CAD Files

Product Environmental Compliance

TE Material Declaration

Please review product documents or contact us for the latest agency approval information. 

 

Please Note: Use the Product Drawing for all design activity. 

Product Type Features

  • DRAM Type  Double Data Rate (DDR)

  • Row-to-Row Spacing 1.6 mm [ .063 in ]

  • Center Post  With

  • Profile  Low

  • Applies To  Printed Circuit Board

  • Product Type  Socket

Configuration Features

  • Number of Positions  184

  • Module Orientation  25°

  • Number of Rows  2

  • Center Key  Offset Left

  • Number of Keys  1

  • Number of Bays  2

Electrical Characteristics

  • DRAM Voltage (V) 2.5

Body Features

  • Ejector Type  Standard

  • Module Key Type  Left Center

  • Ejector Material Color  Natural

  • Ejector Location  Both Ends

  • Ejector Material  High Temperature Nylon

  • Latch Material  High Temperature Nylon

  • Retention Post Location  Both Ends

  • Retention Post Material  Phosphor Bronze

Contact Features

  • Contact Base Material  Phosphor Bronze

  • Socket Type  Memory Card

  • Solder Tail Contact Plating Thickness 3.81 µm [ 150 µin ]

  • Contact Mating Area Plating Thickness .76 µm [ 30 µin ]

  • Solder Tail Contact Plating Material  Matte Tin over Nickel

  • Socket Style  DIMM 2P

  • Contact Mating Area Plating Material  Gold

Termination Features

  • Insertion Style  Direct Insert

  • Termination Post Length 2.62 mm [ .103 in ]

Mechanical Attachment

  • PCB Mounting Style  Through Hole

  • Polarization  Left

  • Mounting Angle  Right Angle

  • Boardlock Material  Stainless Steel

  • PCB Mount Retention  With

  • Locating Posts  Without

  • PCB Mount Retention Type  Boardlocks

Housing Features

  • Centerline 1.27 mm [ .05 in ]

  • Housing Color  Black

  • Housing Material  High Temperature Nylon

Dimensions

  • Center Retention Hole Diameter 2.25 mm [ .089 in ]

  • Height above PC Board 12.15 mm [ .47 in ]

Industry Standards

  • UL Flammability Rating  UL 94V-0

Packaging Features

  • Packaging Method  Tray, Tray/Box

  • Packaging Quantity  32

Terms and Conditions

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Disclaimer:
This information has been provided to you free of charge for your use but remains the sole property of Tyco Electronics Corporation ("TE"). While TE has used reasonable efforts to ensure its accuracy, TE does not guarantee that it is error-free, nor makes any other representation, warranty, or guarantee that the information is completely accurate or up-to-date. In many cases, the CAD data has been simplified to remove proprietary detail while maintaining critical interface geometric detail for use by customers. TE expressly disclaims all implied warranties regarding this information, including but not limited to any implied warranties or merchantability or fitness for a particular purpose.