Lead Size Accepted .41
  • Terminal Plating Gold
  • Termination Method Printed Circuit
  • Contact Current Rating (Max) 3
  • Connector Mounting Type Board Mount
  • Operating Temperature Range -55 – 125
  • Circuit Application Signal
1-1571994-0 SIP Sockets  1
  • Leg Style Standard
  • Connector & Contact Terminates To Printed Circuit Board
  • Number of Positions 10
  • Contact Base Material Beryllium Copper
  • Contact Fabrication Screw Machine
  • Contact Current Rating (Max) 3
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) 2.54
  • Height Above PC Board 4.57
  • Operating Temperature Range -55 – 125
  • Circuit Application Signal
528-AG10D-ES DIP Sockets  1
  • DIP Socket Type Closed Frame
  • Profile Standard
  • Row-to-Row Spacing 15.24
  • Leg Style Straight
  • Connector & Contact Terminates To Printed Circuit Board
  • Number of Positions 28
  • Contact Resistance 10
  • Contact Base Material Beryllium Copper
  • PCB Contact Termination Area Plating Material Gold
  • Contact Fabrication Stamped & Formed
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness 25
  • Contact Current Rating (Max) 3
  • Contact Termination Type Through Hole
  • PCB Mount Retention Without
  • Mounting Angle Vertical
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) 2.54
  • Height Above PC Board 4.57
  • Operating Temperature Range -55 – 125
  • Circuit Application Signal
528-AG11D-ES DIP Sockets  1
  • DIP Socket Type Closed Frame
  • Profile Standard
  • Row-to-Row Spacing 15.24
  • Leg Style Straight
  • Connector & Contact Terminates To Printed Circuit Board
  • Number of Positions 28
  • Contact Resistance 10
  • Contact Base Material Beryllium Copper
  • PCB Contact Termination Area Plating Material Tin-Lead
  • Contact Fabrication Stamped & Formed
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness 25
  • Contact Current Rating (Max) 3
  • Contact Termination Type Through Hole
  • PCB Mount Retention Without
  • Mounting Angle Vertical
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) 2.54
  • Height Above PC Board 4.57
  • Operating Temperature Range -55 – 125
  • Circuit Application Signal
2-1571550-4 DIP Sockets  1
  • DIP Socket Type Closed Frame
  • Profile Standard
  • Row-to-Row Spacing 7.62
  • Leg Style Straight
  • Connector & Contact Terminates To Printed Circuit Board
  • Number of Positions 16
  • Contact Resistance 10
  • Contact Base Material Beryllium Copper
  • PCB Contact Termination Area Plating Material Tin
  • Contact Fabrication Screw Machine
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness 25
  • Contact Current Rating (Max) 3
  • Contact Termination Type Through Hole
  • PCB Mount Retention Without
  • Mounting Angle Vertical
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) 2.54
  • Height Above PC Board 3.43
  • Operating Temperature Range -55 – 105
  • Circuit Application Signal
8080-1G1-LF Transistor Sockets  1
  • Terminal Configuration Contact
  • Profile Standard
  • Package TO-3
  • Connector & Contact Terminates To Printed Circuit Board
  • Number of Positions 3
  • Lead Size Accepted 1.02
  • Terminal Plating Tin
  • Termination Method Solder
  • Contact Current Rating (Max) 10
  • Connector Mounting Type Panel
  • Operating Temperature Range -55 – 125
  • Circuit Application Signal
1-1571550-0 DIP Sockets  1
  • DIP Socket Type Closed Frame
  • Profile Standard
  • Row-to-Row Spacing 15.24
  • Leg Style Straight
  • Connector & Contact Terminates To Printed Circuit Board
  • Number of Positions 32
  • Contact Resistance 10
  • Contact Base Material Beryllium Copper
  • PCB Contact Termination Area Plating Material Tin
  • Contact Fabrication Screw Machine
  • Contact Mating Area Plating Material Tin
  • Contact Mating Area Plating Thickness 25
  • Contact Current Rating (Max) 3
  • Contact Termination Type Through Hole
  • PCB Mount Retention Without
  • Mounting Angle Vertical
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) 2.54
  • Height Above PC Board 4.57
  • Operating Temperature Range -55 – 105
  • Circuit Application Signal
2-1571551-2 DIP Sockets  1
  • DIP Socket Type Closed Frame
  • Profile Standard
  • Row-to-Row Spacing 7.62
  • Leg Style Straight
  • Connector & Contact Terminates To Printed Circuit Board
  • Number of Positions 8
  • Contact Resistance 10
  • Contact Base Material Beryllium Copper
  • PCB Contact Termination Area Plating Material Tin
  • Contact Fabrication Stamped & Formed
  • Contact Mating Area Plating Material Gold Flash
  • Contact Mating Area Plating Thickness 25
  • Contact Current Rating (Max) 3
  • Contact Termination Type Through Hole
  • PCB Mount Retention Without
  • Mounting Angle Vertical
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) 2.54
  • Height Above PC Board 4.57
  • Operating Temperature Range -55 – 105
  • Circuit Application Signal
2-1571551-9 DIP Sockets  1
  • DIP Socket Type Closed Frame
  • Profile Standard
  • Row-to-Row Spacing 15.24
  • Leg Style Straight
  • Connector & Contact Terminates To Printed Circuit Board
  • Number of Positions 28
  • Contact Resistance 10
  • Contact Base Material Beryllium Copper
  • PCB Contact Termination Area Plating Material Tin
  • Contact Fabrication Stamped & Formed
  • Contact Mating Area Plating Material Gold Flash
  • Contact Mating Area Plating Thickness 25
  • Contact Current Rating (Max) 3
  • Contact Termination Type Through Hole
  • PCB Mount Retention Without
  • Mounting Angle Vertical
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) 2.54
  • Height Above PC Board 4.57
  • Operating Temperature Range -55 – 105
  • Circuit Application Signal
3-1571550-0 DIP Sockets  1
  • DIP Socket Type Closed Frame
  • Profile Standard
  • Row-to-Row Spacing 15.24
  • Leg Style Straight
  • Connector & Contact Terminates To Printed Circuit Board
  • Number of Positions 32
  • Contact Resistance 10
  • Contact Base Material Beryllium Copper
  • PCB Contact Termination Area Plating Material Tin
  • Contact Fabrication Screw Machine
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness 25
  • Contact Current Rating (Max) 3
  • Contact Termination Type Through Hole
  • PCB Mount Retention Without
  • Mounting Angle Vertical
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) 2.54
  • Height Above PC Board 3.43
  • Operating Temperature Range -55 – 105
  • Circuit Application Signal
4-1571551-3 DIP Sockets  1
  • DIP Socket Type Closed Frame
  • Profile Standard
  • Row-to-Row Spacing 7.62
  • Leg Style Straight
  • Connector & Contact Terminates To Printed Circuit Board
  • Number of Positions 14
  • Contact Resistance 10
  • Contact Base Material Beryllium Copper
  • PCB Contact Termination Area Plating Material Tin
  • Contact Fabrication Stamped & Formed
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness 25
  • Contact Current Rating (Max) 3
  • Contact Termination Type Through Hole
  • PCB Mount Retention Without
  • Mounting Angle Vertical
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) 2.54
  • Height Above PC Board 4.57
  • Operating Temperature Range -55 – 105
  • Circuit Application Signal
4-1571551-4 DIP Sockets  1
  • DIP Socket Type Closed Frame
  • Profile Standard
  • Row-to-Row Spacing 7.62
  • Leg Style Straight
  • Connector & Contact Terminates To Printed Circuit Board
  • Number of Positions 16
  • Contact Resistance 10
  • Contact Base Material Beryllium Copper
  • PCB Contact Termination Area Plating Material Tin
  • Contact Fabrication Stamped & Formed
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness 25
  • Contact Current Rating (Max) 3
  • Contact Termination Type Through Hole
  • PCB Mount Retention Without
  • Mounting Angle Vertical
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) 2.54
  • Height Above PC Board 4.57
  • Operating Temperature Range -55 – 105
  • Circuit Application Signal
4-1571551-5 DIP Sockets  1
  • DIP Socket Type Closed Frame
  • Profile Standard
  • Row-to-Row Spacing 7.62
  • Leg Style Straight
  • Connector & Contact Terminates To Printed Circuit Board
  • Number of Positions 18
  • Contact Resistance 10
  • Contact Base Material Beryllium Copper
  • PCB Contact Termination Area Plating Material Tin
  • Contact Fabrication Stamped & Formed
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness 25
  • Contact Current Rating (Max) 3
  • Contact Termination Type Through Hole
  • PCB Mount Retention Without
  • Mounting Angle Vertical
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) 2.54
  • Height Above PC Board 4.57
  • Operating Temperature Range -55 – 105
  • Circuit Application Signal
4-1571551-6 DIP Sockets  1
  • DIP Socket Type Closed Frame
  • Profile Standard
  • Row-to-Row Spacing 7.62
  • Leg Style Straight
  • Connector & Contact Terminates To Printed Circuit Board
  • Number of Positions 20
  • Contact Resistance 10
  • Contact Base Material Beryllium Copper
  • PCB Contact Termination Area Plating Material Tin
  • Contact Fabrication Stamped & Formed
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness 25
  • Contact Current Rating (Max) 3
  • Contact Termination Type Through Hole
  • PCB Mount Retention Without
  • Mounting Angle Vertical
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) 2.54
  • Height Above PC Board 4.57
  • Operating Temperature Range -55 – 105
  • Circuit Application Signal