Cabled Interconnect Solutions for High Speed Data

TE Connectivity's (TE's) internal cabled interconnects can provide a solution to data rate increase challenges. They are flexible, robust and provide optimal signal integrity while also saving space inside the application. This new connectivity technology simplifies design and helps lower overall costs by eliminating the need for re-timers and more costly lower-loss PCB materials while reaching speeds up to 56 Gbps with the use of TE high speed cable. TE’s expanded portfolio of internal cabled interconnects now includes SlimSAS, SlimSAS Low Profile (LP), Mini Cool Edge IO (MCIO) connectors, Modular Extensible Input/Output (M-XIO) and cable assemblies for SAS and PCIe Gen 4/Gen 5/Gen 6 server and storage applications.

Industry Standards

M-XIO
  • SNIA/SFF industry standard SFF-TA-1033
  • OCP DC-MHS M-XIO base specification
  • M-XIO connectors are based on MCIO connectors which can be used as the standard internal cabling for PCIe Gen5/6

Product Features

M-XIO
  • 0.6mm contact pitch surface mount technology (SMT) combination connector
  • Supports 85Ω impedance applications
  • A combination form factor which includes two sets of 74 MCIO connector type pins, 12 sideband pins and 4 power pins
  • PCIe Gen5 (32 GT/s NRZ) performance with a path to PCIe Gen6 (64 GT/s PAM4)
  • Support card-edge PCB and cable assembly
  • Multi-sourced with robust ecosystem
Vertical 21A Power Connector

Vertical 21A Power Connector

Vertical Combo X8+ 21A Power Connector

Vertical Combo X8+ 21A Power Connector

Vertical Combo X16+ 21A Power Connector

Vertical Combo X16+ 21A Power Connector

Straght Combo X16+ 21A Powe Plug

Reverse Straght Combo X16+ 21A Powe Plug

Right Angle Combo X16+ 21A Power Plug

Reverse Right Angle Combo x16+ 21A Power Plug

SlimSAS Features

SlimSAS and SlimSAS LP are low profile high density internal cabled interconnect solutions that provide PCIe Gen 4 cable and connector capability. A 0.6mm pitch balances manufacturability with density.
 
  • Industry standard internal cable solution
    • Compliant to SFF-8654 standard
    • 0.6mm pitch
    • 22.4mm height (vertical receptacle, right angle plug)
    • Center latching
  • Connector
    •  85 Ohm, 16G NRZ
    • 100 Ohm, SAS-4
  • Cable assembly
    • 100 Ohm: SAS-4
    • 85 Ohm: PCIe Gen 4

SlimSAS LP Features

  • Low Profile, high density cable solution
    • 0.6mm pitch
    • 13.45mm height (vertical receptacle, right angle plug)
    • Center latching
  • Connector: 85 Ohm, 16G NRZ
  • Cable Assembly
    • 100 Ohm: SAS-4
    • 85 Ohm: PCIe Gen 4

MCIO Features

Newest 85 Ohm 8X 16X Vertical Receptacle
MINI COOL EDGE IO internal cabled interconnects address the SFF-TA-1016 next-generation industry standard and support PCIe Gen 5 applications.
 
  • Low Profile, high density cable solution
    • 0.6mm pitch
    • 13.95mm height (vertical receptacle, right angle plug)
    • Center latching
  • Connector
    • 92 Ohm, 8X 16X vertical
    • 85 Ohm 8X 16X vertical ready. 4X in development
    • 85 Ohm 4X 8X 16X right angle in development
  • Cable assembly
    • 100 Ohm: 56G PAM-4, SAS-4
    • 85 Ohm: PCIe Gen 4, PCIe Gen 5
MCIO
Vertical Receptacle