| Part |
Differing Features |

|
- Connector Style = Receptacle
- Family Name = Free Height
- .50 mm Centerline
- 440 Positions
- Board-to-Board Stack Height = 4.00 mm
|
- Board-to-Board Stack Height = 5.00 mm
- Board-to-Board Stack Height = 8.00 mm
- Copper Alloy Contact Base Material
- Gold (8) Contact Plating, Mating Area, Material
- Without Grounding Plate
|
| Always EU RoHS/ELV Compliant, Reflow solder capable to 245°C |
|
|
|

|
- Connector Style = Plug
- Family Name = Free Height
- .50 mm Centerline
- 440 Positions
- Board-to-Board Stack Height = 5.00 mm
|
- Copper Alloy Contact Base Material
- Gold (8) Contact Plating, Mating Area, Material
- With Grounding Plate
- With Locating Post(s)
- With Vacuum Cover
|
| Always EU RoHS/ELV Compliant, Reflow solder capable to 245°C |
|
|
|

|
- Connector Style = Plug
- Family Name = Free Height
- .50 mm Centerline
- 220 Positions
- Board-to-Board Stack Height = 5.00 mm
|
- Board-to-Board Stack Height = 9.00 mm
- Copper Alloy Contact Base Material
- Gold (8) Contact Plating, Mating Area, Material
- With Grounding Plate
- With Locating Post(s)
|
| Always EU RoHS/ELV Compliant, Reflow solder capable to 245°C |
|
|
|

|
- Connector Style = Plug
- Family Name = Free Height
- .50 mm Centerline
- 440 Positions
- Board-to-Board Stack Height = 8.00 mm
|
- Board-to-Board Stack Height = 9.00 mm
- Board-to-Board Stack Height = 12.00 mm
- Copper Alloy Contact Base Material
- Gold (8) Contact Plating, Mating Area, Material
- With Grounding Plate
|
| Always EU RoHS/ELV Compliant, Reflow solder capable to 245°C |
|
|
|

|
- Connector Style = Receptacle
- Family Name = Free Height
- .50 mm Centerline
- 220 Positions
- Board-to-Board Stack Height = 4.00 mm
|
- Board-to-Board Stack Height = 5.00 mm
- Board-to-Board Stack Height = 8.00 mm
- Copper Alloy Contact Base Material
- Gold (8) Contact Plating, Mating Area, Material
- Without Grounding Plate
|
| Always EU RoHS/ELV Compliant, Reflow solder capable to 245°C |
|
|
|

|
- Connector Style = Plug
- Family Name = Free Height
- .50 mm Centerline
- 220 Positions
- Board-to-Board Stack Height = 8.00 mm
|
- Copper Alloy Contact Base Material
- Gold (8) Contact Plating, Mating Area, Material
- With Grounding Plate
- With Locating Post(s)
- Without Vacuum Cover
|
| Always EU RoHS/ELV Compliant, Reflow solder capable to 245°C |
|
|
|

|
- Connector Style = Receptacle
- Family Name = Free Height
- .50 mm Centerline
- 220 Positions
- Board-to-Board Stack Height = 4.00 mm
|
- Board-to-Board Stack Height = 5.00 mm
- Board-to-Board Stack Height = 8.00 mm
- Copper Alloy Contact Base Material
- Gold (30) Contact Plating, Mating Area, Material
- Without Grounding Plate
|
| Always EU RoHS/ELV Compliant, Reflow solder capable to 245°C |
|
|
|

|
- Connector Style = Plug
- Family Name = Free Height
- .50 mm Centerline
- 220 Positions
- Board-to-Board Stack Height = 8.00 mm
|
- Board-to-Board Stack Height = 12.00 mm
- Copper Alloy Contact Base Material
- Gold (30) Contact Plating, Mating Area, Material
- With Grounding Plate
- With Locating Post(s)
|
| Always EU RoHS/ELV Compliant, Reflow solder capable to 245°C |
|
|
|

|
- Connector Style = Plug
- Family Name = Free Height
- .50 mm Centerline
- 200 Positions
- Board-to-Board Stack Height = 8.00 mm
|
- Copper Alloy Contact Base Material
- Gold Flash Contact Plating, Mating Area, Material
- With Grounding Plate
- With Locating Post(s)
- With Vacuum Cover
|
| Always EU RoHS/ELV Compliant, Reflow solder capable to 245°C |
|
|
|

|
- Connector Style = Receptacle
- Family Name = Free Height
- .50 mm Centerline
- 240 Positions
- Board-to-Board Stack Height = 4.00 mm
|
- Board-to-Board Stack Height = 6.00 mm
- Copper Alloy Contact Base Material
- Gold (8) Contact Plating, Mating Area, Material
- Without Grounding Plate
- With Locating Post(s)
|
| Always EU RoHS/ELV Compliant, Reflow solder capable to 245°C |
|
|
|

|
- Connector Style = Plug
- Family Name = Free Height
- .50 mm Centerline
- 240 Positions
- Board-to-Board Stack Height = 6.00 mm
|
- Copper Alloy Contact Base Material
- Gold (8) Contact Plating, Mating Area, Material
- With Grounding Plate
- With Locating Post(s)
- With Vacuum Cover
|
| Always EU RoHS/ELV Compliant, Reflow solder capable to 245°C |
|
|
|

|
- Connector Style = Receptacle
- Family Name = Free Height
- .50 mm Centerline
- 200 Positions
- Board-to-Board Stack Height = 4.00 mm
|
- Board-to-Board Stack Height = 5.00 mm
- Board-to-Board Stack Height = 7.00 mm
- Copper Alloy Contact Base Material
- Gold (8) Contact Plating, Mating Area, Material
- Without Grounding Plate
|
| Always EU RoHS/ELV Compliant, Reflow solder capable to 245°C |
|
|
|

|
- Connector Style = Plug
- Family Name = Free Height
- .50 mm Centerline
- 220 Positions
- Board-to-Board Stack Height = 5.00 mm
|
- Copper Alloy Contact Base Material
- Gold (8) Contact Plating, Mating Area, Material
- With Grounding Plate
- With Locating Post(s)
- Without Vacuum Cover
|
| Always EU RoHS/ELV Compliant, Not reviewed for solder process capability |
|
|
|

|
- Connector Style = Plug
- Family Name = Free Height
- .50 mm Centerline
- 200 Positions
- Board-to-Board Stack Height = 8.00 mm
|
- Copper Alloy Contact Base Material
- Gold (8) Contact Plating, Mating Area, Material
- With Grounding Plate
- With Locating Post(s)
- With Vacuum Cover
|
| Always EU RoHS/ELV Compliant, Reflow solder capable to 245°C |
|
|
|

|
- Connector Style = Receptacle
- Family Name = Free Height
- .50 mm Centerline
- 240 Positions
- Board-to-Board Stack Height = 4.00 mm
|
- Copper Alloy Contact Base Material
- Gold (8) Contact Plating, Mating Area, Material
- Without Grounding Plate
- With Locating Post(s)
- With Vacuum Cover
|
| Always EU RoHS/ELV Compliant, Reflow solder capable to 245°C |
|
|
|

|
- Connector Style = Receptacle
- Family Name = Free Height
- .50 mm Centerline
- 120 Positions
- Board-to-Board Stack Height = 6.00 mm
|
- Board-to-Board Stack Height = 9.00 mm
- Board-to-Board Stack Height = 10.00 mm
- Copper Alloy Contact Base Material
- Gold (8) Contact Plating, Mating Area, Material
- Without Grounding Plate
|
| Always EU RoHS/ELV Compliant, Reflow solder capable to 260°C |
|
|
|

|
- Connector Style = Receptacle
- Family Name = Free Height
- .50 mm Centerline
- 220 Positions
- Board-to-Board Stack Height = 4.00 mm
|
- Board-to-Board Stack Height = 5.00 mm
- Board-to-Board Stack Height = 8.00 mm
- Copper Alloy Contact Base Material
- Gold (8) Contact Plating, Mating Area, Material
- Without Grounding Plate
|
| Always EU RoHS/ELV Compliant, Not reviewed for solder process capability |
|
|
|

|
- Connector Style = Plug
- Family Name = Free Height
- .50 mm Centerline
- 220 Positions
- Board-to-Board Stack Height = 8.00 mm
|
- Board-to-Board Stack Height = 12.00 mm
- Copper Alloy Contact Base Material
- Gold (8) Contact Plating, Mating Area, Material
- With Grounding Plate
- With Locating Post(s)
|
| Always EU RoHS/ELV Compliant, Reflow solder capable to 245°C |
|
|
|

|
- Connector Style = Plug
- Family Name = Free Height
- .50 mm Centerline
- 220 Positions
- Board-to-Board Stack Height = 5.00 mm
|
- Copper Alloy Contact Base Material
- Gold (30) Contact Plating, Mating Area, Material
- With Grounding Plate
- With Locating Post(s)
- Without Vacuum Cover
|
| Always EU RoHS/ELV Compliant, Reflow solder capable to 245°C |
|
|
|

|
- Connector Style = Plug
- Family Name = Free Height
- .50 mm Centerline
- 220 Positions
- Board-to-Board Stack Height = 8.00 mm
|
- Board-to-Board Stack Height = 12.00 mm
- Copper Alloy Contact Base Material
- Gold (30) Contact Plating, Mating Area, Material
- With Grounding Plate
- With Locating Post(s)
|
| Always EU RoHS/ELV Compliant, Reflow solder capable to 245°C |
|
|
|