390112-1 SO DIMM Sockets
  • DRAM Type Small Outline (SO)
  • Connector System Cable-to-Board
  • Profile High
  • Row-to-Row Spacing 6.2
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Socket
  • Module Orientation Right Angle
  • Number of Positions 144
  • Number of Rows 2
  • Number of Keys 1
  • Center Key Offset Left
  • Number of Bays 2
  • DRAM Voltage 3.3
  • Module Key Type SDRAM
  • Latch Plating Material Tin
  • Latch Material Stainless Steel
  • Ejector Location None
  • Solder Tail Contact Plating Material Gold Flash
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .25
  • Contact Base Material Copper Alloy
  • Socket Type Memory Card
  • Socket Style SO DIMM
  • Insertion Style Cam-In
  • PCB Mounting Style Surface Mount
  • Connector Mounting Type Board Mount
  • PCB Mount Retention With
  • PCB Mount Retention Type Hold-Down Posts
  • Centerline (Pitch) .8
  • Housing Material High Temperature Plastic
  • Housing Color Natural
  • Stack Height 5.6
  • Operating Temperature Range -55 – 105
  • Circuit Application Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Method Soft Tray
  • Packaging Quantity 20
6-390112-1 SO DIMM Sockets
  • DRAM Type Small Outline (SO)
  • Connector System Cable-to-Board
  • Profile High
  • Row-to-Row Spacing 6.2
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Socket
  • Module Orientation Right Angle
  • Number of Positions 144
  • Number of Rows 2
  • Number of Keys 1
  • Center Key Offset Left
  • Number of Bays 2
  • DRAM Voltage 3.3
  • Module Key Type SDRAM
  • Latch Plating Material Tin
  • Latch Material Stainless Steel
  • Ejector Location None
  • Solder Tail Contact Plating Material Gold Flash
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .25
  • Contact Base Material Copper Alloy
  • Socket Type Memory Card
  • Socket Style SO DIMM
  • Insertion Style Cam-In
  • PCB Mounting Style Surface Mount
  • Connector Mounting Type Board Mount
  • PCB Mount Retention With
  • PCB Mount Retention Type Hold-Down Posts
  • Centerline (Pitch) .8
  • Housing Material High Temperature Plastic
  • Housing Color Natural
  • Stack Height 5.6
  • Operating Temperature Range -55 – 105
  • Circuit Application Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tape & Reel
  • Packaging Quantity 200
1981284-4 SO DIMM Sockets
  • DRAM Type Double Data Rate (DDR)
  • Connector System Cable-to-Board
  • Profile Standard
  • Row-to-Row Spacing 6.2
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Socket
  • Module Orientation Right Angle
  • Number of Positions 200
  • Number of Rows 2
  • Keying Standard
  • Number of Keys 1
  • Center Key None
  • Number of Bays 2
  • DRAM Voltage 1.8
  • SGRAM Voltage 1.8
  • Ejector Type Locking
  • Module Key Type SGRAM
  • Latch Plating Material Tin
  • Latch Material Stainless Steel
  • Ejector Location Both Ends
  • Solder Tail Contact Plating Material Gold Flash
  • Contact Mating Area Plating Material Gold
  • Contact Current Rating (Max) .5
  • Contact Base Material Copper Alloy
  • Socket Type Memory Card
  • Socket Style SO DIMM
  • Insertion Style Cam-In
  • PCB Mounting Style Surface Mount
  • Connector Mounting Type Board Mount
  • PCB Mount Retention With
  • PCB Mount Retention Type Solder Tail (Pin)
  • Centerline (Pitch) .6
  • Housing Material High Temperature Thermoplastic
  • Housing Color Black
  • Stack Height 9.2
  • Operating Temperature Range -55 – 85
  • Circuit Application Power
  • UL Flammability Rating UL 94V-0
  • Packaging Method Box & Tray
  • Packaging Quantity 20
1565917-4 SO DIMM Sockets
  • DRAM Type Double Data Rate (DDR)
  • Connector System Cable-to-Board
  • Profile Standard
  • Row-to-Row Spacing 6.2
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Socket
  • Module Orientation Right Angle
  • Number of Positions 200
  • Number of Rows 2
  • Keying Standard
  • Number of Keys 1
  • Center Key None
  • Number of Bays 2
  • DRAM Voltage 1.8
  • SGRAM Voltage 1.8
  • Ejector Type Locking
  • Module Key Type SGRAM
  • Latch Plating Material Tin
  • Latch Material Stainless Steel
  • Ejector Location Both Ends
  • Solder Tail Contact Plating Material Gold Flash
  • Contact Mating Area Plating Material Gold Flash
  • Contact Current Rating (Max) .5
  • Contact Base Material Copper Alloy
  • Socket Type Memory Card
  • Socket Style SO DIMM
  • Insertion Style Cam-In
  • PCB Mounting Style Surface Mount
  • Connector Mounting Type Board Mount
  • PCB Mount Retention With
  • PCB Mount Retention Type Solder Peg
  • Centerline (Pitch) .6
  • Housing Material High Temperature Thermoplastic
  • Housing Color Black
  • Stack Height 5.2
  • Operating Temperature Range -55 – 85
  • Circuit Application Power
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tape & Reel
  • Packaging Quantity 150
390113-1 SO DIMM Sockets
  • DRAM Type Small Outline (SO)
  • Connector System Cable-to-Board
  • Profile Standard
  • Row-to-Row Spacing 6.2
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Socket
  • Module Orientation Right Angle
  • Number of Positions 144
  • Number of Rows 2
  • Number of Keys 1
  • Center Key Offset Left
  • Number of Bays 2
  • DRAM Voltage 3.3
  • Module Key Type SDRAM
  • Latch Plating Material Tin
  • Latch Material Stainless Steel
  • Ejector Location None
  • Solder Tail Contact Plating Material Gold Flash
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .25
  • Contact Base Material Copper Alloy
  • Socket Type Memory Card
  • Socket Style SO DIMM
  • Insertion Style Cam-In
  • PCB Mounting Style Surface Mount
  • Connector Mounting Type Board Mount
  • PCB Mount Retention With
  • PCB Mount Retention Type Hold-Down Posts
  • Centerline (Pitch) .8
  • Housing Material High Temperature Plastic
  • Housing Color Natural
  • Stack Height 5.2
  • Operating Temperature Range -55 – 105
  • Circuit Application Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Method Soft Tray
  • Packaging Quantity 20
1827341-4 SO DIMM Sockets
  • DRAM Type Double Data Rate (DDR) 2
  • Connector System Cable-to-Board
  • Profile Standard
  • Row-to-Row Spacing 6.2
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Center Post Without
  • Product Type Socket
  • Module Orientation Right Angle
  • Number of Positions 200
  • Number of Rows 2
  • Keying Standard
  • Number of Keys 1
  • Center Key Offset Left
  • Number of Bays 2
  • DRAM Voltage 1.8
  • SGRAM Voltage 1.8
  • Ejector Type Locking
  • Module Key Type Offset Left
  • Retention Post Location Center
  • Ejector Location Both Ends
  • Solder Tail Contact Plating Material Gold over Nickel
  • Contact Mating Area Plating Material Gold
  • Contact Current Rating (Max) .5
  • Contact Base Material Copper Alloy
  • Socket Type Memory Card
  • Socket Style SO DIMM
  • Insertion Style Cam-In
  • PCB Mounting Style Surface Mount
  • Connector Mounting Type Board Mount
  • PCB Mount Retention With
  • PCB Mount Retention Type Solder Tail (Pin)
  • Centerline (Pitch) .6
  • Housing Material LCP (Liquid Crystal Polymer)
  • Housing Color Black
  • Stack Height 8
  • Operating Temperature Range -55 – 85
  • Circuit Application Power
  • UL Flammability Rating UL 94V-0
  • Packaging Method Box & Tray
  • Packaging Quantity 20
390322-1 SO DIMM Sockets
  • DRAM Type Small Outline (SO)
  • Connector System Cable-to-Board
  • Profile High
  • Row-to-Row Spacing 6.2
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Socket
  • Module Orientation Right Angle
  • Number of Positions 144
  • Number of Rows 2
  • Number of Keys 1
  • Center Key Offset Left
  • Number of Bays 2
  • DRAM Voltage 3.3
  • Module Key Type SDRAM
  • Latch Plating Material Tin
  • Latch Material Stainless Steel
  • Ejector Location None
  • Solder Tail Contact Plating Material Gold Flash
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .25
  • Contact Base Material Copper Alloy
  • Socket Type Memory Card
  • Socket Style SO DIMM
  • Insertion Style Cam-In
  • PCB Mounting Style Surface Mount
  • Connector Mounting Type Board Mount
  • PCB Mount Retention With
  • PCB Mount Retention Type Hold-Down Posts
  • Centerline (Pitch) .8
  • Housing Material High Temperature Plastic
  • Housing Color Natural
  • Operating Temperature Range -55 – 105
  • Circuit Application Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Method Soft Tray
  • Packaging Quantity 20
2013311-3 SO DIMM Sockets
  • DRAM Type Double Data Rate (DDR) 3
  • Connector System Cable-to-Board
  • Profile Reverse
  • Row-to-Row Spacing 8.2
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Socket
  • Module Orientation Right Angle
  • Number of Positions 204
  • Number of Rows 2
  • Keying Reverse
  • Number of Keys 1
  • Center Key Offset Right
  • Number of Bays 2
  • DRAM Voltage 1.5
  • SGRAM Voltage 1.5
  • Ejector Type Locking
  • Module Key Type SGRAM
  • Latch Plating Material Tin
  • Latch Material Stainless Steel
  • Ejector Location Both Ends
  • Solder Tail Contact Plating Material Gold
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .76
  • Contact Current Rating (Max) .5
  • Contact Base Material Copper Alloy
  • Socket Type Memory Card
  • Socket Style SO DIMM
  • Insertion Style Cam-In
  • PCB Mounting Style Surface Mount
  • Connector Mounting Type Board Mount
  • PCB Mount Retention With
  • PCB Mount Retention Type Solder Peg
  • Centerline (Pitch) .6
  • Housing Material High Temperature Thermoplastic
  • Housing Color Black
  • Stack Height 9.2
  • Operating Temperature Range -55 – 85
  • Circuit Application Power
  • UL Flammability Rating UL 94V-0
  • Packaging Method Semi-Hard Tray Assembly
  • Packaging Quantity 20
  • Comment With floating peg.
2-2013022-1 SO DIMM Sockets
  • DRAM Type Double Data Rate (DDR) 3
  • Connector System Cable-to-Board
  • Profile Standard
  • Row-to-Row Spacing 8.2
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Socket
  • Module Orientation Right Angle
  • Number of Positions 204
  • Number of Rows 2
  • Keying Standard
  • Number of Keys 1
  • Center Key Offset Left
  • Number of Bays 2
  • DRAM Voltage 1.5
  • SGRAM Voltage 1.5
  • Ejector Type Locking
  • Module Key Type SGRAM
  • Latch Plating Material Tin
  • Latch Material Stainless Steel
  • Ejector Location Both Ends
  • Solder Tail Contact Plating Material Gold Flash
  • Contact Mating Area Plating Material Gold Flash
  • Contact Current Rating (Max) .5
  • Contact Base Material Copper Alloy
  • Socket Type Memory Card
  • Socket Style SO DIMM
  • Insertion Style Cam-In
  • PCB Mounting Style Surface Mount
  • Connector Mounting Type Board Mount
  • PCB Mount Retention With
  • PCB Mount Retention Type Solder Tail (Pin)
  • Centerline (Pitch) .6
  • Housing Material High Temperature Thermoplastic
  • Housing Color Black
  • Stack Height 4
  • Operating Temperature Range -55 – 85
  • Circuit Application Power
  • UL Flammability Rating UL 94V-0
  • Packaging Method Emboss on Reel
  • Packaging Quantity 200
  • Comment Without floating peg.
1473005-1 SO DIMM Sockets
  • DRAM Type Double Data Rate (DDR)
  • Connector System Cable-to-Board
  • Profile Standard
  • Row-to-Row Spacing 6.2
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Socket
  • Module Orientation Right Angle
  • Number of Positions 200
  • Number of Rows 2
  • Keying Standard
  • Number of Keys 1
  • Center Key None
  • Number of Bays 2
  • DRAM Voltage 2.5
  • SGRAM Voltage 2.5
  • Ejector Type Locking
  • Module Key Type SGRAM
  • Latch Plating Material Tin
  • Latch Material Stainless Steel
  • Ejector Location Both Ends
  • Solder Tail Contact Plating Material Gold Flash
  • Contact Mating Area Plating Material Gold Flash
  • Contact Current Rating (Max) .5
  • Contact Base Material Copper Alloy
  • Socket Type Memory Card
  • Socket Style SO DIMM
  • Insertion Style Cam-In
  • PCB Mounting Style Surface Mount
  • Connector Mounting Type Board Mount
  • PCB Mount Retention With
  • PCB Mount Retention Type Solder Peg
  • Centerline (Pitch) .6
  • Housing Material High Temperature Thermoplastic
  • Housing Color Black
  • Stack Height 5.2
  • Operating Temperature Range -55 – 85
  • Circuit Application Power
  • UL Flammability Rating UL 94V-0
  • Packaging Method Semi-Hard Tray Assembly
  • Packaging Quantity 20
1473149-4 SO DIMM Sockets
  • DRAM Type Double Data Rate (DDR)
  • Connector System Cable-to-Board
  • Profile Standard
  • Row-to-Row Spacing 6.2
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Socket
  • Module Orientation Right Angle
  • Number of Positions 200
  • Number of Rows 2
  • Keying Reverse
  • Number of Keys 1
  • Center Key None
  • Number of Bays 2
  • DRAM Voltage 1.8
  • SGRAM Voltage 1.8
  • Ejector Type Locking
  • Module Key Type SGRAM
  • Latch Plating Material Tin
  • Latch Material Stainless Steel
  • Ejector Location Both Ends
  • Solder Tail Contact Plating Material Gold Flash
  • Contact Mating Area Plating Material Gold Flash
  • Contact Current Rating (Max) .5
  • Contact Base Material Copper Alloy
  • Socket Type Memory Card
  • Socket Style SO DIMM
  • Insertion Style Cam-In
  • PCB Mounting Style Surface Mount
  • Connector Mounting Type Board Mount
  • PCB Mount Retention With
  • PCB Mount Retention Type Solder Peg
  • Centerline (Pitch) .6
  • Housing Material High Temperature Thermoplastic
  • Housing Color Black
  • Stack Height 5.2
  • Operating Temperature Range -55 – 85
  • Circuit Application Power
  • UL Flammability Rating UL 94V-0
  • Packaging Method Semi-Hard Tray Assembly
  • Packaging Quantity 20
2-2013297-1 SO DIMM Sockets
  • DRAM Type Double Data Rate (DDR) 3
  • Connector System Cable-to-Board
  • Profile Standard
  • Row-to-Row Spacing 8.2
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Socket
  • Module Orientation Right Angle
  • Number of Positions 204
  • Number of Rows 2
  • Keying Standard
  • Number of Keys 1
  • Center Key Offset Left
  • Number of Bays 2
  • DRAM Voltage 1.5
  • SGRAM Voltage 1.5
  • Ejector Type Locking
  • Module Key Type SGRAM
  • Latch Plating Material Tin
  • Latch Material Stainless Steel
  • Ejector Location Both Ends
  • Solder Tail Contact Plating Material Gold
  • Contact Mating Area Plating Material Gold Flash
  • Contact Current Rating (Max) .5
  • Contact Base Material Copper Alloy
  • Socket Type Memory Card
  • Socket Style SO DIMM
  • Insertion Style Cam-In
  • PCB Mounting Style Surface Mount
  • Connector Mounting Type Board Mount
  • PCB Mount Retention With
  • PCB Mount Retention Type Solder Peg
  • Centerline (Pitch) .6
  • Housing Material High Temperature Thermoplastic
  • Housing Color Black
  • Stack Height 8
  • Operating Temperature Range -55 – 85
  • Circuit Application Power
  • UL Flammability Rating UL 94V-0
  • Packaging Method Emboss on Reel
  • Packaging Quantity 150
  • Comment With floating peg.
1-1735251-2 SO DIMM Sockets
  • DRAM Type Double Data Rate (DDR)
  • Connector System Cable-to-Board
  • Profile Standard
  • Row-to-Row Spacing 6.2
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Socket
  • Module Orientation Right Angle
  • Number of Positions 144
  • Number of Rows 2
  • Keying Standard
  • Number of Keys 1
  • Center Key None
  • Number of Bays 2
  • DRAM Voltage 1.8
  • SGRAM Voltage 1.8
  • Ejector Type Locking
  • Module Key Type SGRAM
  • Latch Plating Material Tin
  • Latch Material Stainless Steel
  • Ejector Location Both Ends
  • Solder Tail Contact Plating Material Gold
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .25
  • Contact Base Material Copper Alloy
  • Socket Type Memory Card
  • Socket Style SO DIMM
  • Insertion Style Cam-In
  • PCB Mounting Style Surface Mount
  • Connector Mounting Type Board Mount
  • PCB Mount Retention With
  • PCB Mount Retention Type Hold-Down Posts
  • Centerline (Pitch) .8
  • Housing Material High Temperature Thermoplastic
  • Housing Color Black
  • Stack Height 5.2
  • Operating Temperature Range -55 – 105
  • Circuit Application Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tape & Reel
  • Packaging Quantity 200
1473005-4 SO DIMM Sockets
  • DRAM Type Double Data Rate (DDR)
  • Connector System Cable-to-Board
  • Profile Standard
  • Row-to-Row Spacing 6.2
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Socket
  • Module Orientation Right Angle
  • Number of Positions 200
  • Number of Rows 2
  • Keying Standard
  • Number of Keys 1
  • Center Key None
  • Number of Bays 2
  • DRAM Voltage 1.8
  • SGRAM Voltage 1.8
  • Ejector Type Locking
  • Module Key Type SGRAM
  • Latch Plating Material Tin
  • Latch Material Stainless Steel
  • Ejector Location Both Ends
  • Solder Tail Contact Plating Material Gold Flash
  • Contact Mating Area Plating Material Gold Flash
  • Contact Current Rating (Max) .5
  • Contact Base Material Copper Alloy
  • Socket Type Memory Card
  • Socket Style SO DIMM
  • Insertion Style Cam-In
  • PCB Mounting Style Surface Mount
  • Connector Mounting Type Board Mount
  • PCB Mount Retention With
  • PCB Mount Retention Type Solder Peg
  • Centerline (Pitch) .6
  • Housing Material High Temperature Thermoplastic
  • Housing Color Black
  • Stack Height 5.2
  • Operating Temperature Range -55 – 85
  • Circuit Application Power
  • UL Flammability Rating UL 94V-0
  • Packaging Method Semi-Hard Tray Assembly
  • Packaging Quantity 20
1612618-4 SO DIMM Sockets
  • DRAM Type Double Data Rate (DDR)
  • Connector System Cable-to-Board
  • Profile Ultra High
  • Row-to-Row Spacing 6.2
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Socket
  • Module Orientation Right Angle
  • Number of Positions 200
  • Number of Rows 2
  • Keying Standard
  • Number of Keys 1
  • Center Key None
  • Number of Bays 2
  • DRAM Voltage 1.8
  • SGRAM Voltage 1.8
  • Ejector Type Locking
  • Module Key Type SGRAM
  • Latch Plating Material Tin
  • Latch Material Stainless Steel
  • Ejector Location Both Ends
  • Solder Tail Contact Plating Material Gold Flash
  • Contact Mating Area Plating Material Gold Flash
  • Contact Current Rating (Max) .5
  • Contact Base Material Copper Alloy
  • Socket Type Memory Card
  • Socket Style SO DIMM
  • Insertion Style Cam-In
  • PCB Mounting Style Surface Mount
  • Connector Mounting Type Board Mount
  • PCB Mount Retention With
  • PCB Mount Retention Type Solder Peg
  • Centerline (Pitch) .6
  • Housing Material High Temperature Thermoplastic
  • Housing Color Black
  • Stack Height 9.2
  • Operating Temperature Range -55 – 85
  • Circuit Application Power
  • UL Flammability Rating UL 94V-0
  • Packaging Method Semi-Hard Tray Assembly
  • Packaging Quantity 20
  • Comment Semi-Hard Tray with 20 sockets PN 1279284-1
1473150-4 SO DIMM Sockets
  • DRAM Type Double Data Rate (DDR) 2
  • Connector System Cable-to-Board
  • Profile Standard
  • Row-to-Row Spacing 6.2
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Socket
  • Module Orientation Right Angle
  • Number of Positions 200
  • Number of Rows 2
  • Keying Reverse
  • Number of Keys 1
  • Center Key None
  • Number of Bays 2
  • DRAM Voltage 1.8
  • SGRAM Voltage 1.8
  • Ejector Type Locking
  • Module Key Type SGRAM
  • Latch Plating Material Tin
  • Latch Material Stainless Steel
  • Ejector Location Both Ends
  • Solder Tail Contact Plating Material Gold Flash
  • Contact Mating Area Plating Material Gold Flash
  • Contact Current Rating (Max) .5
  • Contact Base Material Copper Alloy
  • Socket Type Memory Card
  • Socket Style SO DIMM
  • Insertion Style Cam-In
  • PCB Mounting Style Surface Mount
  • Connector Mounting Type Board Mount
  • PCB Mount Retention With
  • PCB Mount Retention Type Solder Peg
  • Centerline (Pitch) .6
  • Housing Material High Temperature Thermoplastic
  • Housing Color Black
  • Stack Height 5.2
  • Operating Temperature Range -55 – 85
  • Circuit Application Power
  • UL Flammability Rating UL 94V-0
  • Packaging Method Box & Tray
  • Packaging Quantity 20
2-2013289-1 SO DIMM Sockets
  • DRAM Type Double Data Rate (DDR) 3
  • Connector System Cable-to-Board
  • Profile Standard
  • Row-to-Row Spacing 8.2
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Socket
  • Module Orientation Right Angle
  • Number of Positions 204
  • Number of Rows 2
  • Keying Standard
  • Number of Keys 1
  • Center Key Offset Left
  • Number of Bays 2
  • DRAM Voltage 1.5
  • SGRAM Voltage 1.5
  • Ejector Type Locking
  • Module Key Type SGRAM
  • Latch Plating Material Tin
  • Latch Material Stainless Steel
  • Ejector Location Both Ends
  • Solder Tail Contact Plating Material Gold
  • Contact Mating Area Plating Material Gold Flash
  • Contact Current Rating (Max) .5
  • Contact Base Material Copper Alloy
  • Socket Type Memory Card
  • Socket Style SO DIMM
  • Insertion Style Cam-In
  • PCB Mounting Style Surface Mount
  • Connector Mounting Type Board Mount
  • PCB Mount Retention With
  • PCB Mount Retention Type Solder Peg
  • Centerline (Pitch) .6
  • Housing Material High Temperature Thermoplastic
  • Housing Color Black
  • Stack Height 5.2
  • Operating Temperature Range -55 – 85
  • Circuit Application Power
  • UL Flammability Rating UL 94V-0
  • Packaging Method Emboss on Reel
  • Packaging Quantity 200
  • Comment With floating peg.
1473006-4 SO DIMM Sockets
  • DRAM Type Double Data Rate (DDR)
  • Connector System Cable-to-Board
  • Profile Standard
  • Row-to-Row Spacing 6.2
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Socket
  • Module Orientation Right Angle
  • Number of Positions 200
  • Number of Rows 2
  • Keying Reverse
  • Number of Keys 1
  • Center Key None
  • Number of Bays 2
  • DRAM Voltage 1.8
  • SGRAM Voltage 1.8
  • Ejector Type Locking
  • Module Key Type SGRAM
  • Latch Plating Material Tin
  • Latch Material Stainless Steel
  • Ejector Location Both Ends
  • Solder Tail Contact Plating Material Gold Flash
  • Contact Mating Area Plating Material Gold Flash
  • Contact Current Rating (Max) .5
  • Contact Base Material Copper Alloy
  • Socket Type Memory Card
  • Socket Style SO DIMM
  • Insertion Style Cam-In
  • PCB Mounting Style Surface Mount
  • Connector Mounting Type Board Mount
  • PCB Mount Retention With
  • PCB Mount Retention Type Solder Peg
  • Centerline (Pitch) .6
  • Housing Material High Temperature Thermoplastic
  • Housing Color Black
  • Stack Height 5.2
  • Operating Temperature Range -55 – 85
  • Circuit Application Power
  • UL Flammability Rating UL 94V-0
  • Packaging Method Semi-Hard Tray Assembly
  • Packaging Quantity 20
1717468-3 SO DIMM Sockets
  • DRAM Type Double Data Rate (DDR)
  • Connector System Cable-to-Board
  • Profile Standard
  • Row-to-Row Spacing 6.2
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Socket
  • Module Orientation Right Angle
  • Number of Positions 200
  • Number of Rows 2
  • Keying Standard
  • Number of Keys 1
  • Center Key None
  • Number of Bays 2
  • DRAM Voltage 2.5
  • SGRAM Voltage 2.5
  • Ejector Type Locking
  • Module Key Type SGRAM
  • Latch Material Stainless Steel
  • Ejector Location Both Ends
  • Solder Tail Contact Plating Material Gold Flash
  • Contact Mating Area Plating Material Gold Flash
  • Contact Current Rating (Max) .5
  • Contact Base Material Copper Alloy
  • Socket Type Memory Card
  • Socket Style SO DIMM
  • Insertion Style Cam-In
  • PCB Mounting Style Surface Mount
  • Connector Mounting Type Board Mount
  • PCB Mount Retention With
  • PCB Mount Retention Type Solder Peg
  • Centerline (Pitch) .6
  • Housing Material High Temperature Thermoplastic
  • Housing Color Black
  • Stack Height 6.5
  • Operating Temperature Range -55 – 85
  • Circuit Application Power
  • UL Flammability Rating UL 94V-0
  • Packaging Method Semi-Hard Tray Assembly
  • Packaging Quantity 20
1717254-1 SO DIMM Sockets
  • DRAM Type Double Data Rate (DDR)
  • Connector System Cable-to-Board
  • Profile Standard
  • Row-to-Row Spacing 6.2
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Socket
  • Module Orientation Right Angle
  • Number of Positions 200
  • Number of Rows 2
  • Keying Standard
  • Number of Keys 1
  • Center Key None
  • Number of Bays 2
  • DRAM Voltage 2.5
  • SGRAM Voltage 2.5
  • Ejector Type Locking
  • Module Key Type SGRAM
  • Latch Plating Material Tin
  • Latch Material Stainless Steel
  • Ejector Location Both Ends
  • Solder Tail Contact Plating Material Gold Flash
  • Contact Mating Area Plating Material Gold Flash
  • Contact Current Rating (Max) .5
  • Contact Base Material Copper Alloy
  • Socket Type Memory Card
  • Socket Style SO DIMM
  • Insertion Style Cam-In
  • PCB Mounting Style Surface Mount
  • Connector Mounting Type Board Mount
  • PCB Mount Retention With
  • PCB Mount Retention Type Solder Peg
  • Centerline (Pitch) .6
  • Housing Material High Temperature Thermoplastic
  • Housing Color Black
  • Stack Height 5.2
  • Operating Temperature Range -55 – 85
  • Circuit Application Power
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tape & Reel
  • Packaging Quantity 150