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About TE Connectivity (TE)
Industry & New Product News
May 22, 2013
The new line of M.2 next generation form factor (NGFF) connectors are smaller in both size and volume. Engineered for a wide range of applications, these M.2 NGFF connectors meet both current and future market needs for slim solutions.
February 20, 2013
Our new, low-profile battery connector with a height of 1.9mm, provides you with flexibility for your mobile device design, a reliable connection, and a competitive production cost.
February 4, 2013
Our new, low profile, single-sided double-data-rate 3 (DDR3) small outline dual in-line memory module (SODIMM) connector delivers peak performance with high-speed data applications.
January 23, 2013
On January 23, 2013, we released our ultra low profile push-pull micro SIM connector, an advanced hardware solution designed to increase efficiency while reducing end-product cost and size.
January 9, 2013
This novel 0.4mm fine pitch board-to-board (BtB) connector features a stack height of 0.6mm and is designed to meet the increasing demand for thinner and smaller consumer electronics devices.