Products (22) Overview
Land Grid Array (LGA) Sockets

Ease of Soldering and Positioning

Our LGA sockets provide a compressive electrical interconnect between the processor and the printed circuit board (PCB). As computing power increases, chips’ pin count are increasing. A robust bolster plate provides a reliable interconnection to the microprocessor package and limits PCB bowing during compression to ensure a reliable connection. The contact tip geometry is optimized to reduce risk of contact damage during handling and package installation. Our flexible tooling provides high-quality, fast turnaround time for prototypes so sockets can be in your hands at the earliest stages of your program.

Product Features:

LGA Sockets
  • Socket housing facilitates efficient soldering to the PCB.
  • Socket is supplied with a cap to facilitate vacuum pick and place.
  • Backplates are available in zinc or nickel plating.
LGA 3647 Socket and Hardware

LGA 3647 Socket and Hardware

  1. LGA 3647 Socket and Hardware (English)

TE’s new LGA 3647 socket and hardware allows designers to take advantage of Intel’s new high performance processors that also offer better system scaling.

Product Details:

LGA 3647 Socket
  • Pitch: 0.9906mm Hex
  • SP Height: 2.7mm
  • Cont. NF: 25gf @ nominal def.
  • Pin count: 3647
  • Pin array: 49x74
  • Multi-piece housing: 2 piece
LGA Sockets

LGA sockets

LGA sockets are the latest socket technology for Intel- and AMD-based LGA microprocessor packages that range in size up to 3647 pins. This generation of LGA sockets provides a compressive electrical interface to the microprocessor package and are solder ball, surface mount attached to the PCB. The stainless steel load plate provides a reliable interconnection to the microprocessor package with a single lever handle for package actuation. The contact tip geometry is optimized to reduce risk of contact damage during handling and package installation.

Related Materials
Land Grid Array (LGA) Sockets

Ease of Soldering and Positioning

Our LGA sockets provide a compressive electrical interconnect between the processor and the printed circuit board (PCB). As computing power increases, chips’ pin count are increasing. A robust bolster plate provides a reliable interconnection to the microprocessor package and limits PCB bowing during compression to ensure a reliable connection. The contact tip geometry is optimized to reduce risk of contact damage during handling and package installation. Our flexible tooling provides high-quality, fast turnaround time for prototypes so sockets can be in your hands at the earliest stages of your program.

Product Features:

LGA Sockets
  • Socket housing facilitates efficient soldering to the PCB.
  • Socket is supplied with a cap to facilitate vacuum pick and place.
  • Backplates are available in zinc or nickel plating.
LGA 3647 Socket and Hardware

LGA 3647 Socket and Hardware

  1. LGA 3647 Socket and Hardware (English)

TE’s new LGA 3647 socket and hardware allows designers to take advantage of Intel’s new high performance processors that also offer better system scaling.

Product Details:

LGA 3647 Socket
  • Pitch: 0.9906mm Hex
  • SP Height: 2.7mm
  • Cont. NF: 25gf @ nominal def.
  • Pin count: 3647
  • Pin array: 49x74
  • Multi-piece housing: 2 piece
LGA Sockets

LGA sockets

LGA sockets are the latest socket technology for Intel- and AMD-based LGA microprocessor packages that range in size up to 3647 pins. This generation of LGA sockets provides a compressive electrical interface to the microprocessor package and are solder ball, surface mount attached to the PCB. The stainless steel load plate provides a reliable interconnection to the microprocessor package with a single lever handle for package actuation. The contact tip geometry is optimized to reduce risk of contact damage during handling and package installation.