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Antenna Products Overview

RF Antenna Productss
RF Antenna Products


RF Antenna Products

Contact Us:

Phone: +1 (717) 986-5440

Europe/ Middle East / Africa
Phone: +49-371-51-45-22

Asia Pacific
Phone: +886-2-8768-2788 (Ext. 309)

TE Connectivity (TE) designs and manufactures antennas that comply with the most stringent operating requirements. We are a pioneer of customized embedded antenna solutions to meet the wireless industry's demand for increased complexity and miniaturization combined with the need to integrate a multi-radio environment into one component.

Our innovative antenna designs have been applied to a wide range of wireless products including some of the thinnest laptops, leading touch screen smartphones, and revolutionary gaming consoles. Our antennas offer endless possibilities for our customers to create wireless devices with several combinations of features in a variety of shapes or sizes. 

Our antennas utilize diverse technologies and offer optimal solutions for each of the following examples:

WLAN / WWAN / Voice

  • 802.11 (a/b/g/n): 2400 - 2483.5 & 4900 - 5875 MHz
  • LTE: 700 – 3700 MHz, multiband, Metaspan antenna technology
  • GSM/UMTS: 850 – 2170 MHz, single and multiband
  • WiMax: 2300 – 3800 MHz

  • ISM 900/ZigBee: 902 - 928 MHz
  • Bluetooth wireless technology: 2400 - 2483.5 MHz
  • ZigBee: 2400 - 2483.5 MHz
  • UWB: 3168 - 10560 MHz
  • Global Navigation Satellite Systems (GNSS): GPS 1565 - 1585 MHz & Glonass
  • DVB-H: 1670 - 1675 MHz
  • NFC: 13.56 MHz

(The Bluetooth trademarks are owned by Bluetooth SIG, Inc. ZigBee is a trademark of ZigBee Alliance.)

Numerous Industries have integrated wireless functionality into their everyday products and services. TE provides advanced antenna solutions for most wireless devices, with many combinations of features that are required. Our antenna designs accommodate numerous sets of frequency bands for operation on any network - in both regional and global markets - at a competitive price point.

TE Connectivity is a leading developer and manufacturer of high performance embedded and external antennas for diverse wireless applications in various industries. TE has a global presence with manufacturing and design locations around the world.

    Key Features
  • Design & manufacturing locations around the world for fast time-to-market
  • Experienced manufacturer offering a complete range of antenna technologies
  • Molded Interconnect Device (MID) technology leader with years of proven 2-Shot and LDS solutions
  • State of the art labs and equipment with RF, SAR, throughput testing, and acoustic testing capabilities
  • Value added production processes on-site along with experienced RF and mechanical design engineering teams

  • Wearables / IoT
  • Tablets
  • Mobile and Smart phones
  • Notebooks and desktops
  • Wireless printers and routers
  • HDTV
  • Wireless alarm, security, and monitoring systems
  • Smart Grid
  • Vehicle tracking systems
  • Custom Antenna Design

Manufacturing Capability

TE most commonly utilizes the following manufacturing technologies: Molded Interconnect Device (MID) Technology: Two Shot and Laser Direct Structuring; Stamped Metal; Printed Circuit Board (PCB) and Flexible Printed Circuit (FPC).

MID Technology

TE is one of the leading provider of Molded Interconnect Device (MID) technology with more than 25 years mass production experience. In its most basic form, MID technology is defined as a process that results in selectively plated plastic parts. This technology is most often used in three basic ways: electro-mechanical (signal or current carrying traces), RF technology (antennas), and for shielding applications. MIDs can integrate electrical and mechanical elements into almost any shape of interconnect device allowing entirely new functions to be created while facilitating the miniaturization of products.

TE utilizes two different technologies to manufacture MID antennas: 2-Shot molding and Laser Direct Structuring (LDS).

MID 2-shot    MID LDS

Two Shot MID Technology  Custom Antenna Design Request

MID 2-shot

Two-Shot Molded Interconnect Device (MID) Antennas Video

Two Shot molding is a mature and well understood process that remains viable for cost effective and repeatable production of MIDs. The basic process has only two steps, injection molding of two distinct thermoplastic polymers and the electroless plating process, resulting in a selectively plated component. In order to achieve the selectivity during plating, a catalyst doped “plateable” resin is molded in conjunction with a standard non-plateable resin to define the desired area to be plated. This area is metallized initially with copper, followed by nickel and, optionally, gold plating. The following are just a few of the several advantages that MID 2-Shot technology delivers compared to alternative technologies:

  • Design flexibility for complex 3D geometries
  • Ability to integrate multiple functions into one component
  • Tightest tolerance for pattern registration to carrier
  • Fewest manufacturing steps and processes
  • Higher yields
  • Improved scalability

Laser Direct Structuring MID Technology  Custom Antenna Design Request


LDS Molded Interconnect Device (MID) Antennas Video

Laser Direct Structuring (LDS) is an exciting technology used to create Molded Interconnect Devices (MID). Through the use of the dedicated laser system and a variety of the proprietary resins, it opens up many possibilities to create 3 dimensional MIDs with finer line width and spacing than what is possible with the conventional MID processes. LDS is a three step process. First, the antenna is molded in a standard single shot mold using one of the LDS resins. Second, the desired pattern is directly structured onto the antenna by the 3D laser system. Finally, the pattern is plated using industry-standard methods where the plating adheres to the plastic only where the plastic has been activated by the laser, thus creating a conductive pattern. LDS offers some of the 2-Shot technology advantages mentioned above plus:

  • Ability to produce thin (0.15 mm) traces
  • Flexibility for pattern changes during production
  • Simple/fastest/lowest cost tooling

Printed Antennas  Custom Antenna Design Request

Printed Antennas

Printing is an emerging manufacturing process being used to produce antennas. The Antenna carrier is molded of standard resin materials. Then the antenna pattern is structured onto the carrier by applying a conductive, non-plate particulate in a tightly controlled manner with a 3D print system.

  • No special resins
  • No plating required
  • Flexibility to make pattern changes easily
  • Simple/fastest/lowest cost tooling
  • Environmentally friendly

Stamped Metal Antennas  Custom Antenna Design Request


TE has developed a line of low profile, high performance Stamped Metal embedded antenna solutions for single-, dual-, tri- and quad band applications. Stamped Metal antennas offer OEM’s a low cost and highly repeatable manufacturing solution with a number of standard or customized antenna designs. Stampings are a proven solution with several advantages such as:

  • Lowest cost
  • Integrated contacts to ground plane
  • High volume capable production die
  • Additional assembly stations may be added for volume upswings

Flexible Printed Circuit (FPC) and Printed Circuit Board (PCB) Antennas  Custom Antenna Design Request


FPC Antenna Assembly Video

Flexible Printed Circuits and Printed Circuit Boards are ideal for multi band antennas, allowing virtually any wireless product to operate at different frequencies without multiple antennas. TE Connectivity offers a broad range of low profile, high performance FPC and PCB embedded antennas. Similar to our Stamped Metal antennas, FPC and PCB antennas offer OEM’s a low cost and highly repeatable manufacturing solutions in a number of standard or customized antenna designs. FPC and PCB antennas address the needs of a variety of wireless applications and offer several advantages such as:

  • Low cost tooling investment
  • Flexibility for pattern changes during production
  • Shortest lead time for tool build

Speaker Acoustic Modules  Custom Antenna Design Request

Speaker Acoustic Modules

TE has in-house capability for designing, assembling, and testing speaker acoustic modules (SAMs). The antenna and acoustic chamber are designed together as one assembly. The acoustic chamber becomes the carrier for the antenna using one of the above technologies. SAMs are 100% RF and acoustic tested in the production line prior to packaging.

  • Space saving combination of acoustic chamber and antenna
  • RF test after speaker integration to SAM


TE Connectivity is a leading developer and manufacturer of high performance embedded and external antennas for diverse wireless applications in various industries. TE has a global presence with manufacturing and design locations around the world.

Product Management & Design Locations:

  • Harrisburg, Pennsylvania USA
  • Aptos, California USA
  • Menlo Park, California USA
  • Hertogenbosch, Netherlands
  • Kunshan, China
  • Taipei, Taiwan
  • Kawasaki, Japan
  • Seoul, South Korea
Manufacturing Locations:

  • Kunshan, China
  • Qingdao, China
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