Speed, density, flexibility, efficiency, and standardization. These are the five words that best describe our rich portfolio of pluggable I/O interconnects. Our products are continuously improved to move data faster while also keeping system thermal management in mind. Our teams are also highly involved with standard organizations to design form factors for mass industry adoption.
Leading global networking companies have defined microQSFP: a new compact, hot‐pluggable transceiver module form factor targeting next generation data communications.