New step forward in density and overall performance
New Power Connectors Deliver Higher Density, Better Connectivity Tolerance
June 13, 2017
Harrisburg, Pa. – June 13, 2017 – TE Connectivity (TE), a world leader in connectivity and sensors, announced today its new MULTI-BEAM card edge connectors, a new portfolio of power card edge connectors that deliver the highest signal density in the market with better connectivity tolerance and better performance in a unique, modular design.
The new MULTI-BEAM card edge connectors deliver up to 30 percent power density improvement and up to 60 percent signal density improvement over current products. They offer the best overall power and signal density to address server market requirements in performance, profile and cost.
MULTI-BEAM card edge connectors also offer a new level of design flexibility over TE’s current SEC-II power card edge products, and they deliver superior current and signal density with an exclusive TE design. The scalable and modular design also supports greater flexibility in configuration and PCB design. MULTI-BEAM card edge connectors are ideal for data center, telecom, industrial automation devices and power system applications.
“Power system designers continually strive to deliver denser products with higher performance, but legacy card edge connectors limit signal and power density at the card edge,” said Bandy Yuan, product manager at TE Connectivity’s Data and Devices business unit. “Our new MULTI-BEAM card edge connectors offer a new step forward in density and overall performance, enabling more design flexibility in the system and on the PCB.”
MULTI-BEAM card edge connectors from TE are available immediately.
