61668-2 Board-to-Board Connector Contacts
PRODUCT
  1. Connectors
  2. Board-to-Board Connector Contacts
  1. BIF-LEAF CONT CR/SNAP PTPPHBZ 61668-2
active
  • Connector System Wire-to-Board
  • Connector & Contact Terminates To Wire & Cable
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Pre-Tin
  • Contact Type Hermaphroditic
  • Contact Mating Area Plating Material Pre-Tin
  • Contact Orientation Straight
  • Contact Current Rating (Max) 6
  • Termination Method to Wire & Cable Crimp
  • PCB Mount Retention Without
  • Wire Insulation Support With
  • Contact Retention Type Within Housing Snap-In
  • Connector Mounting Type Board Mount
  • Accepts Wire Insulation Diameter Range 2.79
  • Wire Size 24 – 18
  • Wire Size .2 – .8
  • Operating Temperature Range -55 – 105
  • Circuit Application Signal
  • Packaging Method Box
  • Packaging Quantity 6000
61668-4 Board-to-Board Connector Contacts
PRODUCT
  1. Connectors
  2. Board-to-Board Connector Contacts
  1. BIF-LEAF CONT CR/SNAP AUPHBZ 61668-4
active
  • Connector System Wire-to-Board
  • Connector & Contact Terminates To Wire & Cable
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Nickel
  • Contact Mating Area Plating Material Thickness .762
  • PCB Contact Termination Area Plating Material Thickness .762
  • Contact Type Hermaphroditic
  • Contact Mating Area Plating Material Gold
  • Contact Orientation Straight
  • Contact Current Rating (Max) 6
  • Termination Method to Wire & Cable Crimp
  • PCB Mount Retention Without
  • Wire Insulation Support With
  • Contact Retention Type Within Housing Snap-In
  • Connector Mounting Type Board Mount
  • Accepts Wire Insulation Diameter Range 2.79
  • Wire Size 24 – 18
  • Wire Size .2 – .8
  • Operating Temperature Range -55 – 105
  • Circuit Application Signal
  • Packaging Method Package
  • Packaging Quantity 6000
3-61668-1 Board-to-Board Connector Contacts
PRODUCT
  1. Connectors
  2. Board-to-Board Connector Contacts
  1. BIF-LEAF CONT CR/SNAP SN/BR 3-61668-1
active
  • Connector System Wire-to-Board
  • Connector & Contact Terminates To Wire & Cable
  • Contact Base Material Brass
  • PCB Contact Termination Area Plating Material Tin
  • Contact Underplating Material Nickel
  • Contact Mating Area Plating Material Thickness 2.032 – 5.08
  • PCB Contact Termination Area Plating Material Thickness 2.032 – 5.08
  • Contact Type Hermaphroditic
  • Contact Mating Area Plating Material Tin
  • Contact Orientation Straight
  • Contact Current Rating (Max) 6
  • Termination Method to Wire & Cable Crimp
  • PCB Mount Retention Without
  • Wire Insulation Support With
  • Contact Retention Type Within Housing Snap-In
  • Connector Mounting Type Board Mount
  • Accepts Wire Insulation Diameter Range 2.79
  • Wire Size 24 – 18
  • Wire Size .2 – .8
  • Operating Temperature Range -55 – 105
  • Circuit Application Signal
  • Packaging Method Reel
  • Packaging Quantity 6000
61668-1 Board-to-Board Connector Contacts
PRODUCT
  1. Connectors
  2. Board-to-Board Connector Contacts
  1. BIF-LEAF CONT CR/SNAP SNPB/BR 61668-1
active
  • Connector System Wire-to-Board
  • Connector & Contact Terminates To Wire & Cable
  • Contact Base Material Brass
  • PCB Contact Termination Area Plating Material Tin-Lead
  • Contact Underplating Material Nickel
  • Contact Mating Area Plating Material Thickness 2.032 – 5.08
  • PCB Contact Termination Area Plating Material Thickness 2.032 – 5.08
  • Contact Type Hermaphroditic
  • Contact Mating Area Plating Material Tin-Lead
  • Contact Orientation Straight
  • Contact Current Rating (Max) 6
  • Termination Method to Wire & Cable Crimp
  • PCB Mount Retention Without
  • Wire Insulation Support With
  • Contact Retention Type Within Housing Snap-In
  • Connector Mounting Type Board Mount
  • Accepts Wire Insulation Diameter Range 2.79
  • Wire Size 24 – 18
  • Wire Size .2 – .8
  • Operating Temperature Range -55 – 105
  • Circuit Application Signal
  • Packaging Method Reel
  • Packaging Quantity 6000