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Overview

The 1620 is a fully piezoresistive silicon pressure sensor for use in invasive blood pressure monitoring.  The sensor is designed to be used with automated assembly equipment and can be dropped directly into a customer's disposable blood pressure housing. The sensor is designed to meet the requirements as described in the Association for the Advancement of Medical Instrumentation (AAMI) specification for Blood Pressure Transducers. The pressure sensor consists of a pressure sensing element mounted on a ceramic substrate. Thick film resistors on the ceramic substrate are laser trimmed for compensation and calibration. A plastic cap is attached to the ceramic substrate to provide an easy method of attachment to the customer’s assembly and protection for the sensing element. A dielectric gel is placed over the sensor to provide electrical and fluid isolation. The 1620 pressure sensors are batch manufactured in a 10x12 element array on a ceramic substrate (120 units per substrate). The products are shipped in anti-static shipping containers. They can also be shipped on a tape and reel. Performance characteristics and packaging can be easily tailored on a special order basis to meet the requirements of specific customers. 

Benefits

  • Low Cost, Medical Applications 
  • Small Size and Reliable Performance
  • Gel Isolation for Liquids 
  • Operates from 5°C to 40°C 
  • Compatible for Automated Assembly
  • 1% Accuracy for Replacements 
  • 5.0 uV/V/mmHg Sensitivity 
  • Customization for OEM Applications 
Features

Please review product documents or contact us for the latest agency approval information.  

Product Type Features

  • Sensor Type  Disposable Medical Pressure Sensors

  • Type  Gage

Configuration Features

  • Tubes  Narrow Hole, Wide Hole

Electrical Characteristics

  • Supply Voltage (V) 6

Dimensions

  • Dimensions 8.13 x 11.43 x 4.2 mm [ .32 x .45 x .16 in ]

Usage Conditions

  • Operating Temperature 10 – 40 °C [ 50 – 104 °F ]

Operation/Application

  • Output/Span  Sensitivity = 5 uV/V/mmHg

  • Accuracy  ±1.0% FSO

  • Overpressure  125 psi

  • Pressure (mmHG) -50 – 300

Packaging Features

  • Package  Hybrid Assembly

Other

  • Options  Pad Type 2 C2160 Hereaus, Pad Type 4 C2160 Hereaus, Pad Type 6 C2160 Hereaus, Pad Type A ESL 9695-G with C1302 Longchi on Top, Pad Type B ESL9695-G with Solder Bumps, Pad Type E ESL 9695-G with C1302 Longchi on Top, Pad Type F 9695-C with C1302 Longchi on Top

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This information has been provided to you free of charge for your use but remains the sole property of Tyco Electronics Corporation ("TE"). While TE has used reasonable efforts to ensure its accuracy, TE does not guarantee that it is error-free, nor makes any other representation, warranty, or guarantee that the information is completely accurate or up-to-date. In many cases, the CAD data has been simplified to remove proprietary detail while maintaining critical interface geometric detail for use by customers. TE expressly disclaims all implied warranties regarding this information, including but not limited to any implied warranties or merchantability or fitness for a particular purpose.