High Quality Socket Technology
Featuring our latest LGA 3647 socket for Intel CPU processors, we offer a wide range of socket solutions for land grid array (LGA) packages designed to support both Intel and AMD based LGA microprocessor packages.
Our LGA sockets provide a compressive electrical interconnect between the processor and the printed circuit board (PCB). As computing power increases, chips’ pin count are increasing. A robust bolster plate provides a reliable interconnection to the microprocessor package and limits PCB bowing during compression to ensure a reliable connection. The contact tip geometry is optimized to reduce risk of contact damage during handling and package installation. Our flexible tooling provides fast turnaround time for prototypes so sockets can be in your hands at the earliest stages of your program.
LGA 3647 Socket
- Pitch: 0.9906mm Hex
- SP Height: 2.7mm
- Cont. NF: 25gf @ nominal def.
- Pin count: 3647
- Pin array: 49x74
- Multi-piece housing: 2 piece
TE Connectivity’s new LGA 3647 socket meets the next-generation designs of Intel’s new CPU processors for higher performance and better system scaling.
Features: LGA Sockets
Ease of Soldering and Positioning
- Socket housing facilitates efficient soldering to the PCB.
- Socket is supplied with a cap to facilitate vacuum pick and place.
- Backplates are available in zinc or nickel plating.
for LGA Sockets
- High Performance Computing (HPC)
- Workstations and desktop computers
LGA sockets are the latest socket technology for Intel- and AMD-based LGA microprocessor packages that range in size up to 1200+ positions. This generation of LGA sockets provides a compressive electrical interface to the microprocessor package and are solder ball, surface mount attached to the PCB. The stainless steel load plate provides a reliable interconnection to the microprocessor package with a single lever handle for package actuation. The contact tip geometry is optimized to reduce risk of contact damage during handling and package installation.