86432-1 Board-to-Board Connector Contacts
  • Applied Pressure High
  • Connector System Board-to-Board
  • Connector & Contact Terminates To Printed Circuit Board
  • Contact Resistance 12
  • Insulation Resistance 5000
  • Dielectric Withstanding Voltage (Max) 1200
  • Printed Circuit Board Hole Shape Round
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin
  • Contact Mating Area Plating Material Thickness 2.0066
  • PCB Contact Termination Area Plating Material Thickness 2.0066
  • Contact Type Socket
  • Contact Mating Area Plating Material Tin
  • Contact Orientation Horizontal
  • Contact Current Rating (Max) 5
  • Termination Post & Tail Length 3.68
  • PCB Mount Retention Without
  • Wire Insulation Support Without
  • Connector Mounting Type Board Mount
  • Mating Entry Location Side
  • Centerline (Pitch) 3.81
  • PCB Thickness (Recommended) 1.4 – 2.62
  • Operating Temperature Range -65 – 105
  • Circuit Application Signal
  • Packaging Method Reel
  • Packaging Quantity 5000
102100-5 Board-to-Board Connector Contacts
  • Applied Pressure High
  • Connector System Board-to-Board
  • Connector & Contact Terminates To Wire & Cable
  • Contact Resistance 12
  • Insulation Resistance 5000
  • Dielectric Withstanding Voltage (Max) 1200
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin
  • Contact Mating Area Plating Material Thickness .4064
  • PCB Contact Termination Area Plating Material Thickness .4064
  • Contact Type Socket
  • Contact Mating Area Plating Material Tin
  • Contact Orientation Straight
  • Contact Current Rating (Max) 5
  • PCB Mount Retention Without
  • Wire Insulation Support With
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) 3.81
  • Accepts Wire Insulation Diameter Range 1.3 – 2.29
  • Wire Size 22 – 18
  • Wire Size .3 – .9
  • Operating Temperature Range -65 – 105
  • Circuit Application Signal
  • Packaging Method Reel
  • Packaging Quantity 5000
  • Comment Applicators also available for AMPOMATOR Lead Making Machines and Stripper/Crimper Machines. Consult AMP, Inc.
102099-5 Board-to-Board Connector Contacts
  • Applied Pressure Standard
  • Connector System Board-to-Board
  • Connector & Contact Terminates To Wire & Cable
  • Contact Resistance 12
  • Insulation Resistance 5000
  • Dielectric Withstanding Voltage (Max) 1200
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin
  • Contact Mating Area Plating Material Thickness .4064
  • PCB Contact Termination Area Plating Material Thickness .4064
  • Contact Type Socket
  • Contact Mating Area Plating Material Tin
  • Contact Orientation Straight
  • Contact Current Rating (Max) 5
  • PCB Mount Retention Without
  • Wire Insulation Support With
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) 3.81
  • Accepts Wire Insulation Diameter Range 1.3 – 2.29
  • Wire Size 22 – 18
  • Wire Size .3 – .9
  • Operating Temperature Range -65 – 105
  • Circuit Application Signal
  • Packaging Method Reel
  • Packaging Quantity 5000
  • Comment Applicators also available for AMPOMATOR Lead Making Machines and Stripper/Crimper Machines. Consult AMP, Inc.
182198-1 Board-to-Board Connector Contacts
  • Applied Pressure High
  • Connector System Board-to-Board
  • Connector & Contact Terminates To Wire & Cable
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin
  • Contact Mating Area Plating Material Thickness .762
  • PCB Contact Termination Area Plating Material Thickness .762
  • Contact Type Socket
  • Contact Mating Area Plating Material Tin
  • Contact Orientation Straight
  • Contact Current Rating (Max) 5
  • PCB Mount Retention Without
  • Wire Insulation Support With
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) 3.81
  • Accepts Wire Insulation Diameter Range 1.8 – 2.3
  • Wire Size 22 – 18
  • Wire Size .3 – .9
  • Operating Temperature Range -40 – 105
  • Circuit Application Signal
  • Packaging Method Loose Piece
  • Packaging Quantity 2000
166722-1 Board-to-Board Connector Contacts  1
  • Applied Pressure Standard
  • Connector System Cable-to-Cable
  • Sealable No
  • Connector & Contact Terminates To Wire & Cable
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin-Lead
  • Contact Mating Area Plating Material Thickness .8
  • Contact Type Socket
  • Contact Mating Area Plating Material Gold
  • Contact Orientation Straight
  • Contact Current Rating (Max) 3
  • Termination Method to Wire & Cable Crimp
  • PCB Mount Retention Without
  • Wire Insulation Support With
  • Connector Mounting Type Cable Mount (Free-Hanging)
  • Accepts Wire Insulation Diameter Range .91 – 1.37
  • Wire Size 24 – 20
  • Wire Size .21 – .51
  • Operating Temperature Range -65 – 105
  • Circuit Application Power & Signal
  • Packaging Method Loose Piece
  • Packaging Quantity 200
280621-2 Board-to-Board Connector Contacts
  • Applied Pressure Standard
  • Connector System Board-to-Board
  • Connector & Contact Terminates To Wire & Cable
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Gold Flash
  • Contact Mating Area Plating Material Thickness .4
  • Contact Type Socket
  • Contact Mating Area Plating Material Gold
  • Contact Orientation Straight
  • Contact Current Rating (Max) 5
  • PCB Mount Retention Without
  • Wire Insulation Support With
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) 3.81
  • Accepts Wire Insulation Diameter Range 1.8 – 2.3
  • Wire Size 22 – 18
  • Wire Size .3 – .9
  • Operating Temperature Range -40 – 105
  • Circuit Application Signal
  • Packaging Method Package
  • Packaging Quantity 5000
102100-1 Board-to-Board Connector Contacts
PRODUCT
  1. Connectors
  2. Board-to-Board Connector Contacts
  1. MOD I RECP PLTD 15 SEL 102100-1
active
  • Applied Pressure High
  • Connector System Board-to-Board
  • Connector & Contact Terminates To Wire & Cable
  • Contact Resistance 12
  • Insulation Resistance 5000
  • Dielectric Withstanding Voltage (Max) 1200
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Gold Flash
  • Contact Mating Area Plating Material Thickness .381
  • Contact Type Socket
  • Contact Mating Area Plating Material Gold
  • Contact Orientation Straight
  • Contact Current Rating (Max) 5
  • PCB Mount Retention Without
  • Wire Insulation Support With
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) 3.81
  • Accepts Wire Insulation Diameter Range 1.3 – 2.29
  • Wire Size 22 – 18
  • Wire Size .3 – .9
  • Operating Temperature Range -65 – 105
  • Circuit Application Signal
  • Packaging Method Reel
  • Packaging Quantity 5000
  • Comment Applicators also available for AMPOMATOR Lead Making Machines and Stripper/Crimper Machines. Consult AMP, Inc.
281423-1 Board-to-Board Connector Contacts
  • Applied Pressure High
  • Connector System Board-to-Board
  • Connector & Contact Terminates To Wire & Cable
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin
  • Contact Mating Area Plating Material Thickness .8
  • PCB Contact Termination Area Plating Material Thickness .8
  • Contact Type Socket
  • Contact Mating Area Plating Material Tin
  • Contact Orientation Straight
  • Contact Current Rating (Max) 5
  • PCB Mount Retention Without
  • Wire Insulation Support With
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) 3.81
  • Accepts Wire Insulation Diameter Range 2.2 – 2.8
  • Wire Size 20 – 17
  • Wire Size .5 – 1
  • Operating Temperature Range -40 – 105
  • Circuit Application Signal
  • Packaging Method Reel
  • Packaging Quantity 5000
85487-5 Board-to-Board Connector Contacts  1
PRODUCT
  1. Connectors
  2. Board-to-Board Connector Contacts
  1. MOD I RECP PLTD 15 SEL 85487-5
active
  • Applied Pressure Standard
  • Connector System Board-to-Board
  • Connector & Contact Terminates To Printed Circuit Board
  • Contact Resistance 12
  • Insulation Resistance 5000
  • Dielectric Withstanding Voltage (Max) 1200
  • Printed Circuit Board Hole Shape Round
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Gold
  • Contact Mating Area Plating Material Thickness .381
  • Contact Type Socket
  • Contact Mating Area Plating Material Gold
  • Contact Orientation Horizontal
  • Contact Current Rating (Max) 5
  • Termination Post & Tail Length 3.68
  • PCB Mount Retention Without
  • Wire Insulation Support Without
  • Connector Mounting Type Board Mount
  • Mating Entry Location Side
  • Centerline (Pitch) 3.81
  • PCB Thickness (Recommended) 1.4 – 2.62
  • Operating Temperature Range -65 – 105
  • Circuit Application Signal
  • Packaging Method Reel
  • Packaging Quantity 5000
280621-1 Board-to-Board Connector Contacts
PRODUCT
  1. Connectors
  2. Board-to-Board Connector Contacts
  1. MOD I CRIMP CONTACT 280621-1
active
  • Applied Pressure Standard
  • Connector System Board-to-Board
  • Connector & Contact Terminates To Wire & Cable
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin
  • Contact Mating Area Plating Material Thickness .8
  • PCB Contact Termination Area Plating Material Thickness .8
  • Contact Type Socket
  • Contact Mating Area Plating Material Tin
  • Contact Orientation Straight
  • Contact Current Rating (Max) 5
  • PCB Mount Retention Without
  • Wire Insulation Support With
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) 3.81
  • Accepts Wire Insulation Diameter Range 1.8 – 2.3
  • Wire Size 22 – 18
  • Wire Size .3 – .9
  • Operating Temperature Range -40 – 105
  • Circuit Application Signal
  • Packaging Method Carton
  • Packaging Quantity 5000
102100-2 Board-to-Board Connector Contacts
PRODUCT
  1. Connectors
  2. Board-to-Board Connector Contacts
  1. MOD I RECP PLTD 30 SEL 102100-2
active
  • Applied Pressure High
  • Connector System Board-to-Board
  • Connector & Contact Terminates To Wire & Cable
  • Contact Resistance 12
  • Insulation Resistance 5000
  • Dielectric Withstanding Voltage (Max) 1200
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Gold Flash
  • Contact Mating Area Plating Material Thickness .762
  • Contact Type Socket
  • Contact Mating Area Plating Material Gold
  • Contact Orientation Straight
  • Contact Current Rating (Max) 5
  • PCB Mount Retention Without
  • Wire Insulation Support With
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) 3.81
  • Accepts Wire Insulation Diameter Range 1.3 – 2.29
  • Wire Size 22 – 18
  • Wire Size .3 – .9
  • Operating Temperature Range -65 – 105
  • Circuit Application Signal
  • Packaging Method Reel
  • Packaging Quantity 5000
  • Comment Applicators also available for AMPOMATOR Lead Making Machines and Stripper/Crimper Machines. Consult AMP, Inc.
280702-1 Board-to-Board Connector Contacts
  • Applied Pressure High
  • Connector System Board-to-Board
  • Connector & Contact Terminates To Wire & Cable
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin
  • Contact Mating Area Plating Material Thickness .8
  • PCB Contact Termination Area Plating Material Thickness .8
  • Contact Type Socket
  • Contact Mating Area Plating Material Tin
  • Contact Orientation Straight
  • Contact Current Rating (Max) 5
  • PCB Mount Retention Without
  • Wire Insulation Support With
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) 3.81
  • Accepts Wire Insulation Diameter Range 1.8 – 2.3
  • Wire Size 22 – 18
  • Wire Size .3 – .9
  • Operating Temperature Range -40 – 105
  • Circuit Application Signal
  • Packaging Method Reel
  • Packaging Quantity 5000
102099-2 Board-to-Board Connector Contacts
PRODUCT
  1. Connectors
  2. Board-to-Board Connector Contacts
  1. MOD I RECP PLTD 30 SEL 102099-2
active
  • Applied Pressure Standard
  • Connector System Board-to-Board
  • Connector & Contact Terminates To Wire & Cable
  • Contact Resistance 12
  • Insulation Resistance 5000
  • Dielectric Withstanding Voltage (Max) 1200
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Gold Flash
  • Contact Mating Area Plating Material Thickness .762
  • Contact Type Socket
  • Contact Mating Area Plating Material Gold
  • Contact Orientation Straight
  • Contact Current Rating (Max) 5
  • PCB Mount Retention Without
  • Wire Insulation Support With
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) 3.81
  • Accepts Wire Insulation Diameter Range 1.3 – 2.29
  • Wire Size 22 – 18
  • Wire Size .3 – .9
  • Operating Temperature Range -65 – 105
  • Circuit Application Signal
  • Packaging Method Reel
  • Packaging Quantity 5000
  • Comment Applicators also available for AMPOMATOR Lead Making Machines and Stripper/Crimper Machines. Consult AMP, Inc.
85493-4 Board-to-Board Connector Contacts
  • Applied Pressure Standard
  • Connector System Board-to-Board
  • Connector & Contact Terminates To Printed Circuit Board
  • Contact Resistance 12
  • Insulation Resistance 5000
  • Dielectric Withstanding Voltage (Max) 1200
  • Printed Circuit Board Hole Shape Round
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Gold
  • Contact Mating Area Plating Material Thickness .762
  • PCB Contact Termination Area Plating Material Thickness 1.26999746
  • Contact Type Socket
  • Contact Mating Area Plating Material Gold
  • Contact Orientation Horizontal
  • Contact Current Rating (Max) 5
  • Termination Post & Tail Length 3.68
  • PCB Mount Retention Without
  • Wire Insulation Support Without
  • Connector Mounting Type Board Mount
  • Mating Entry Location Side
  • Centerline (Pitch) 3.81
  • PCB Thickness (Recommended) 1.4 – 2.62
  • Operating Temperature Range -65 – 105
  • Circuit Application Signal
  • Packaging Method Loose Piece
  • Packaging Quantity 1000
181299-1 Board-to-Board Connector Contacts
PRODUCT
  1. Connectors
  2. Board-to-Board Connector Contacts
  1. MOD I CRIMP CONTACT 181299-1
active
  • Applied Pressure Standard
  • Connector System Board-to-Board
  • Connector & Contact Terminates To Wire & Cable
  • Operating Voltage 40
  • Contact Resistance 15
  • Insulation Resistance 5000
  • Dielectric Withstanding Voltage (Max) 1200
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin
  • Contact Mating Area Plating Material Thickness .8
  • PCB Contact Termination Area Plating Material Thickness .7999984
  • Contact Type Socket
  • Contact Mating Area Plating Material Tin
  • Contact Orientation Straight
  • Contact Current Rating (Max) 5
  • Termination Method to Wire & Cable Crimp
  • PCB Mount Retention Without
  • Wire Insulation Support With
  • Contact Retention Type Within Housing Snap-In
  • Connector Mounting Type Board Mount
  • Mating Entry Location Top
  • Centerline (Pitch) 3.81
  • Accepts Wire Insulation Diameter Range 1.8 – 2.3
  • Wire Size 22 – 18
  • Wire Size .3 – .9
  • Operating Temperature Range -40 – 105
  • Circuit Application Signal
  • Packaging Method Loose Piece
  • Packaging Quantity 2000
181299-2 Board-to-Board Connector Contacts
  • Applied Pressure Standard
  • Connector System Board-to-Board
  • Connector & Contact Terminates To Wire & Cable
  • Operating Voltage 40
  • Contact Resistance 15
  • Insulation Resistance 5000
  • Dielectric Withstanding Voltage (Max) 1200
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Gold Flash
  • Contact Mating Area Plating Material Thickness .4
  • Contact Type Socket
  • Contact Mating Area Plating Material Gold
  • Contact Orientation Straight
  • Contact Current Rating (Max) 5
  • Termination Method to Wire & Cable Crimp
  • PCB Mount Retention Without
  • Wire Insulation Support With
  • Contact Retention Type Within Housing Snap-In
  • Connector Mounting Type Board Mount
  • Mating Entry Location Top
  • Centerline (Pitch) 3.81
  • Accepts Wire Insulation Diameter Range 1.8 – 2.3
  • Wire Size 22 – 18
  • Wire Size .3 – .9
  • Operating Temperature Range -40 – 105
  • Circuit Application Signal
  • Packaging Method Loose Piece
  • Packaging Quantity 2000
102103-3 Board-to-Board Connector Contacts
  • Applied Pressure Standard
  • Connector System Board-to-Board
  • Connector & Contact Terminates To Wire & Cable
  • Contact Resistance 12
  • Insulation Resistance 5000
  • Dielectric Withstanding Voltage (Max) 1200
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin
  • Contact Mating Area Plating Material Thickness .4064
  • PCB Contact Termination Area Plating Material Thickness .4064
  • Contact Type Socket
  • Contact Mating Area Plating Material Tin
  • Contact Orientation Straight
  • Contact Current Rating (Max) 5
  • PCB Mount Retention Without
  • Wire Insulation Support With
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) 3.81
  • Accepts Wire Insulation Diameter Range 1.3 – 2.29
  • Wire Size 22 – 18
  • Wire Size .3 – .9
  • Operating Temperature Range -65 – 105
  • Circuit Application Signal
  • Packaging Method Loose Piece
  • Packaging Quantity 1000
  • Comment Applicators also available for AMPOMATOR Lead Making Machines and Stripper/Crimper Machines. Consult AMP, Inc.
87003-2 Board-to-Board Connector Contacts
  • Applied Pressure Standard
  • Connector System Board-to-Board
  • Connector & Contact Terminates To Printed Circuit Board
  • Contact Resistance 12
  • Insulation Resistance 5000
  • Dielectric Withstanding Voltage (Max) 1200
  • Printed Circuit Board Hole Shape Round
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin
  • Contact Mating Area Plating Material Thickness 2.0066
  • PCB Contact Termination Area Plating Material Thickness 2.0066
  • Contact Type Socket
  • Contact Mating Area Plating Material Tin
  • Contact Orientation Straight
  • Contact Current Rating (Max) 5
  • Termination Post & Tail Length 2.85
  • PCB Mount Retention Without
  • Wire Insulation Support Without
  • Connector Mounting Type Board Mount
  • Mating Entry Location Top
  • Centerline (Pitch) 3.81
  • PCB Thickness (Recommended) 1.4 – 1.78
  • Operating Temperature Range -65 – 105
  • Circuit Application Signal
  • Packaging Method Reel
  • Packaging Quantity 5000
85487-4 Board-to-Board Connector Contacts  1
PRODUCT
  1. Connectors
  2. Board-to-Board Connector Contacts
  1. MOD I RECP PLTD 30 SEL 85487-4
active
  • Applied Pressure Standard
  • Connector System Board-to-Board
  • Connector & Contact Terminates To Printed Circuit Board
  • Contact Resistance 12
  • Insulation Resistance 5000
  • Dielectric Withstanding Voltage (Max) 1200
  • Printed Circuit Board Hole Shape Round
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Gold
  • Contact Mating Area Plating Material Thickness .762
  • Contact Type Socket
  • Contact Mating Area Plating Material Gold
  • Contact Orientation Horizontal
  • Contact Current Rating (Max) 5
  • Termination Post & Tail Length 3.68
  • PCB Mount Retention Without
  • Wire Insulation Support Without
  • Connector Mounting Type Board Mount
  • Mating Entry Location Side
  • Centerline (Pitch) 3.81
  • PCB Thickness (Recommended) 1.4 – 2.62
  • Operating Temperature Range -65 – 105
  • Circuit Application Signal
  • Packaging Method Reel
  • Packaging Quantity 5000
86448-1 Board-to-Board Connector Contacts
  • Applied Pressure High
  • Connector System Board-to-Board
  • Connector & Contact Terminates To Printed Circuit Board
  • Printed Circuit Board Hole Shape Rectangular
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin
  • Contact Mating Area Plating Material Thickness .76
  • PCB Contact Termination Area Plating Material Thickness .76
  • Contact Type Socket
  • Contact Mating Area Plating Material Tin
  • Contact Orientation Straight
  • Contact Current Rating (Max) 5
  • Termination Post & Tail Length 2.85
  • PCB Mount Retention Without
  • Wire Insulation Support Without
  • Connector Mounting Type Board Mount
  • Mating Entry Location Top
  • Centerline (Pitch) 3.81
  • PCB Thickness (Recommended) 1.57
  • Operating Temperature Range -65 – 105
  • Circuit Application Signal
  • Packaging Method Reel
  • Packaging Quantity 5000