| Part |
Differing Features |

|
- Size = Standard
- Type A Series
- 1 Ports
- Surface Mount Contact Termination Type
- Top Mount Location
|
- Right Angle Orientation
- Gold Flash over Palladium Nickel Contact Plating, Mating Area, Material
- Contact Plating, Mating Area, Thickness = .1 µm
- With Panel Ground
- Panel Ground Type = 4-40 UNC Threaded Hole
|
| Always EU RoHS/ELV Compliant, Reflow solder capable to 245°C |
|
|
|

|
- Size = Standard
- Type A Series
- 1 Ports
- Surface Mount Contact Termination Type
- Top Mount Location
|
- Right Angle Orientation
- Gold Flash over Palladium Nickel Contact Plating, Mating Area, Material
- Contact Plating, Mating Area, Thickness = .1 µm
- With Panel Ground
- Panel Ground Type = M3 Threaded Hole
|
| Always EU RoHS/ELV Compliant, Reflow solder capable to 245°C |
|
|
|

|
- Size = Standard
- Type A Series
- 1 Ports
- Surface Mount Contact Termination Type
- Top Mount Location
|
- Right Angle Orientation
- Gold Flash over Palladium Nickel Contact Plating, Mating Area, Material
- Contact Plating, Mating Area, Thickness = .1 µm
- With Panel Ground
- Panel Ground Type = M3 Threaded Hole
|
| Always EU RoHS/ELV Compliant, Reflow solder capable to 245°C |
|
|
|

|
- Size = Standard
- Type A Series
- 1 Ports
- Surface Mount Contact Termination Type
- Top Mount Location
|
- Right Angle Orientation
- Gold Flash over Palladium Nickel Contact Plating, Mating Area, Material
- Contact Plating, Mating Area, Thickness = .1 µm
- With Panel Ground
- Panel Ground Type = M3 Threaded Hole
|
| Always EU RoHS/ELV Compliant, Reflow solder capable to 245°C |
|
|
|

|
- Size = Standard
- Type A Series
- 1 Ports
- Surface Mount Contact Termination Type
- Top Mount Location
|
- Right Angle Orientation
- Gold Flash over Palladium Nickel Contact Plating, Mating Area, Material
- Contact Plating, Mating Area, Thickness = .1 µm
- With Panel Ground
- Panel Ground Type = M3 Threaded Hole
|
| Always EU RoHS/ELV Compliant, Reflow solder capable to 245°C |
|
|
|

|
- Size = Standard
- Type A Series
- 1 Ports
- Surface Mount Contact Termination Type
- Top Mount Location
|
- Right Angle Orientation
- Gold Flash over Palladium Nickel Contact Plating, Mating Area, Material
- Contact Plating, Mating Area, Thickness = .1 µm
- With Panel Ground
- Panel Ground Type = M3 Threaded Hole
|
| Always EU RoHS/ELV Compliant, Reflow solder capable to 245°C |
|
|
|

|
- Size = Standard
- Type A Series
- 1 Ports
- Surface Mount Contact Termination Type
- Top Mount Location
|
- Right Angle Orientation
- Gold Flash over Palladium Nickel Contact Plating, Mating Area, Material
- Contact Plating, Mating Area, Thickness = .1 µm
- With Panel Ground
- Panel Ground Type = M3 Threaded Hole
|
| Always EU RoHS/ELV Compliant, Reflow solder capable to 245°C |
|
|
|

|
- Size = Standard
- Type A Series
- 1 Ports
- Through Hole Contact Termination Type
- Top Mount Location
|
- Right Angle Orientation
- Gold Contact Plating, Mating Area, Material
- Contact Plating, Mating Area, Thickness = .1 µm
- With Panel Ground
- Panel Ground Type = M3 Threaded Hole
|
| Always EU RoHS/ELV Compliant, Reflow solder capable to 245°C |
|
|
|

|
- Size = Standard
- Type A Series
- 1 Ports
- Through Hole Contact Termination Type
- Top Mount Location
|
- Right Angle Orientation
- Gold Contact Plating, Mating Area, Material
- Contact Plating, Mating Area, Thickness = .1 µm
- With Panel Ground
- Panel Ground Type = M3 Threaded Hole
|
| Always EU RoHS/ELV Compliant, Reflow solder capable to 245°C |
|
|
|

|
- Size = Standard
- Type A Series
- 1 Ports
- Surface Mount Contact Termination Type
- Top Mount Location
|
- Right Angle Orientation
- Gold Flash over Palladium Nickel Contact Plating, Mating Area, Material
- Contact Plating, Mating Area, Thickness = .1 µm
- Without Panel Ground
- Packaging Method = Tape & Reel
|
| Always EU RoHS/ELV Compliant, Reflow solder capable to 245°C |
|
|
|

|
- Size = Standard
- Type A Series
- 1 Ports
- Surface Mount Contact Termination Type
- Top Mount Location
|
- Right Angle Orientation
- Gold Flash over Palladium Nickel Contact Plating, Mating Area, Material
- Contact Plating, Mating Area, Thickness = .1 µm
- Without Panel Ground
- Packaging Method = Tape & Reel
|
| Always EU RoHS/ELV Compliant, Reflow solder capable to 245°C |
|
|
|

|
- Size = Standard
- Type A Series
- 1 Ports
- Surface Mount Contact Termination Type
- Top Mount Location
|
- Gold Contact Plating, Mating Area, Material
- Contact Plating, Mating Area, Thickness = .38 µm
- Packaging Method = Tray
- Not Stacked
- TE Connectivity
|
| Always EU RoHS/ELV Compliant, Reflow solder capable to 260°C |
|
|
|

|
- Size = Standard
- Type A Series
- 1 Ports
- Surface Mount Contact Termination Type
- Top Mount Location
|
- Right Angle Orientation
- Gold Contact Plating, Mating Area, Material
- Contact Plating, Mating Area, Thickness = .76 µm
- Without Panel Ground
- Packaging Method = Tape & Reel
|
| Always EU RoHS/ELV Compliant, Reflow solder capable to 245°C |
|
|
|

|
- Size = Standard
- Type A Series
- 1 Ports
- Surface Mount Contact Termination Type
- Top Mount Location
|
- Right Angle Orientation
- Gold Contact Plating, Mating Area, Material
- Contact Plating, Mating Area, Thickness = .76 µm
- With Panel Ground
- Panel Ground Type = 2.65 Hole
|
| Always EU RoHS/ELV Compliant, Reflow solder capable to 245°C |
|
|
|

|
- Size = Standard
- Type A Series
- 1 Ports
- Surface Mount Contact Termination Type
- Top Mount Location
|
- Right Angle Orientation
- Gold Contact Plating, Mating Area, Material
- Contact Plating, Mating Area, Thickness = .76 µm
- With Panel Ground
- Panel Ground Type = M3 Threaded Hole
|
| Always EU RoHS/ELV Compliant, Reflow solder capable to 245°C |
|
|
|

|
- Size = Standard
- Type A Series
- 1 Ports
- Surface Mount Contact Termination Type
- Top Mount Location
|
- Right Angle Orientation
- Gold Contact Plating, Mating Area, Material
- Contact Plating, Mating Area, Thickness = .76 µm
- With Panel Ground
- Panel Ground Type = 2.65 Hole
|
| Always EU RoHS/ELV Compliant, Reflow solder capable to 245°C |
|
|
|

|
- Size = Standard
- Type A Series
- 1 Ports
- Surface Mount Contact Termination Type
- Top Mount Location
|
- Right Angle Orientation
- Gold Contact Plating, Mating Area, Material
- Contact Plating, Mating Area, Thickness = .76 µm
- With Panel Ground
- Panel Ground Type = M3 Threaded Hole
|
| Always EU RoHS/ELV Compliant, Reflow solder capable to 245°C |
|
|
|

|
- Size = Standard
- Type A Series
- 1 Ports
- Surface Mount Contact Termination Type
- Top Mount Location
|
- Right Angle Orientation
- Gold Contact Plating, Mating Area, Material
- Contact Plating, Mating Area, Thickness = .76 µm
- With Panel Ground
- Panel Ground Type = M3 Threaded Hole
|
| Always EU RoHS/ELV Compliant, Reflow solder capable to 245°C |
|
|
|

|
- Size = Standard
- Type A Series
- 1 Ports
- Surface Mount Contact Termination Type
- Top Mount Location
|
- Right Angle Orientation
- Gold Flash over Palladium Nickel Contact Plating, Mating Area, Material
- Contact Plating, Mating Area, Thickness = .1 µm
- With Panel Ground
- Panel Ground Type = M3 Threaded Hole
|
| Always EU RoHS/ELV Compliant, Reflow solder capable to 245°C |
|
|
|

|
- Size = Standard
- Type A Series
- 1 Ports
- Surface Mount Contact Termination Type
- Top Mount Location
|
- Right Angle Orientation
- Gold Flash over Palladium Nickel Contact Plating, Mating Area, Material
- Contact Plating, Mating Area, Thickness = .1 µm
- With Panel Ground
- Panel Ground Type = M3 Threaded Hole
|
| Always EU RoHS/ELV Compliant, Reflow solder capable to 245°C |
|
|
|