Mini Spring Sockets: Bullet Nose, 5A

Please review product documents or contact us for the latest agency approval information.  

• Connector & Contact Terminates To  Printed Circuit Board

• Socket Sleeve Style  Bullet Nose

• Connector System  Cable-to-Board

• Sealable  No

• Compatible With Wire & Cable Type  Discrete Wire

• Sleeve Plating Material  Tin

• Sleeve Material  Copper

• Contact Base Material  Beryllium Copper

• Contact Mating Area Plating Material Thickness (µm) 2.54, 30

• Contact Mating Area Plating Material Thickness (µin) 30

• Contact Current Rating (Max) (A) 5

• Contact Spring Plating Thickness (µm) .762, 2.54, 3.81

• Contact Spring Plating Thickness (µin) 30

• Contact Spring Plating Material  Gold, Tin

• Termination Method to Wire & Cable  Solder

• Termination Method to Printed Circuit Board  Through Hole - Press-Fit

• Insertion Method  Hand/Semi-Automatic, Hand/Semi-Automatic/Automatic

• PCB Thickness (Recommended)  .79 – 3.18 mm [ .031 – .125 in ]

• Socket Length (mm) 4.67, 7.37

• Socket Length (in) .184, .29

• PCB Hole Diameter (mm) 1.32, 1.57

• PCB Hole Diameter (in) .052, .062

• Wire Size (AWG) 22 – 20, 28 – 22

• Wire Size (mm²) .081 – .326, .326 – .518

• Mating Pin Diameter Range (mm) .36 – .66, .71 – .84

• Mating Pin Diameter Range (in) .014 – .026, .028 – .033

• Operating Temperature Range  -65 – 125 °C [ -85 – 257 °F ]

• Circuit Application  Power & Signal

• Solder Process Feature  Anti-Flux, None

• Packaging Method  Bag, Carrier Tape, Loose Piece, Reel

• Packaging Quantity  2000, 10000

• Spring Material  Beryllium Copper