Feature Help for Lead Free Solder Processes
ELV Compliant Products - End of Life Vehicles (ELV) Directive 2000/53/EC requires that impacted products be free of mercury, cadmium and lead as of 2003-7-1. Lead can still be used as an alloying additive in copper and in solderable applications. These products comply with the ELV directive.
RoHS Compliant Products - Restrictions on Certain Hazardous Substances (RoHS) Directive 2002/95/EC requires that impacted products be free of mercury, cadmium, hexavalent chromium, PBB, PBDE and lead as of 2006-7-1. Lead can still be used as an alloying additive in copper. These products comply with the RoHS directive. Each of these products also comply with the ELV directive unless specifically indicated as RoHS/Not ELV compliant.
Reflow solder capable to 245°C
Temperatures up to 245°C may be used in Reflow solder process per Tyco Electronics spec 109-201.
Spec 109-201 does not apply to circuit protection devices. Please refer to the datasheet of the component for exact soldering conditions.
Reflow solder capable to 260°C
Temperatures up to 260°C may be used in Reflow solder process per Tyco Electronics spec 109-201.
Spec 109-201 does not apply to circuit protection devices. Please refer to the datasheet of the component for exact soldering conditions.
Not reviewed for lead free solder process
Product has not as yet been reviewed for lead free solder process compliance.
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