1-5316559-1 Board-to-Board Headers & Receptacles  1
  • Connector Assembly Type PCB Mount Header
  • Connector System Board-to-Board
  • Connector & Contact Terminates To Printed Circuit Board
  • Series Free Height
  • Ground Component Type Grounding Contact
  • Connector Type Connector Assembly
  • Boss Yes
  • Product Type Connector
  • Stackable Yes
  • PCB Mount Orientation Vertical
  • Number of Positions 160
  • Board-to-Board Configuration Mezzanine
  • Number of Rows 2
  • Dielectric Withstanding Voltage 200
  • Insulation Resistance 160
  • Voltage 50
  • Insulation Resistance 2
  • Sealant Yes
  • Busbar Mating Area Plating Thickness 200
  • Contact Base Material Copper Alloy
  • PCB Contact Termination Area Plating Material Tin
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .2
  • Contact Type Pin
  • Contact Current Rating (Max) .5
  • PCB Contact Termination Area Plating Thickness 1
  • Contact Plating Thickness 1
  • Contact Layout Inline
  • Termination Method to Printed Circuit Board Surface Mount
  • PCB Mount Retention Type Solder Peg
  • Mating Alignment With
  • Mating Alignment Type Polarization
  • PCB Mount Retention With
  • PCB Mount Alignment With
  • PCB Mount Alignment Type Locating Posts
  • Centerline (Pitch) .6
  • Housing Material High Temperature Thermoplastic
  • Stack Height 4
  • Height 4
  • Mating Post Length 1
  • Operating Temperature Range -40 – 85
  • Pick and Place Cover Without
  • Circuit Application Signal
  • For Use With Receptacle
  • UL Flammability Rating UL 94V-0
  • Packaging Method Hard Tray
  • Packaging Quantity 30
1-5353233-0 Board-to-Board Headers & Receptacles
  • Connector Assembly Type PCB Mount Header
  • Connector System Board-to-Board
  • Connector & Contact Terminates To Printed Circuit Board
  • Series Free Height
  • Ground Component Type Grounding Contact
  • Connector Type Connector Assembly
  • Boss Yes
  • Product Type Connector
  • Stackable Yes
  • PCB Mount Orientation Vertical
  • Number of Positions 280
  • Board-to-Board Configuration Mezzanine
  • Number of Rows 2
  • Post Entry Direction With
  • Dielectric Withstanding Voltage 200
  • Insulation Resistance 280
  • Voltage 50
  • Insulation Resistance 2
  • Busbar Mating Area Plating Thickness 200
  • Contact Base Material Copper Alloy
  • PCB Contact Termination Area Plating Material Tin
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .2
  • Contact Type Pin
  • Contact Current Rating (Max) .5
  • PCB Contact Termination Area Plating Thickness 1
  • Contact Plating Thickness 1
  • Contact Layout Inline
  • Termination Method to Printed Circuit Board Surface Mount
  • PCB Mount Retention Type Solder Peg
  • Mating Alignment With
  • Mating Alignment Type Polarization
  • PCB Mount Retention With
  • PCB Mount Alignment With
  • PCB Mount Alignment Type Locating Posts
  • Centerline (Pitch) .6
  • Housing Material High Temperature Thermoplastic
  • Stack Height 8
  • Height 8
  • Mating Post Length 1
  • Operating Temperature Range -40 – 85
  • Assembly Process Feature Vacuum Cover
  • Pick and Place Cover With
  • Circuit Application Signal
  • For Use With Receptacle
  • UL Flammability Rating UL 94V-0
  • Packaging Method Reel
  • Packaging Quantity 300
1-5353135-0 Board-to-Board Headers & Receptacles
  • Connector Assembly Type PCB Mount Header
  • Connector System Board-to-Board
  • Connector & Contact Terminates To Printed Circuit Board
  • Series Free Height
  • Ground Component Type Grounding Contact
  • Connector Type Connector Assembly
  • Boss Yes
  • Product Type Connector
  • Stackable Yes
  • PCB Mount Orientation Vertical
  • Number of Positions 280
  • Board-to-Board Configuration Mezzanine
  • Number of Rows 2
  • Post Entry Direction With
  • Dielectric Withstanding Voltage 200
  • Insulation Resistance 280
  • Voltage 50
  • Insulation Resistance 2
  • Busbar Mating Area Plating Thickness 200
  • Contact Base Material Copper Alloy
  • PCB Contact Termination Area Plating Material Tin
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .2
  • Contact Type Pin
  • Contact Current Rating (Max) .5
  • PCB Contact Termination Area Plating Thickness 1
  • Contact Plating Thickness 1
  • Contact Layout Inline
  • Termination Method to Printed Circuit Board Surface Mount
  • PCB Mount Retention Type Solder Peg
  • Mating Alignment With
  • Mating Alignment Type Polarization
  • PCB Mount Retention With
  • PCB Mount Alignment With
  • PCB Mount Alignment Type Locating Posts
  • Centerline (Pitch) .6
  • Housing Material High Temperature Thermoplastic
  • Stack Height 8
  • Height 8
  • Mating Post Length 1
  • Operating Temperature Range -40 – 85
  • Assembly Process Feature Vacuum Cover
  • Pick and Place Cover With
  • Circuit Application Signal
  • For Use With Receptacle
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tape
  • Packaging Quantity 400
1-5316562-1 Board-to-Board Headers & Receptacles
  • Connector Assembly Type PCB Mount Header
  • Connector System Board-to-Board
  • Connector & Contact Terminates To Printed Circuit Board
  • Series Free Height
  • Ground Component Type Grounding Contact
  • Connector Type Connector Assembly
  • Boss Yes
  • Product Type Connector
  • Stackable Yes
  • PCB Mount Orientation Vertical
  • Number of Positions 160
  • Board-to-Board Configuration Mezzanine
  • Number of Rows 2
  • Dielectric Withstanding Voltage 200
  • Insulation Resistance 160
  • Voltage 50
  • Insulation Resistance 2
  • Busbar Mating Area Plating Thickness 200
  • Contact Base Material Copper Alloy
  • PCB Contact Termination Area Plating Material Tin
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .2
  • Contact Type Pin
  • Contact Current Rating (Max) .5
  • PCB Contact Termination Area Plating Thickness 1
  • Contact Plating Thickness 1
  • Contact Layout Inline
  • Termination Method to Printed Circuit Board Surface Mount
  • PCB Mount Retention Type Solder Peg
  • Mating Alignment With
  • Mating Alignment Type Polarization
  • PCB Mount Retention With
  • PCB Mount Alignment With
  • PCB Mount Alignment Type Locating Posts
  • Centerline (Pitch) .6
  • Housing Material High Temperature Thermoplastic
  • Stack Height 8
  • Height 8
  • Mating Post Length 1
  • Operating Temperature Range -40 – 85
  • Pick and Place Cover Without
  • Circuit Application Signal
  • For Use With Receptacle
  • UL Flammability Rating UL 94V-0
  • Packaging Method Soft Tray
  • Packaging Quantity 30
1-5353188-1 Board-to-Board Headers & Receptacles
  • Connector Assembly Type PCB Mount Header
  • Connector System Board-to-Board
  • Connector & Contact Terminates To Printed Circuit Board
  • Series Free Height
  • Ground Component Type Grounding Contact
  • Connector Type Connector Assembly
  • Boss Yes
  • Product Type Connector
  • Stackable Yes
  • PCB Mount Orientation Vertical
  • Number of Positions 160
  • Board-to-Board Configuration Mezzanine
  • Number of Rows 2
  • Dielectric Withstanding Voltage 200
  • Insulation Resistance 160
  • Voltage 50
  • Insulation Resistance 2
  • Busbar Mating Area Plating Thickness 200
  • Contact Base Material Copper Alloy
  • PCB Contact Termination Area Plating Material Tin
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .2
  • Contact Type Pin
  • Contact Current Rating (Max) .5
  • PCB Contact Termination Area Plating Thickness 1
  • Contact Plating Thickness 1
  • Contact Layout Inline
  • Termination Method to Printed Circuit Board Surface Mount
  • PCB Mount Retention Type Solder Peg
  • Mating Alignment With
  • Mating Alignment Type Polarization
  • PCB Mount Retention With
  • PCB Mount Alignment With
  • PCB Mount Alignment Type Locating Posts
  • Centerline (Pitch) .6
  • Housing Material High Temperature Thermoplastic
  • Stack Height 8
  • Height 8
  • Mating Post Length 1
  • Operating Temperature Range -40 – 85
  • High Temperature Compatible Yes
  • Pick and Place Cover Without
  • Circuit Application Signal
  • For Use With Receptacle
  • UL Flammability Rating UL 94V-0
  • Packaging Method Reel
  • Packaging Quantity 600
1-5353190-1 Board-to-Board Headers & Receptacles
  • Connector Assembly Type PCB Mount Receptacle
  • Connector System Board-to-Board
  • Connector & Contact Terminates To Printed Circuit Board
  • Series Free Height
  • Ground Component Type Grounding Contact
  • Connector Type Connector Assembly
  • Boss Yes
  • Product Type Connector
  • Stackable Yes
  • PCB Mount Orientation Vertical
  • Number of Positions 160
  • Board-to-Board Configuration Mezzanine
  • Number of Rows 2
  • Dielectric Withstanding Voltage 200
  • Insulation Resistance 160
  • Voltage 50
  • Insulation Resistance 2
  • Busbar Mating Area Plating Thickness 200
  • Contact Base Material Copper Alloy
  • PCB Contact Termination Area Plating Material Gold
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .2
  • Contact Type Socket
  • Contact Current Rating (Max) .5
  • PCB Contact Termination Area Plating Thickness .05
  • Contact Plating Thickness .05 – .127
  • Contact Layout Inline
  • Termination Method to Printed Circuit Board Surface Mount
  • PCB Mount Retention Type Solder Peg
  • Mating Alignment With
  • Mating Alignment Type Polarization
  • PCB Mount Retention With
  • PCB Mount Alignment With
  • PCB Mount Alignment Type Locating Posts
  • Centerline (Pitch) .6
  • Housing Material High Temperature Thermoplastic
  • Stack Height 4
  • Height 4
  • Mating Post Length 1
  • Operating Temperature Range -40 – 85
  • Pick and Place Cover Without
  • Circuit Application Signal
  • For Use With Plug
  • UL Flammability Rating UL 94V-0
  • Packaging Method Reel
  • Packaging Quantity 1000
1-5353183-0 Board-to-Board Headers & Receptacles  1
  • Connector Assembly Type PCB Mount Header
  • Connector System Board-to-Board
  • Connector & Contact Terminates To Printed Circuit Board
  • Series Free Height
  • Connector Type Connector Assembly
  • Boss Yes
  • Product Type Connector
  • Stackable Yes
  • PCB Mount Orientation Vertical
  • Number of Positions 140
  • Board-to-Board Configuration Mezzanine
  • Number of Rows 2
  • Dielectric Withstanding Voltage 200
  • Insulation Resistance 140
  • Voltage 50
  • Insulation Resistance 2
  • Busbar Mating Area Plating Thickness 200
  • Contact Base Material Copper Alloy
  • PCB Contact Termination Area Plating Material Tin
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .2
  • Contact Type Pin
  • Contact Current Rating (Max) .5
  • PCB Contact Termination Area Plating Thickness 1
  • Contact Plating Thickness 1
  • Contact Layout Inline
  • Termination Method to Printed Circuit Board Surface Mount
  • PCB Mount Retention Type Solder Peg
  • Mating Alignment With
  • Mating Alignment Type Polarization
  • PCB Mount Retention With
  • PCB Mount Alignment With
  • PCB Mount Alignment Type Locating Posts
  • Centerline (Pitch) .6
  • Housing Material High Temperature Thermoplastic
  • Stack Height 4
  • Height 4
  • Mating Post Length 1
  • Operating Temperature Range -40 – 85
  • Pick and Place Cover Without
  • Circuit Application Signal
  • For Use With Receptacle
  • UL Flammability Rating UL 94V-0
  • Packaging Method Reel
  • Packaging Quantity 1000
1-5316077-0 Board-to-Board Headers & Receptacles
  • Connector Assembly Type PCB Mount Receptacle
  • Connector System Board-to-Board
  • Connector & Contact Terminates To Printed Circuit Board
  • Series Free Height
  • Ground Component Type Grounding Contact
  • Connector Type Connector Assembly
  • Boss Yes
  • Product Type Connector
  • Stackable Yes
  • PCB Mount Orientation Vertical
  • Number of Positions 140
  • Board-to-Board Configuration Mezzanine
  • Number of Rows 2
  • Dielectric Withstanding Voltage 200
  • Insulation Resistance 140
  • Voltage 50
  • Insulation Resistance 2
  • Busbar Mating Area Plating Thickness 200
  • Contact Base Material Copper Alloy
  • PCB Contact Termination Area Plating Material Gold
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .2
  • Contact Type Socket
  • Contact Current Rating (Max) .5
  • PCB Contact Termination Area Plating Thickness .05
  • Contact Plating Thickness .05 – .127
  • Contact Layout Inline
  • Termination Method to Printed Circuit Board Surface Mount
  • PCB Mount Retention Type Solder Peg
  • Mating Alignment With
  • Mating Alignment Type Polarization
  • PCB Mount Retention With
  • PCB Mount Alignment With
  • PCB Mount Alignment Type Locating Posts
  • Centerline (Pitch) .6
  • Housing Material High Temperature Thermoplastic
  • Stack Height 4
  • Height 4
  • Mating Post Length 1
  • Operating Temperature Range -40 – 85
  • Pick and Place Cover Without
  • Circuit Application Signal
  • For Use With Plug
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tray
  • Packaging Quantity 30
1-2069480-0 Board-to-Board Headers & Receptacles
  • Connector Assembly Type PCB Mount Receptacle
  • Connector System Board-to-Board
  • Row-to-Row Spacing 3.6
  • Connector & Contact Terminates To Printed Circuit Board
  • Series Free Height
  • Ground Component Type Grounding Contact
  • Connector Type Connector Assembly
  • Boss Yes
  • Product Type Connector
  • Stackable Yes
  • PCB Mount Orientation Vertical
  • Number of Positions 140
  • Board-to-Board Configuration Mezzanine
  • Number of Rows 2
  • Post Entry Direction With
  • Dielectric Withstanding Voltage 200
  • Insulation Resistance 140
  • Voltage 50
  • Insulation Resistance 2
  • Busbar Mating Area Plating Thickness 200
  • Contact Base Material Copper Alloy
  • PCB Contact Termination Area Plating Material Tin
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .2
  • Contact Type Socket
  • Contact Current Rating (Max) .5
  • PCB Contact Termination Area Plating Thickness 1
  • Contact Plating Thickness .05 – .127
  • Contact Layout Inline
  • Termination Method to Printed Circuit Board Surface Mount
  • PCB Mount Retention Type Solder Peg
  • Mating Alignment With
  • Mating Alignment Type Polarization
  • PCB Mount Retention With
  • PCB Mount Alignment With
  • PCB Mount Alignment Type Locating Posts
  • Centerline (Pitch) .6
  • Housing Material High Temperature Thermoplastic
  • Stack Height 4
  • Height 3.25
  • Mating Post Length 1
  • Operating Temperature Range -40 – 85
  • Assembly Process Feature None
  • Pick and Place Cover With
  • Circuit Application Signal
  • For Use With Plug Housing
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tape
  • Packaging Quantity 900
1-5316316-0 Board-to-Board Headers & Receptacles
  • Connector Assembly Type PCB Mount Header
  • Connector System Board-to-Board
  • Connector & Contact Terminates To Printed Circuit Board
  • Series Free Height
  • Ground Component Type Grounding Contact
  • Connector Type Connector Assembly
  • Boss Yes
  • Product Type Connector
  • Stackable Yes
  • PCB Mount Orientation Vertical
  • Number of Positions 140
  • Board-to-Board Configuration Mezzanine
  • Number of Rows 2
  • Dielectric Withstanding Voltage 200
  • Voltage 50
  • Insulation Resistance 100 – 500
  • Sealant Yes
  • Contact Base Material Copper Alloy
  • PCB Contact Termination Area Plating Material Tin
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .2
  • Contact Type Pin
  • Contact Current Rating (Max) .5
  • PCB Contact Termination Area Plating Thickness 1
  • Contact Plating Thickness 1
  • Contact Layout Inline
  • Termination Method to Printed Circuit Board Surface Mount
  • PCB Mount Retention Type Solder Peg
  • Mating Alignment With
  • Mating Alignment Type Polarization
  • PCB Mount Retention With
  • PCB Mount Alignment With
  • PCB Mount Alignment Type Locating Posts
  • Centerline (Pitch) .6
  • Housing Material High Temperature Thermoplastic
  • Stack Height 8
  • Height 8
  • Operating Temperature Range -40 – 85
  • Pick and Place Cover Without
  • For Use With Receptacle
  • UL Flammability Rating UL 94V-0
  • Packaging Method Hard Tray
  • Packaging Quantity 30
1-5353186-0 Board-to-Board Headers & Receptacles
  • Connector Assembly Type PCB Mount Header
  • Connector System Board-to-Board
  • Connector & Contact Terminates To Printed Circuit Board
  • Series Free Height
  • Ground Component Type Grounding Contact
  • Connector Type Connector Assembly
  • Boss Yes
  • Product Type Connector
  • Stackable Yes
  • PCB Mount Orientation Vertical
  • Number of Positions 140
  • Board-to-Board Configuration Mezzanine
  • Number of Rows 2
  • Dielectric Withstanding Voltage 200
  • Insulation Resistance 140
  • Voltage 50
  • Insulation Resistance 2
  • Busbar Mating Area Plating Thickness 200
  • Contact Base Material Copper Alloy
  • PCB Contact Termination Area Plating Material Tin
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .2
  • Contact Type Pin
  • Contact Current Rating (Max) .5
  • PCB Contact Termination Area Plating Thickness 1
  • Contact Plating Thickness 1
  • Contact Layout Inline
  • Termination Method to Printed Circuit Board Surface Mount
  • PCB Mount Retention Type Solder Peg
  • Mating Alignment With
  • Mating Alignment Type Polarization
  • PCB Mount Retention With
  • PCB Mount Alignment With
  • PCB Mount Alignment Type Locating Posts
  • Centerline (Pitch) .6
  • Housing Material High Temperature Thermoplastic
  • Stack Height 6
  • Height 6
  • Mating Post Length 1
  • Operating Temperature Range -40 – 85
  • Pick and Place Cover Without
  • Circuit Application Signal
  • For Use With Receptacle
  • UL Flammability Rating UL 94V-0
  • Packaging Method Reel
  • Packaging Quantity 800
1-5353187-0 Board-to-Board Headers & Receptacles
  • Connector Assembly Type PCB Mount Header
  • Connector System Board-to-Board
  • Connector & Contact Terminates To Printed Circuit Board
  • Series Free Height
  • Connector Type Connector Assembly
  • Boss Yes
  • Product Type Connector
  • Stackable Yes
  • PCB Mount Orientation Vertical
  • Number of Positions 140
  • Board-to-Board Configuration Mezzanine
  • Number of Rows 2
  • Dielectric Withstanding Voltage 200
  • Insulation Resistance 140
  • Voltage 50
  • Insulation Resistance 2
  • Busbar Mating Area Plating Thickness 200
  • Contact Base Material Copper Alloy
  • PCB Contact Termination Area Plating Material Tin
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .2
  • Contact Type Pin
  • Contact Current Rating (Max) .5
  • PCB Contact Termination Area Plating Thickness 1
  • Contact Plating Thickness 1
  • Contact Layout Inline
  • Termination Method to Printed Circuit Board Surface Mount
  • PCB Mount Retention Type Solder Peg
  • Mating Alignment With
  • Mating Alignment Type Polarization
  • PCB Mount Retention With
  • PCB Mount Alignment With
  • PCB Mount Alignment Type Locating Posts
  • Centerline (Pitch) .6
  • Housing Material High Temperature Thermoplastic
  • Stack Height 8
  • Height 8
  • Mating Post Length 1
  • Operating Temperature Range -40 – 85
  • High Temperature Compatible Yes
  • Pick and Place Cover Without
  • Circuit Application Signal
  • For Use With Receptacle
  • UL Flammability Rating UL 94V-0
  • Packaging Method Reel
  • Packaging Quantity 600
1-5353187-1 Board-to-Board Headers & Receptacles
  • Connector Assembly Type PCB Mount Header
  • Connector System Board-to-Board
  • Connector & Contact Terminates To Printed Circuit Board
  • Series Free Height
  • Connector Type Connector Assembly
  • Boss Yes
  • Product Type Connector
  • Stackable Yes
  • PCB Mount Orientation Vertical
  • Number of Positions 160
  • Board-to-Board Configuration Mezzanine
  • Number of Rows 2
  • Dielectric Withstanding Voltage 200
  • Insulation Resistance 160
  • Voltage 50
  • Insulation Resistance 2
  • Busbar Mating Area Plating Thickness 200
  • Contact Base Material Copper Alloy
  • PCB Contact Termination Area Plating Material Tin
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .2
  • Contact Type Pin
  • Contact Current Rating (Max) .5
  • PCB Contact Termination Area Plating Thickness 1
  • Contact Plating Thickness 1
  • Contact Layout Inline
  • Termination Method to Printed Circuit Board Surface Mount
  • PCB Mount Retention Type Solder Peg
  • Mating Alignment With
  • Mating Alignment Type Polarization
  • PCB Mount Retention With
  • PCB Mount Alignment With
  • PCB Mount Alignment Type Locating Posts
  • Centerline (Pitch) .6
  • Housing Material High Temperature Thermoplastic
  • Stack Height 8
  • Height 8
  • Mating Post Length 1
  • Operating Temperature Range -40 – 85
  • High Temperature Compatible Yes
  • Pick and Place Cover Without
  • Circuit Application Signal
  • For Use With Receptacle
  • UL Flammability Rating UL 94V-0
  • Packaging Method Reel
  • Packaging Quantity 600
1-5353188-0 Board-to-Board Headers & Receptacles
  • Connector Assembly Type PCB Mount Header
  • Connector System Board-to-Board
  • Connector & Contact Terminates To Printed Circuit Board
  • Series Free Height
  • Ground Component Type Grounding Contact
  • Connector Type Connector Assembly
  • Boss Yes
  • Product Type Connector
  • Stackable Yes
  • PCB Mount Orientation Vertical
  • Number of Positions 140
  • Board-to-Board Configuration Mezzanine
  • Number of Rows 2
  • Dielectric Withstanding Voltage 200
  • Insulation Resistance 140
  • Voltage 50
  • Insulation Resistance 2
  • Busbar Mating Area Plating Thickness 200
  • Contact Base Material Copper Alloy
  • PCB Contact Termination Area Plating Material Tin
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .2
  • Contact Type Pin
  • Contact Current Rating (Max) .5
  • PCB Contact Termination Area Plating Thickness 1
  • Contact Plating Thickness 1
  • Contact Layout Inline
  • Termination Method to Printed Circuit Board Surface Mount
  • PCB Mount Retention Type Solder Peg
  • Mating Alignment With
  • Mating Alignment Type Polarization
  • PCB Mount Retention With
  • PCB Mount Alignment With
  • PCB Mount Alignment Type Locating Posts
  • Centerline (Pitch) .6
  • Housing Material High Temperature Thermoplastic
  • Stack Height 8
  • Height 8
  • Mating Post Length 1
  • Operating Temperature Range -40 – 85
  • High Temperature Compatible Yes
  • Pick and Place Cover Without
  • Circuit Application Signal
  • For Use With Receptacle
  • UL Flammability Rating UL 94V-0
  • Packaging Method Reel
  • Packaging Quantity 600
1-5353232-0 Board-to-Board Headers & Receptacles
  • Connector Assembly Type PCB Mount Header
  • Connector System Board-to-Board
  • Connector & Contact Terminates To Printed Circuit Board
  • Series Free Height
  • Ground Component Type Grounding Contact
  • Connector Type Connector Assembly
  • Boss Yes
  • Product Type Connector
  • Stackable Yes
  • PCB Mount Orientation Vertical
  • Number of Positions 280
  • Board-to-Board Configuration Mezzanine
  • Number of Rows 2
  • Post Entry Direction With
  • Dielectric Withstanding Voltage 200
  • Insulation Resistance 280
  • Voltage 50
  • Insulation Resistance 2
  • Busbar Mating Area Plating Thickness 200
  • Contact Base Material Copper Alloy
  • PCB Contact Termination Area Plating Material Tin
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .2
  • Contact Type Pin
  • Contact Current Rating (Max) .5
  • PCB Contact Termination Area Plating Thickness 1
  • Contact Plating Thickness 1
  • Contact Layout Inline
  • Termination Method to Printed Circuit Board Surface Mount
  • PCB Mount Retention Type Solder Peg
  • Mating Alignment With
  • Mating Alignment Type Polarization
  • PCB Mount Retention With
  • PCB Mount Alignment With
  • PCB Mount Alignment Type Locating Posts
  • Centerline (Pitch) .6
  • Housing Material High Temperature Thermoplastic
  • Stack Height 6
  • Height 6
  • Mating Post Length 1
  • Operating Temperature Range -40 – 85
  • Assembly Process Feature Vacuum Cover
  • Pick and Place Cover With
  • Circuit Application Signal
  • For Use With Receptacle
  • UL Flammability Rating UL 94V-0
  • Packaging Method Reel
  • Packaging Quantity 400
1-5353284-0 Board-to-Board Headers & Receptacles
  • Connector Assembly Type PCB Mount Header
  • Connector System Board-to-Board
  • Connector & Contact Terminates To Printed Circuit Board
  • Series Free Height
  • Ground Component Type Grounding Contact
  • Connector Type Connector Assembly
  • Boss Yes
  • Product Type Connector
  • Stackable Yes
  • PCB Mount Orientation Vertical
  • Number of Positions 280
  • Board-to-Board Configuration Mezzanine
  • Number of Rows 2
  • Post Entry Direction With
  • Dielectric Withstanding Voltage 200
  • Insulation Resistance 280
  • Voltage 50
  • Insulation Resistance 2
  • Busbar Mating Area Plating Thickness 200
  • Contact Base Material Copper Alloy
  • PCB Contact Termination Area Plating Material Tin
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .2
  • Contact Type Pin
  • Contact Current Rating (Max) .5
  • PCB Contact Termination Area Plating Thickness 1
  • Contact Plating Thickness 1
  • Contact Layout Inline
  • Termination Method to Printed Circuit Board Surface Mount
  • PCB Mount Retention Type Solder Peg
  • Mating Alignment With
  • Mating Alignment Type Polarization
  • PCB Mount Retention With
  • PCB Mount Alignment With
  • PCB Mount Alignment Type Locating Posts
  • Centerline (Pitch) .6
  • Housing Material High Temperature Thermoplastic
  • Stack Height 4
  • Height 4
  • Mating Post Length 1
  • Operating Temperature Range -40 – 85
  • Assembly Process Feature Vacuum Cover
  • Pick and Place Cover With
  • Circuit Application Signal
  • For Use With Receptacle
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tape
  • Packaging Quantity 550
1-5353720-0 Board-to-Board Headers & Receptacles
  • Connector Assembly Type PCB Mount Header
  • Connector System Board-to-Board
  • Connector & Contact Terminates To Printed Circuit Board
  • Series Free Height
  • Ground Component Type Grounding Contact
  • Connector Type Connector Assembly
  • Boss Yes
  • Product Type Connector
  • PCB Mount Orientation Vertical
  • Number of Positions 280
  • Board-to-Board Configuration Mezzanine
  • Number of Rows 2
  • Post Entry Direction With
  • Dielectric Withstanding Voltage 200
  • Insulation Resistance 280
  • Voltage 50
  • Insulation Resistance 2
  • Busbar Mating Area Plating Thickness 200
  • Contact Base Material Copper Alloy
  • PCB Contact Termination Area Plating Material Tin
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .2
  • Contact Type Pin
  • Contact Current Rating (Max) .5
  • PCB Contact Termination Area Plating Thickness 1
  • Contact Plating Thickness 1
  • Contact Layout Inline
  • Termination Method to Printed Circuit Board Surface Mount
  • PCB Mount Retention Type Solder Peg
  • Mating Alignment With
  • Mating Alignment Type Polarization
  • PCB Mount Retention With
  • PCB Mount Alignment With
  • PCB Mount Alignment Type Locating Posts
  • Centerline (Pitch) .6
  • Housing Material High Temperature Thermoplastic
  • Stack Height 4
  • Height 4
  • Mating Post Length 1
  • Operating Temperature Range -40 – 85
  • Assembly Process Feature Vacuum Cover
  • Pick and Place Cover With
  • Circuit Application Signal
  • For Use With Receptacle
  • UL Flammability Rating UL 94V-0
  • Packaging Method Box & Tray
  • Packaging Quantity 18
1-5353831-1 Board-to-Board Headers & Receptacles
  • Connector Assembly Type PCB Mount Header
  • Connector System Board-to-Board
  • Connector & Contact Terminates To Printed Circuit Board
  • Series Free Height
  • Ground Component Type Grounding Contact
  • Connector Type Connector Assembly
  • Boss Yes
  • Product Type Connector
  • Stackable Yes
  • PCB Mount Orientation Vertical
  • Number of Positions 160
  • Board-to-Board Configuration Mezzanine
  • Number of Rows 2
  • Dielectric Withstanding Voltage 200
  • Insulation Resistance 160
  • Voltage 50
  • Insulation Resistance 2
  • Busbar Mating Area Plating Thickness 200
  • Contact Base Material Copper Alloy
  • PCB Contact Termination Area Plating Material Tin
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .2
  • Contact Type Pin
  • Contact Current Rating (Max) .5
  • PCB Contact Termination Area Plating Thickness 1
  • Contact Plating Thickness 1
  • Contact Layout Inline
  • Termination Method to Printed Circuit Board Surface Mount
  • PCB Mount Retention Type Solder Peg
  • Mating Alignment With
  • Mating Alignment Type Polarization
  • PCB Mount Retention With
  • PCB Mount Alignment With
  • Connector Mounting Type Board Mount
  • PCB Mount Alignment Type Locating Posts
  • Centerline (Pitch) .6
  • Housing Material High Temperature Thermoplastic
  • Stack Height 7
  • Height 7
  • Operating Temperature Range -40 – 85
  • Pick and Place Cover Without
  • Circuit Application Signal
  • For Use With Receptacle
  • UL Flammability Rating UL 94V-0
  • Packaging Method Reel
  • Packaging Quantity 700
1-6123086-0 Board-to-Board Headers & Receptacles
  • Connector Assembly Type PCB Mount Header
  • Connector System Board-to-Board
  • Connector & Contact Terminates To Printed Circuit Board
  • Series Free Height
  • Ground Component Type Grounding Contact
  • Connector Type Connector Assembly
  • Boss Yes
  • Product Type Connector
  • Stackable No
  • PCB Mount Orientation Vertical
  • Number of Positions 280
  • Board-to-Board Configuration Mezzanine
  • Number of Rows 2
  • Post Entry Direction With
  • Dielectric Withstanding Voltage 200
  • Insulation Resistance 280
  • Voltage 50
  • Insulation Resistance 2
  • Busbar Mating Area Plating Thickness 200
  • Contact Base Material Copper Alloy
  • PCB Contact Termination Area Plating Material Tin
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .2
  • Contact Type Pin
  • Contact Current Rating (Max) .5
  • PCB Contact Termination Area Plating Thickness .1
  • Contact Plating Thickness 1
  • Contact Layout Inline
  • Termination Method to Printed Circuit Board Surface Mount
  • PCB Mount Retention Type Solder Peg
  • Mating Alignment With
  • Mating Alignment Type Polarization
  • PCB Mount Retention With
  • PCB Mount Alignment With
  • PCB Mount Alignment Type Locating Posts
  • Centerline (Pitch) .6
  • Housing Material High Temperature Thermoplastic
  • Stack Height 6
  • Height 7.45
  • Mating Post Length 1
  • Operating Temperature Range -40 – 85
  • Assembly Process Feature Vacuum Cover
  • Pick and Place Cover With
  • Circuit Application Signal
  • For Use With Receptacle Assembly
  • UL Flammability Rating UL 94V-0
  • Packaging Method Box & Tray
  • Packaging Quantity 18
1-6123098-0 Board-to-Board Headers & Receptacles
  • Connector Assembly Type PCB Mount Header
  • Connector System Board-to-Board
  • Connector & Contact Terminates To Printed Circuit Board
  • Series Free Height
  • Ground Component Type Grounding Contact
  • Connector Type Connector Assembly
  • Boss Yes
  • Product Type Connector
  • Stackable No
  • PCB Mount Orientation Vertical
  • Number of Positions 280
  • Board-to-Board Configuration Mezzanine
  • Number of Rows 2
  • Post Entry Direction With
  • Dielectric Withstanding Voltage 200
  • Insulation Resistance 280
  • Voltage 50
  • Insulation Resistance 2
  • Busbar Mating Area Plating Thickness 200
  • Contact Base Material Copper Alloy
  • PCB Contact Termination Area Plating Material Tin
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .2
  • Contact Type Pin
  • Contact Current Rating (Max) .5
  • PCB Contact Termination Area Plating Thickness 1
  • Contact Plating Thickness 1
  • Contact Layout Inline
  • Termination Method to Printed Circuit Board Surface Mount
  • PCB Mount Retention Type Solder Peg
  • Mating Alignment With
  • Mating Alignment Type Polarization
  • PCB Mount Retention With
  • PCB Mount Alignment With
  • PCB Mount Alignment Type Locating Posts
  • Centerline (Pitch) .6
  • Housing Material High Temperature Thermoplastic
  • Stack Height 12
  • Height 13.45
  • Mating Post Length 1
  • Operating Temperature Range -40 – 85
  • Assembly Process Feature Vacuum Cover
  • Pick and Place Cover With
  • Circuit Application Signal
  • For Use With Receptacle Assembly
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tray
  • Packaging Quantity 18