| Part |
Differing Features |

|
- 1.00 mm Centerline
- 10 Positions
- Matte Tin Contact Plating, Mating Area, Material
- Contact Plating, Mating Area, Thickness = 3 µm
- PA6T Housing Material
|
- Termination Method to PC Board = Through Hole
- PCB Mounting Orientation = Vertical
- With PCB Mount Alignment
- With PCB Mount Retention
- Tail Length = 3.2 mm
|
| Always EU RoHS/ELV Compliant, Wave solder capable to 265°C |
|
|
|

|
- 1.00 mm Centerline
- 11 Positions
- Matte Tin Contact Plating, Mating Area, Material
- Contact Plating, Mating Area, Thickness = 3 µm
- PA6T Housing Material
|
- Termination Method to PC Board = Through Hole
- PCB Mounting Orientation = Vertical
- With PCB Mount Alignment
- With PCB Mount Retention
- Tail Length = 3.2 mm
|
| Always EU RoHS/ELV Compliant, Wave solder capable to 265°C |
|
|
|

|
- 1.00 mm Centerline
- 12 Positions
- Matte Tin Contact Plating, Mating Area, Material
- Contact Plating, Mating Area, Thickness = 3 µm
- PA6T Housing Material
|
- Termination Method to PC Board = Through Hole
- PCB Mounting Orientation = Vertical
- With PCB Mount Alignment
- With PCB Mount Retention
- Tail Length = 3.2 mm
|
| Always EU RoHS/ELV Compliant, Wave solder capable to 265°C |
|
|
|

|
- 1.00 mm Centerline
- 13 Positions
- Matte Tin Contact Plating, Mating Area, Material
- Contact Plating, Mating Area, Thickness = 3 µm
- PA6T Housing Material
|
- Termination Method to PC Board = Through Hole
- PCB Mounting Orientation = Vertical
- With PCB Mount Alignment
- With PCB Mount Retention
- Tail Length = 3.2 mm
|
| Always EU RoHS/ELV Compliant, Wave solder capable to 265°C |
|
|
|

|
- 1.00 mm Centerline
- 14 Positions
- Matte Tin Contact Plating, Mating Area, Material
- Contact Plating, Mating Area, Thickness = 3 µm
- PA6T Housing Material
|
- Termination Method to PC Board = Through Hole
- PCB Mounting Orientation = Vertical
- With PCB Mount Alignment
- With PCB Mount Retention
- Tail Length = 3.2 mm
|
| Always EU RoHS/ELV Compliant, Wave solder capable to 265°C |
|
|
|

|
- 1.00 mm Centerline
- 15 Positions
- Matte Tin Contact Plating, Mating Area, Material
- Contact Plating, Mating Area, Thickness = 3 µm
- PA6T Housing Material
|
- Termination Method to PC Board = Through Hole
- PCB Mounting Orientation = Vertical
- With PCB Mount Alignment
- With PCB Mount Retention
- Tail Length = 3.2 mm
|
| Always EU RoHS/ELV Compliant, Wave solder capable to 265°C |
|
|
|

|
- 1.00 mm Centerline
- 16 Positions
- Matte Tin Contact Plating, Mating Area, Material
- Contact Plating, Mating Area, Thickness = 3 µm
- PA6T Housing Material
|
- Termination Method to PC Board = Through Hole
- PCB Mounting Orientation = Vertical
- With PCB Mount Alignment
- With PCB Mount Retention
- Tail Length = 3.2 mm
|
| Always EU RoHS/ELV Compliant, Wave solder capable to 265°C |
|
|
|

|
- 1.00 mm Centerline
- 17 Positions
- Matte Tin Contact Plating, Mating Area, Material
- Contact Plating, Mating Area, Thickness = 3 µm
- PA6T Housing Material
|
- Termination Method to PC Board = Through Hole
- PCB Mounting Orientation = Vertical
- With PCB Mount Alignment
- With PCB Mount Retention
- Tail Length = 3.2 mm
|
| Always EU RoHS/ELV Compliant, Wave solder capable to 265°C |
|
|
|

|
- 1.00 mm Centerline
- 18 Positions
- Matte Tin Contact Plating, Mating Area, Material
- Contact Plating, Mating Area, Thickness = 3 µm
- PA6T Housing Material
|
- Termination Method to PC Board = Through Hole
- PCB Mounting Orientation = Vertical
- With PCB Mount Alignment
- With PCB Mount Retention
- Tail Length = 3.2 mm
|
| Always EU RoHS/ELV Compliant, Wave solder capable to 265°C |
|
|
|

|
- .50 mm Centerline
- 33 Positions
- Gold Contact Plating, Mating Area, Material
- Contact Plating, Mating Area, Thickness = .025 µm
- PA9T Housing Material
|
- Termination Method to PC Board = Surface Mount
- PCB Mounting Orientation = Vertical
- Without PCB Mount Alignment
- With PCB Mount Retention
- Staggered Type B Tail Orientation
|
| Always EU RoHS/ELV Compliant, Reflow solder capable to 260°C |
|
|
|

|
- .50 mm Centerline
- 34 Positions
- Gold Contact Plating, Mating Area, Material
- Contact Plating, Mating Area, Thickness = .025 µm
- PA9T Housing Material
|
- Termination Method to PC Board = Surface Mount
- PCB Mounting Orientation = Vertical
- Without PCB Mount Alignment
- With PCB Mount Retention
- Staggered Type B Tail Orientation
|
| Always EU RoHS/ELV Compliant, Reflow solder capable to 260°C |
|
|
|

|
- .50 mm Centerline
- 35 Positions
- Gold Contact Plating, Mating Area, Material
- Contact Plating, Mating Area, Thickness = .025 µm
- PA9T Housing Material
|
- Termination Method to PC Board = Surface Mount
- PCB Mounting Orientation = Vertical
- Without PCB Mount Alignment
- With PCB Mount Retention
- Staggered Type B Tail Orientation
|
| Always EU RoHS/ELV Compliant, Reflow solder capable to 260°C |
|
|
|

|
- .50 mm Centerline
- 36 Positions
- Gold Contact Plating, Mating Area, Material
- Contact Plating, Mating Area, Thickness = .025 µm
- PA9T Housing Material
|
- Termination Method to PC Board = Surface Mount
- PCB Mounting Orientation = Vertical
- Without PCB Mount Alignment
- With PCB Mount Retention
- Staggered Type B Tail Orientation
|
| Always EU RoHS/ELV Compliant, Reflow solder capable to 260°C |
|
|
|

|
- .50 mm Centerline
- 37 Positions
- Gold Contact Plating, Mating Area, Material
- Contact Plating, Mating Area, Thickness = .025 µm
- PA9T Housing Material
|
- Termination Method to PC Board = Surface Mount
- PCB Mounting Orientation = Vertical
- Without PCB Mount Alignment
- With PCB Mount Retention
- Staggered Type B Tail Orientation
|
| Always EU RoHS/ELV Compliant, Reflow solder capable to 260°C |
|
|
|

|
- .50 mm Centerline
- 38 Positions
- Gold Contact Plating, Mating Area, Material
- Contact Plating, Mating Area, Thickness = .025 µm
- PA9T Housing Material
|
- Termination Method to PC Board = Surface Mount
- PCB Mounting Orientation = Vertical
- Without PCB Mount Alignment
- With PCB Mount Retention
- Staggered Type B Tail Orientation
|
| Always EU RoHS/ELV Compliant, Reflow solder capable to 260°C |
|
|
|

|
- .50 mm Centerline
- 39 Positions
- Gold Contact Plating, Mating Area, Material
- Contact Plating, Mating Area, Thickness = .025 µm
- PA9T Housing Material
|
- Termination Method to PC Board = Surface Mount
- PCB Mounting Orientation = Vertical
- Without PCB Mount Alignment
- With PCB Mount Retention
- Staggered Type B Tail Orientation
|
| Always EU RoHS/ELV Compliant, Reflow solder capable to 260°C |
|
|
|

|
- .50 mm Centerline
- 40 Positions
- Gold Contact Plating, Mating Area, Material
- Contact Plating, Mating Area, Thickness = .025 µm
- PA9T Housing Material
|
- Termination Method to PC Board = Surface Mount
- PCB Mounting Orientation = Vertical
- Without PCB Mount Alignment
- With PCB Mount Retention
- Staggered Type B Tail Orientation
|
| Always EU RoHS/ELV Compliant, Reflow solder capable to 260°C |
|
|
|

|
- 1.25 mm Centerline
- 6 Positions
- Bright Tin Contact Plating, Mating Area, Material
- Contact Plating, Mating Area, Thickness = .8 µm
- PBT Housing Material
|
- Termination Method to PC Board = Through Hole
- PCB Mounting Orientation = Vertical
- With PCB Mount Alignment
- With PCB Mount Retention
- Tail Length = 3.2 mm
|
| Converted to EU RoHS/ELV Compliant, Wave solder capable to 265°C |
|
|
|

|
- 1.25 mm Centerline
- 7 Positions
- Bright Tin Contact Plating, Mating Area, Material
- Contact Plating, Mating Area, Thickness = .8 µm
- PBT Housing Material
|
- Termination Method to PC Board = Through Hole
- PCB Mounting Orientation = Vertical
- With PCB Mount Alignment
- With PCB Mount Retention
- Tail Length = 3.2 mm
|
| Converted to EU RoHS/ELV Compliant, Wave solder capable to 265°C |
|
|
|

|
- 1.25 mm Centerline
- 8 Positions
- Bright Tin Contact Plating, Mating Area, Material
- Contact Plating, Mating Area, Thickness = .8 µm
- PBT Housing Material
|
- Termination Method to PC Board = Through Hole
- PCB Mounting Orientation = Vertical
- With PCB Mount Alignment
- With PCB Mount Retention
- Tail Length = 3.2 mm
|
| Converted to EU RoHS/ELV Compliant, Wave solder capable to 265°C |
|
|
|