FAQs about Electronics Miniaturization

Q: What is the bottleneck of miniaturization?

A: We believe that among the design challenges brought on by miniaturization, the most difficult challenge is to guarantee the performance and reliability of the miniaturized devices. Design engineers need to find an optimal balance between the two, and to engage with key partners early in the design process to ensure the right high-performance miniaturized components are selected.

Q: Miniaturization of connected devices means that the space requirement is reduced, but will that result in cost increase?

A: We believe the reduction in space requirements will reduce costs at a certain level: smaller device size and smaller PCB area often mean lower material costs. In addition, the demand for miniaturization will drive the increase in the degree of production automation, thereby improving production efficiency and reducing overall assembly costs.

However, from another perspective, the reduction of available space will bring challenges to the design of the devices - if not handled properly, the performance of the devices will be affected, which may result in a series of cost-recovery phenomena such as repairs and complaints. Therefore, at the beginning of the design, engineers should consider questions such as how to guarantee the performance of the devices and how to make the optimized choices of miniaturized components. Solving the challenges brought on by miniaturization with key partners is the key to improving cost efficiency.

Q: In addition to the demand for smaller sizes and stronger portability of connected devices, what are the other priorities within miniaturization?

A:  In addition to small size and portability, the user experience of consumer products is also a key to brand success. We all know that in the ever-changing connected devices market, user experience has a great influence on the brand. The user experience includes not only the functional differentiation of products, but also the stability of product quality. In addition to bringing some new functions and convenience to consumers, connected device manufacturers must also consider if the innovative functions and the device can be stable and durable enough to continue to bring convenience to consumers so that consumers’ trust and loyalty to the products and to the brand can be nurtured.

Q: Is components reliability relative to size? Is there a risk of losing capabilities with smaller components?

A: We believe that the reliability of components is not directly related to size, and the use of miniaturized components is an inevitable solution to the trend of miniaturization of connected devices. Miniaturized components do not necessarily and should not lead to a reduction in reliability. Taking signal connectors as an example, miniaturized connectors are different from the conventional connector only in the size, center spacing, wire gauge, and other specifications, but through different structural design, material use and connectivity technology, the stability of signal connectivity, the efficiency and the reliability of the connection, and the ability to apply to harsh environments will be the same as connectors that are larger.

Nonetheless, the selection of components such as connectors is still critical. Design engineers need to work with their component suppliers as early as possible in their design process to choose components that are suitable for their application and to avoid errors and unqualified options.

Q: How do miniaturized connectors ensure safety, reliability, and high efficiency of connectivity?

A: The security, reliability, and high efficiency of connectivity within miniaturized connectors are mainly achieved through the following aspects.

• Safety: The connectors have passed industry tests and comply with global industry standards, such as UL94-V0 and glow wire test requirements and are suitable for miniaturized smart devices.
• Reliability: Reliability of the miniaturized connectors is mainly impacted from using material, production technology and structural design. Various types of locking devices such as Terminal Position Assurance (TPAs), Connector Position Assurance (CPA), etc. can all play an effective role in ensuring the reliability of the connection and avoiding accidental disconnection. Also, in case of IP protection needs, some connectors will use sealings or plugs to enable waterproof protection.
• Efficiency: Efficiency of connector assembly is mainly ensured through use of innovative connectivity technology and ergonomic designs. For example, products using Insulation Displacement Connection (IDC) technology can be used in fully automatic machines without wire pre-stripping so that the assembly efficiency can be greatly improved. The following will all help reduce the risk of assembly errors and improve efficiency: Connector and terminal polarization, audible click and tactile feel, keying options and other error-proof design, low insertion force of the terminals and anti-snag latch of the housing.

Q: In which industries does Surface-Mounted Technology (SMT) apply? Compared with the traditional through-hole assembly, what are the advantages of SMT?

A: SMT technology is widely applied in the appliance and consumer electronics industries. Compared with the through-hole installation method, SMT can easily mount smaller and lighter components on the PCB, which saves space and is appropriate for efficient automation and high-density assembly. We have observed that this trend will go hand-in-hand with miniaturization and become standard equipment for the current and future connected devices.

Q: The density of various subsystems in smart devices is getting higher and higher, and the space is very limited. How can we achieve more complex device designs in the future?

A: With the increasing functions of connected devices, although their size continues to be miniaturized, the density of various functional subsystems such as sensor systems, Wi-Fi modules, and touch screens is still increasing. We have noticed that the following new trends in device functionality and miniaturization are driving changes in design and will continue to shape the way engineers design devices in the future:

• Multi-layer PCBs, with more than two layers of circuit, will likely become mainstream, providing high speed and high capacity in a smaller space, reducing weight and simplifying design. By using three or more layers of conductive materials, the multilayer PCB will provide more functions without increasing the thickness of the PCB.
• In the future, we will probably increasingly use one or two integrated power and signal interfaces to complete the power and signal transmission between each subsystem module. In circuit design, reduced number of connections will be required between modules, simplifying cable design, and reducing space requirements.

Q: What are the main differentiated advantages of TE's miniaturized products? For the convenience of assembly, how does TE design the products?

A：The differentiated advantages in TE's miniaturized product portfolio mainly lie in: small size, reliability and high assembly efficiency.

From the small size perspective, we have a broad product portfolio, including small-pitch connectors, miniaturized terminals and low-profile relays. We constantly pay attention to the reduction of product size, such as our new OJT TV-8 rated relays: compared with similar TV-8 rated products, its size is about 40% smaller.

For reliability, our products are designed with appropriate material, new connection technologies, and reliability enhancement structure. For example, our new 2.5mm Sealed Signal Double Lock connectors are designed to provide IP 67 protection against water and dust, and provide double locking devices to improve reliability of the connection.

In terms of assembly efficiency, many of our connectors are designed with ergonomic features to prevent human errors and improve assembly efficiency, including polarized terminals, audible click and tactile feel, keying options, low insertion force, and anti-snag latch. In addition, we also have a variety of products suitable for automated assembly to help customers improve overall production efficiency and reduce costs. For example, our upcoming 2.0mm GRACE INERTIA Connectors use Insulation Displacement Connection (IDC) technology to simplify the assembly and can use crimping machine to enable fully automatic production, which can improve the production efficiency and save potential costs.

Q: For miniaturization, what specific products and solutions does TE have?

Representative miniaturized products & solutions from TE include:

• 2mm Signal GRACE INERTIA Connector: Our miniature design utilizes IDC technology to help lower applied costs
• Sealed Signal Double Lock Connector: Provides IP67 rated water and dust protection in a miniaturized space saving design
• Mini MAG-MATE Magnet Wire Terminals: Terminate some of the smallest diameters of cooper wire utilizing IDC technology to maximize manufacturing efficiency
• 250 Series Miniature FASTON Receptacles: Offer a miniature and ergonomically-friend design for use in applications with limited space for electrical connections
• OJT TV-8 Relay: 40% smaller in size compared to similarly rated relays, offering a miniature design that can withstand up to 117A of inrush current

Q:  What support does TE provide when the customers need to choose a product?

A: To help customers select the correct products, TE provides both online and offline support. You can enjoy self-service product searches and inquiries through te.com, or directly contact our inside sales representatives in every region at any time. Additionally, you can reach out to customer support on the website through LiveChat to get answers to your product and design questions

Meanwhile, we also have in-house testing capabilities to help customers with regulatory certifications (UL, VDE), improve time to market and ensure safety compliance.

In addition, our engineers also provide technical assistance to customers and supply chain partners to ensure the success of the whole solution.