5G networks will support exponentially higher data loads, a key factor in the evolution of smarter AI. With access to richer data, improved AIs will boost 5G performance by enhancing security, reducing congestion, and fixing network issues in real time. And with 5G and AI working together, data will become more valuable than ever before.
Data is just ones and zeros—until you do something with it.
Why choose TE Connectivity as your design partner? For starters, we’re years ahead of the development curve. In fact, some our products are three generations beyond the current standard. Our solutions enable higher speeds, lower latency, enhanced thermal efficiency, and increased flexibility.
Free Height Connectors
With up to three times the speed of their predecessor, Free Height Connectors are capable of rates over 32 Gbps. They’re an excellent choice for applications that require parallel stacked PCBs. Free Height Connectors provide a range of position sizes from 40–440 positions in contact pitches of 0.5, 0.6, 0.8, and 1.0mm. Board-to-board stack heights range from 4-20mm in 1mm increments.
Card Edge Connectors
With a smaller footprint and higher signal integrity, our Card Edge Connectors provide flexibility in PCIe protocol applications. With a smaller footprint and higher signal integrity, our Card Edge Connectors provide reliable performance and design flexibility in PCIe protocol applications. We offer a wide range of options to support add-in cards and modules, including WiFi, Bluetooth, global navigation satellite systems, near field communication, and Wireless Gigabit Alliance (WiGig).
The STRADA Whisper backplane family was designed for high-performing, high-bandwidth systems. Its revolutionary design transfers data at speeds of 25 Gbps and offers unparalleled scalability up to 112 Gbps—allowing you to achieve efficient future system upgrades without costly backplane or midplane redesigns.
With 28 Gbps data rates for 400 Gbps total bandwidth, CDFP connectors, cages, and cable assemblies can easily handle today’s increasing data usage. The one-piece, pluggable I/O assembly provides the flexibility and standardization needed in high-speed networking and high-performance computing applications.
Our OSFP connectors and cable assemblies support aggregate data rates of 200G and up to 400 Gbps. Thanks to integrated thermal heatsink technology in the plug, OSFP products provide the thermal performance and signal integrity to support 400G data rates.
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Designed to be one of the most flexible solutions on the market for making internal I/O connections on the board, Sliver connectors and cable assembly systems help extend high data signals inside networking equipment while maintaining optimal signal integrity.
We offer 5G antennas for use in a variety of automotive, commercial transportation, rail and consumer device applications. Our solutions provide high-quality transmissions in wireless devices in a wide variety of frequencies, including Bluetooth, WLAN, cellular, and ZigBee.
Pack more power into smaller spaces with our ELCON Mini Power interconnects, which feature a small, 8mm height form-factor and support higher currents than similar sized solutions (up to 40 Amps per contact, 400 Volts AC or DC). Features include positive metal latch retention, optional coding contacts for sense/detect functionality, enhanced grounding, and use of industry-proven crimp contacts.
Our LGA sockets provide a compressive electrical interconnect between the processor and the printed circuit board (PCB). As computing power increases, so does the chips' pin counts. A robust bolster plate provides a reliable interconnection to the microprocessor package and limits PCB bowing during compression to ensure a reliable connection. The contact tip geometry is optimized to reduce risk of contact damage during handling and package installation.
High-Speed Cable Assemblies
Supporting the latest high-speed standards, our high-speed pluggable I/O copper cable assemblies are engineered for 56 Gbps and beyond. Our signal integrity (SI) and system architecture expertise allow us to provide one of the highest performing portfolios for QSFP28/56 and SFP28/56 cable assemblies in the market. These cable assemblies are at the forefront of next-generation connectivity, meeting 100G Ethernet and InfiniBand Enhanced Data Rate (EDR) requirements. We offer custom cabling solutions and corresponding pluggable I/O cages and connectors.
Our unique thermal bridge technology provides up to 2x better thermal resistance over traditional thermal technologies such as gap pads or thermal pads. This solution was developed as customers seek ways to dissipate more heat associated with increasing system power requirements, specifically in fixed cooling applications with restricted airflow, liquid cooling or cold plates.
Our FullAXS connector sealing systems are designed to function with a very large Z-axis tolerance.The FullAXS Mini and FullAXS product portfolio offers ODVA standard solutions for your WiMAX and LTE fiber, power, and x-TTA connectivity designs. Designed for a broad range of transceivers, and with a connector shell that allows for easy one-handed mating, the product offers a bulkhead construction to plug these cable assemblies directly into optical transceivers or other connector types. The FullAXS Mini connector sealing system and cable assembly helps reduce the physical footprint and installation costs of wireless outdoor products.
STRADA Mesa Connectors
We offer the STRADA Mesa mezzanine connector to provide a stacking, board-to-board connection solution for efficient PCB space utilization. The STRADA Mesa product design delivers a high-speed performance of +15 Gbps. In addition, the design provides three pin and socket signal contact arrangement options -- high-speed differential, high-density single-ended and RF/ Coaxial -- to suit various application requirements.