203743-000 Joints & Splices  1
ANSI C119.1
  • Technology Cold Applied
  • Product Type Roll-On Sleeves
  • Closing Method Roll-On
  • Cable Seal Mastic
  • Strain Relief No
  • Number of Main Wires (Max) 1
  • Voltage Class ≤ 1
  • Color Black
  • Cable Cross-Section (Max) (Main) 70
  • Cable Cross-Section (Min) (Main) 10
  • Cable Diameter (Max) (Main) 17
  • Cable Diameter (Min) (Main) 9
  • Chemical Resistance Water, Humic Acids
  • Operating Temperature Range -40 – 130
  • Silicone-Free No
  • UV-Stabilized Yes
  • Halogen Free Yes
  • Solvent-Free Yes
  • Low Smoke Emission No
  • Marine-Offshore-Shipbuilding Certified No
  • Non-Toxic & Non-Corrosive Emission Isocyanate-Free Yes
  • Free of Lead, Cadmium, Heavy Metals Yes
  • Emission Free Label-Free Acc (REACH & CLP) Yes
  • CSA Certified Yes
  • UL Rating Yes
  • Standards ANSI C119.1
  • Product Availability AMERICAS
  • Minimum Order Quantity 1
  • Packaging Quantity 1
  • Packaging Method Bag
  • Minimum Packaging Unit 1
  • Product Use Outdoor, Overhead & Direct Buried
  • Other Colors Available No
2013311-3 SO DIMM Sockets
  • DRAM Type Double Data Rate (DDR) 3
  • Connector System Cable-to-Board
  • Profile Reverse
  • Row-to-Row Spacing 8.2
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Socket
  • Module Orientation Right Angle
  • Number of Positions 204
  • Number of Rows 2
  • Center Key Offset Right
  • Keying Reverse
  • Number of Bays 2
  • Number of Keys 1
  • DRAM Voltage 1.5
  • SGRAM Voltage 1.5
  • Ejector Type Locking
  • Latch Material Stainless Steel
  • Module Key Type SGRAM
  • Latch Plating Material Tin
  • Ejector Location Both Ends
  • Contact Base Material Copper Alloy
  • PCB Contact Termination Area Plating Material Gold
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .76
  • Contact Current Rating (Max) .5
  • Socket Type Memory Card
  • Socket Style SO DIMM
  • Insertion Style Cam-In
  • PCB Mount Retention Type Solder Peg
  • PCB Mount Retention With
  • PCB Mounting Style Surface Mount
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) .6
  • Housing Color Black
  • Housing Material High Temperature Thermoplastic
  • Stack Height 9.2
  • Operating Temperature Range -55 – 85
  • Circuit Application Power
  • UL Flammability Rating UL 94V-0
  • Packaging Method Semi-Hard Tray Assembly
  • Packaging Quantity 20
  • Comment With floating peg.
2-2013290-1 SO DIMM Sockets
  • DRAM Type Double Data Rate (DDR) 3
  • Connector System Cable-to-Board
  • Profile Reverse
  • Row-to-Row Spacing 8.2
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Socket
  • Module Orientation Right Angle
  • Number of Positions 204
  • Number of Rows 2
  • Center Key Offset Right
  • Keying Reverse
  • Number of Bays 2
  • Number of Keys 1
  • DRAM Voltage 1.5
  • SGRAM Voltage 1.5
  • Ejector Type Locking
  • Latch Material Stainless Steel
  • Module Key Type SGRAM
  • Latch Plating Material Tin
  • Ejector Location Both Ends
  • Contact Base Material Copper Alloy
  • PCB Contact Termination Area Plating Material Gold
  • Contact Mating Area Plating Material Gold Flash
  • Contact Current Rating (Max) .5
  • Socket Type Memory Card
  • Socket Style SO DIMM
  • Insertion Style Cam-In
  • PCB Mount Retention Type Solder Peg
  • PCB Mount Retention With
  • PCB Mounting Style Surface Mount
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) .6
  • Housing Color Black
  • Housing Material High Temperature Thermoplastic
  • Stack Height 5.2
  • Operating Temperature Range -55 – 85
  • Circuit Application Power
  • UL Flammability Rating UL 94V-0
  • Packaging Method Emboss on Reel
  • Packaging Quantity 200
  • Comment With floating peg.
1903302-3 SD Card Connectors  1
  • Format Secure Digital
  • Connector & Contact Terminates To Printed Circuit Board
  • Shielded No
  • Product Type Removable Memory Products
  • Operating Function Push-On Push-Off
  • Number of Positions 9
  • Number of Rows 1
  • Lead Configuration Inline
  • Color Black
  • Shell Material Copper Alloy
  • Hold-Down Without
  • Contact Base Material Copper Alloy
  • PCB Contact Termination Area Plating Material Tin
  • Contact Underplating Material Nickel
  • Contact Current Rating (Max) .5
  • Vacuum Tape Without
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .2 – .5
  • PCB Mounting Style Surface Mount
  • Mounting Angle Right Angle
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) 1.7
  • Housing Material LCP (Liquid Crystal Polymer)
  • Housing Color Black
  • Solder Tab Length .8
  • Height above PC Board 2.95
  • Operating Temperature Range -25 – 85
  • Circuit Application Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tape & Reel
2-2013287-1 SO DIMM Sockets
  • DRAM Type Double Data Rate (DDR) 3
  • Connector System Cable-to-Board
  • Profile Reverse
  • Row-to-Row Spacing 8.2
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Socket
  • Module Orientation Right Angle
  • Number of Positions 204
  • Number of Rows 2
  • Center Key Offset Right
  • Keying Reverse
  • Number of Bays 2
  • Number of Keys 1
  • DRAM Voltage 1.5
  • SGRAM Voltage 1.5
  • Ejector Type Locking
  • Latch Material Stainless Steel
  • Module Key Type SGRAM
  • Latch Plating Material Tin
  • Ejector Location Both Ends
  • Contact Base Material Copper Alloy
  • PCB Contact Termination Area Plating Material Gold
  • Contact Mating Area Plating Material Gold Flash
  • Contact Current Rating (Max) .5
  • Socket Type Memory Card
  • Socket Style SO DIMM
  • Insertion Style Cam-In
  • PCB Mount Retention Type Solder Tail (Pin)
  • PCB Mount Retention With
  • PCB Mounting Style Surface Mount
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) .6
  • Housing Color Black
  • Housing Material High Temperature Thermoplastic
  • Stack Height 4
  • Operating Temperature Range -55 – 85
  • Circuit Application Power
  • UL Flammability Rating UL 94V-0
  • Packaging Method Emboss on Reel
  • Packaging Quantity 200
  • Comment Without floating peg.
2-2013290-2 SO DIMM Sockets
  • DRAM Type Double Data Rate (DDR) 3
  • Connector System Cable-to-Board
  • Profile Reverse
  • Row-to-Row Spacing 8.2
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Socket
  • Module Orientation Right Angle
  • Number of Positions 204
  • Number of Rows 2
  • Center Key Offset Right
  • Keying Reverse
  • Number of Bays 2
  • Number of Keys 1
  • DRAM Voltage 1.5
  • SGRAM Voltage 1.5
  • Ejector Type Locking
  • Latch Material Stainless Steel
  • Module Key Type SGRAM
  • Latch Plating Material Tin
  • Ejector Location Both Ends
  • Contact Base Material Copper Alloy
  • PCB Contact Termination Area Plating Material Gold
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .254
  • Contact Current Rating (Max) .5
  • Socket Type Memory Card
  • Socket Style SO DIMM
  • Insertion Style Cam-In
  • PCB Mount Retention Type Solder Peg
  • PCB Mount Retention With
  • PCB Mounting Style Surface Mount
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) .6
  • Housing Color Black
  • Housing Material High Temperature Thermoplastic
  • Stack Height 5.2
  • Operating Temperature Range -55 – 85
  • Circuit Application Power
  • UL Flammability Rating UL 94V-0
  • Packaging Method Emboss on Reel
  • Packaging Quantity 200
  • Comment With floating peg.
2041127-1 PCB D-Sub Connectors
  • Shell Type Front Metal Shell
  • Connector Style Receptacle
  • Connector System Cable-to-Board
  • Row-to-Row Spacing .5 in
  • Shell Size 1
  • Profile Slim
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Shape Reverse "D" Shaped
  • Grounding Indents Without
  • Product Type Connector
  • Footprint 3.1
  • Orientation Reverse
  • Grounding Straps Without
  • Number of Positions 15
  • Number of Rows 3
  • PCB Mount Orientation Right Angle
  • Preloaded Yes
  • Shell Material SPCC
  • Plastic No
  • Shell Plating Material Nickel
  • Color Black
  • Contact Base Material Brass
  • PCB Contact Termination Area Plating Material Tin
  • Contact Shape Round
  • Contact Current Rating (Max) 1
  • Contact Mating Area Plating Material Gold Flash
  • PCB Termination Area Plating Finish Matte
  • Grounding Clips With
  • Termination Post Length 1.8
  • Panel Mount Feature Without
  • PCB Mounting Style Through Hole
  • PCB Mount Retention With
  • PCB Mount Retention Type Retention Leg
  • Mating Connector Lock Without
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) 2.29
  • Housing Color Black
  • Housing Material LCP
  • PCB Thickness (Recommended) 1.19
  • Operating Temperature Range -55 – 105
  • Circuit Application Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Quantity 200
  • Packaging Method Reel
  • Comment Black cap is supplied.
1871916-1 SD Card Connectors
  • Format Secure Digital
  • Connector & Contact Terminates To Printed Circuit Board
  • PCB Offset .8
  • Shielded No
  • Product Type Removable Memory Products
  • Operating Function Push-On Push-Off
  • Number of Positions 9
  • Number of Rows 1
  • Lead Configuration Inline
  • Color Black
  • Shell Material Copper Alloy
  • Hold-Down Without
  • Contact Base Material Copper Alloy
  • PCB Contact Termination Area Plating Material Tin
  • Contact Underplating Material Nickel
  • Contact Current Rating (Max) .5
  • Vacuum Tape Without
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .2 – .5
  • PCB Mounting Style Surface Mount
  • Mounting Angle Right Angle
  • Connector Mounting Type Board Mount
  • Polarizing Post Length .8
  • Centerline (Pitch) 1.7
  • Housing Material LCP (Liquid Crystal Polymer)
  • Housing Color Black
  • Solder Tab Length .8
  • Height above PC Board 2.95
  • Operating Temperature Range -25 – 85
  • Circuit Application Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tape & Reel
1981287-4 SO DIMM Sockets
  • DRAM Type Double Data Rate (DDR)
  • Connector System Cable-to-Board
  • Profile Reverse
  • Row-to-Row Spacing 6.2
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Socket
  • Module Orientation Right Angle
  • Number of Positions 200
  • Number of Rows 2
  • Center Key None
  • Keying Reverse
  • Number of Bays 2
  • Number of Keys 1
  • DRAM Voltage 1.8
  • SGRAM Voltage 1.8
  • Ejector Type Locking
  • Latch Material Stainless Steel
  • Module Key Type SGRAM
  • Latch Plating Material Tin
  • Ejector Location Both Ends
  • Contact Base Material Copper Alloy
  • PCB Contact Termination Area Plating Material Gold Flash
  • Contact Mating Area Plating Material Gold
  • Contact Current Rating (Max) .5
  • Socket Type Memory Card
  • Socket Style SO DIMM
  • Insertion Style Cam-In
  • PCB Mount Retention Type Solder Tail (Pin)
  • PCB Mount Retention With
  • PCB Mounting Style Surface Mount
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) .6
  • Housing Color Black
  • Housing Material High Temperature Thermoplastic
  • Stack Height 9.2
  • Operating Temperature Range -55 – 85
  • Circuit Application Power
  • UL Flammability Rating UL 94V-0
  • Packaging Method Box & Tray
  • Packaging Quantity 20
2-2013298-3 SO DIMM Sockets
  • DRAM Type Double Data Rate (DDR) 3
  • Connector System Cable-to-Board
  • Profile Reverse
  • Row-to-Row Spacing 8.2
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Socket
  • Module Orientation Right Angle
  • Number of Positions 204
  • Number of Rows 2
  • Center Key Offset Right
  • Keying Reverse
  • Number of Bays 2
  • Number of Keys 1
  • DRAM Voltage 1.5
  • SGRAM Voltage 1.5
  • Ejector Type Locking
  • Latch Material Stainless Steel
  • Module Key Type SGRAM
  • Latch Plating Material Tin
  • Ejector Location Both Ends
  • Contact Base Material Copper Alloy
  • PCB Contact Termination Area Plating Material Gold
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .76
  • Contact Current Rating (Max) .5
  • Socket Type Memory Card
  • Socket Style SO DIMM
  • Insertion Style Cam-In
  • PCB Mount Retention Type Solder Peg
  • PCB Mount Retention With
  • PCB Mounting Style Surface Mount
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) .6
  • Housing Color Black
  • Housing Material High Temperature Thermoplastic
  • Stack Height 8
  • Operating Temperature Range -55 – 85
  • Circuit Application Power
  • UL Flammability Rating UL 94V-0
  • Packaging Method Emboss on Reel
  • Packaging Quantity 150
  • Comment With floating peg.
2-2013311-1 SO DIMM Sockets
  • DRAM Type Double Data Rate (DDR) 3
  • Connector System Cable-to-Board
  • Profile Reverse
  • Row-to-Row Spacing 8.2
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Socket
  • Module Orientation Right Angle
  • Number of Positions 204
  • Number of Rows 2
  • Center Key Offset Right
  • Keying Reverse
  • Number of Bays 2
  • Number of Keys 1
  • DRAM Voltage 1.5
  • SGRAM Voltage 1.5
  • Ejector Type Locking
  • Latch Material Stainless Steel
  • Module Key Type SGRAM
  • Latch Plating Material Tin
  • Ejector Location Both Ends
  • Contact Base Material Copper Alloy
  • PCB Contact Termination Area Plating Material Gold
  • Contact Mating Area Plating Material Gold Flash
  • Contact Current Rating (Max) .5
  • Socket Type Memory Card
  • Socket Style SO DIMM
  • Insertion Style Cam-In
  • PCB Mount Retention Type Solder Peg
  • PCB Mount Retention With
  • PCB Mounting Style Surface Mount
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) .6
  • Housing Color Black
  • Housing Material High Temperature Thermoplastic
  • Stack Height 9.2
  • Operating Temperature Range -55 – 85
  • Circuit Application Power
  • UL Flammability Rating UL 94V-0
  • Packaging Method Emboss on Reel
  • Packaging Quantity 150
  • Comment With floating peg.
2-2013311-2 SO DIMM Sockets
  • DRAM Type Double Data Rate (DDR) 3
  • Connector System Cable-to-Board
  • Profile Reverse
  • Row-to-Row Spacing 8.2
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Socket
  • Module Orientation Right Angle
  • Number of Positions 204
  • Number of Rows 2
  • Center Key Offset Right
  • Keying Reverse
  • Number of Bays 2
  • Number of Keys 1
  • DRAM Voltage 1.5
  • SGRAM Voltage 1.5
  • Ejector Type Locking
  • Latch Material Stainless Steel
  • Module Key Type SGRAM
  • Latch Plating Material Tin
  • Ejector Location Both Ends
  • Contact Base Material Copper Alloy
  • PCB Contact Termination Area Plating Material Gold
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .254
  • Contact Current Rating (Max) .5
  • Socket Type Memory Card
  • Socket Style SO DIMM
  • Insertion Style Cam-In
  • PCB Mount Retention Type Solder Peg
  • PCB Mount Retention With
  • PCB Mounting Style Surface Mount
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) .6
  • Housing Color Black
  • Housing Material High Temperature Thermoplastic
  • Stack Height 9.2
  • Operating Temperature Range -55 – 85
  • Circuit Application Power
  • UL Flammability Rating UL 94V-0
  • Packaging Method Emboss on Reel
  • Packaging Quantity 150
  • Comment With floating peg.
2013290-1 SO DIMM Sockets
  • DRAM Type Double Data Rate (DDR) 3
  • Connector System Cable-to-Board
  • Profile Reverse
  • Row-to-Row Spacing 8.2
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Socket
  • Module Orientation Right Angle
  • Number of Positions 204
  • Number of Rows 2
  • Center Key Offset Right
  • Keying Reverse
  • Number of Bays 2
  • Number of Keys 1
  • DRAM Voltage 1.5
  • SGRAM Voltage 1.5
  • Ejector Type Locking
  • Latch Material Stainless Steel
  • Module Key Type SGRAM
  • Latch Plating Material Tin
  • Ejector Location Both Ends
  • Contact Base Material Copper Alloy
  • PCB Contact Termination Area Plating Material Gold
  • Contact Mating Area Plating Material Gold Flash
  • Contact Current Rating (Max) .5
  • Socket Type Memory Card
  • Socket Style SO DIMM
  • Insertion Style Cam-In
  • PCB Mount Retention Type Solder Peg
  • PCB Mount Retention With
  • PCB Mounting Style Surface Mount
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) .6
  • Housing Color Black
  • Housing Material High Temperature Thermoplastic
  • Stack Height 5.2
  • Operating Temperature Range -55 – 85
  • Circuit Application Power
  • UL Flammability Rating UL 94V-0
  • Packaging Method Semi-Hard Tray Assembly
  • Packaging Quantity 20
  • Comment With floating peg.
292407-4 SO DIMM Sockets
  • DRAM Type Double Data Rate (DDR) 2
  • Connector System Cable-to-Board
  • Profile Standard
  • Row-to-Row Spacing 5.8
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Socket
  • Module Orientation Right Angle
  • Number of Positions 200
  • Number of Rows 2
  • Center Key Offset Right
  • Keying Reverse
  • Number of Bays 2
  • Number of Keys 1
  • DRAM Voltage 1.8
  • SGRAM Voltage 1.8
  • Ejector Type Locking
  • Latch Material Stainless Steel
  • Module Key Type SGRAM
  • Latch Plating Material Tin
  • Ejector Location Both Ends
  • Contact Base Material Copper Alloy
  • PCB Contact Termination Area Plating Material Gold Flash
  • Contact Mating Area Plating Material Gold Flash
  • Contact Current Rating (Max) .5
  • Socket Type Memory Card
  • Socket Style SO DIMM
  • Insertion Style Cam-In
  • PCB Mount Retention Type Solder Peg
  • PCB Mount Retention With
  • PCB Mounting Style Surface Mount
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) .6
  • Housing Color Black
  • Housing Material High Temperature Thermoplastic
  • Stack Height 4
  • Operating Temperature Range -55 – 85
  • Circuit Application Power
  • UL Flammability Rating UL 94V-0
  • Packaging Method Reel
  • Packaging Quantity 200
292407-5 SO DIMM Sockets
  • DRAM Type Double Data Rate (DDR) 2
  • Connector System Cable-to-Board
  • Profile Standard
  • Row-to-Row Spacing 5.8
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Socket
  • Module Orientation Right Angle
  • Number of Positions 200
  • Number of Rows 2
  • Center Key Offset Right
  • Keying Reverse
  • Number of Bays 2
  • Number of Keys 1
  • DRAM Voltage 1.8
  • SGRAM Voltage 1.8
  • Ejector Type Locking
  • Latch Material Stainless Steel
  • Module Key Type SGRAM
  • Latch Plating Material Tin
  • Ejector Location Both Ends
  • Contact Base Material Copper Alloy
  • PCB Contact Termination Area Plating Material Gold Flash
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .254
  • Contact Current Rating (Max) .5
  • Socket Type Memory Card
  • Socket Style SO DIMM
  • Insertion Style Cam-In
  • PCB Mount Retention Type Solder Peg
  • PCB Mount Retention With
  • PCB Mounting Style Surface Mount
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) .6
  • Housing Color Black
  • Housing Material High Temperature Thermoplastic
  • Stack Height 4
  • Operating Temperature Range -55 – 85
  • Circuit Application Power
  • UL Flammability Rating UL 94V-0
  • Packaging Method Reel
  • Packaging Quantity 200
1-1735438-1 Mini DIMM Sockets
  • DRAM Type Double Data Rate (DDR) 3
  • Connector System Board-to-Board
  • Row-to-Row Spacing 8.7
  • Connector & Contact Terminates To Printed Circuit Board
  • Center Post With
  • Profile Standard
  • Product Type Socket
  • Number of Positions 244
  • Module Orientation Right Angle
  • Number of Rows 2
  • Number of Hold-Downs 6
  • Center Key None
  • Keying Standard
  • Number of Keys 1
  • DRAM Voltage 1.5
  • Ejector Type Standard
  • Latch Color Natural
  • Center Post Material Liquid Crystal Polymer (LCP)
  • Latch Material Liquid Crystal Polymer (LCP)
  • Ejector Material Color Natural
  • Retention Post Location None
  • Hold-Down Material Copper Alloy
  • Module Key Type Per JEDEC MO-244, Module Variation AB/BB/CB, Standard Orientation
  • Ejector Location Both Ends
  • Ejector Material Liquid Crystal Polymer (LCP)
  • Contact Base Material Copper Alloy
  • PCB Contact Termination Area Plating Material Gold Flash
  • Contact Underplating Material Nickel
  • Contact Current Rating (Max) 1
  • Socket Style Mini DIMM
  • Socket Type Memory Card
  • Contact Mating Area Plating Thickness 30
  • Contact Mating Area Plating Material Gold
  • Insertion Style Direct Insert
  • PCB Mount Retention Type Solder Peg
  • PCB Mount Retention With
  • Locating Posts With
  • PCB Mounting Style Surface Mount
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) .6
  • Housing Color Black
  • Housing Material LCP (Liquid Crystal Polymer)
  • Hold-Down Plating Material Tin
  • Center Retention Hole Diameter 2.5
  • Height above PC Board 9.79
  • Operating Temperature Range -55 – 125
  • Circuit Application Power & Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Method Hard Tray
  • Packaging Quantity 15
1-1735438-2 Mini DIMM Sockets
  • DRAM Type Double Data Rate (DDR) 3
  • Connector System Board-to-Board
  • Row-to-Row Spacing 8.7
  • Connector & Contact Terminates To Printed Circuit Board
  • Center Post With
  • Profile Standard
  • Product Type Socket
  • Number of Positions 244
  • Module Orientation Right Angle
  • Number of Rows 2
  • Number of Hold-Downs 6
  • Center Key None
  • Keying Reverse
  • Number of Keys 1
  • DRAM Voltage 1.5
  • Ejector Type Standard
  • Latch Color Natural
  • Center Post Material Liquid Crystal Polymer (LCP)
  • Latch Material Liquid Crystal Polymer (LCP)
  • Ejector Material Color Natural
  • Retention Post Location None
  • Hold-Down Material Copper Alloy
  • Module Key Type Per JEDEC MO-244, Module Variation AB/BB/CB, Reverse Orientation
  • Ejector Location Both Ends
  • Ejector Material Liquid Crystal Polymer (LCP)
  • Contact Base Material Copper Alloy
  • PCB Contact Termination Area Plating Material Gold Flash
  • Contact Underplating Material Nickel
  • Contact Current Rating (Max) 1
  • Socket Style Mini DIMM
  • Socket Type Memory Card
  • Contact Mating Area Plating Thickness 15
  • Contact Mating Area Plating Material Gold
  • Insertion Style Direct Insert
  • PCB Mount Retention Type Solder Peg
  • PCB Mount Retention With
  • Locating Posts With
  • PCB Mounting Style Surface Mount
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) .6
  • Housing Color Black
  • Housing Material LCP (Liquid Crystal Polymer)
  • Hold-Down Plating Material Tin
  • Center Retention Hole Diameter 2.5
  • Height above PC Board 9.79
  • Operating Temperature Range -55 – 125
  • Circuit Application Power & Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Method Hard Tray
  • Packaging Quantity 15
1735438-1 Mini DIMM Sockets
  • DRAM Type Double Data Rate (DDR) 3
  • Connector System Board-to-Board
  • Row-to-Row Spacing 8.7
  • Connector & Contact Terminates To Printed Circuit Board
  • Center Post With
  • Profile Standard
  • Product Type Socket
  • Number of Positions 244
  • Module Orientation Right Angle
  • Number of Rows 2
  • Number of Hold-Downs 6
  • Center Key None
  • Keying Standard
  • Number of Keys 1
  • DRAM Voltage 1.5
  • Ejector Type Standard
  • Latch Color Natural
  • Center Post Material Liquid Crystal Polymer (LCP)
  • Latch Material Liquid Crystal Polymer (LCP)
  • Ejector Material Color Natural
  • Retention Post Location None
  • Hold-Down Material Copper Alloy
  • Module Key Type Per JEDEC MO-244, Module Variation AB/BB/CB, Standard Orientation
  • Ejector Location Both Ends
  • Ejector Material Liquid Crystal Polymer (LCP)
  • Contact Base Material Copper Alloy
  • PCB Contact Termination Area Plating Material Gold Flash
  • Contact Underplating Material Nickel
  • Contact Current Rating (Max) 1
  • Socket Style Mini DIMM
  • Socket Type Memory Card
  • Contact Mating Area Plating Thickness 30
  • Contact Mating Area Plating Material Gold
  • Insertion Style Direct Insert
  • PCB Mount Retention Type Solder Peg
  • PCB Mount Retention With
  • Locating Posts With
  • PCB Mounting Style Surface Mount
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) .6
  • Housing Color Black
  • Housing Material LCP (Liquid Crystal Polymer)
  • Hold-Down Plating Material Tin
  • Center Retention Hole Diameter 2.5
  • Height above PC Board 9.79
  • Operating Temperature Range -55 – 125
  • Circuit Application Power & Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Method Hard Tray
  • Packaging Quantity 15
1735438-2 Mini DIMM Sockets
  • DRAM Type Double Data Rate (DDR) 3
  • Connector System Board-to-Board
  • Row-to-Row Spacing 8.7
  • Connector & Contact Terminates To Printed Circuit Board
  • Center Post With
  • Profile Standard
  • Product Type Socket
  • Number of Positions 244
  • Module Orientation Right Angle
  • Number of Rows 2
  • Number of Hold-Downs 6
  • Center Key None
  • Keying Reverse
  • Number of Keys 1
  • DRAM Voltage 1.5
  • Ejector Type Standard
  • Latch Color Natural
  • Center Post Material Liquid Crystal Polymer (LCP)
  • Latch Material Liquid Crystal Polymer (LCP)
  • Ejector Material Color Natural
  • Retention Post Location None
  • Hold-Down Material Copper Alloy
  • Module Key Type Per JEDEC MO-244, Module Variation AB/BB/CB, Reverse Orientation
  • Ejector Location Both Ends
  • Ejector Material Liquid Crystal Polymer (LCP)
  • Contact Base Material Copper Alloy
  • PCB Contact Termination Area Plating Material Gold Flash
  • Contact Underplating Material Nickel
  • Contact Current Rating (Max) 1
  • Socket Style Mini DIMM
  • Socket Type Memory Card
  • Contact Mating Area Plating Thickness 30
  • Contact Mating Area Plating Material Gold
  • Insertion Style Direct Insert
  • PCB Mount Retention Type Solder Peg
  • PCB Mount Retention With
  • Locating Posts With
  • PCB Mounting Style Surface Mount
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) .6
  • Housing Color Black
  • Housing Material LCP (Liquid Crystal Polymer)
  • Hold-Down Plating Material Tin
  • Center Retention Hole Diameter 2.5
  • Height above PC Board 9.79
  • Operating Temperature Range -55 – 125
  • Circuit Application Power & Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Method Hard Tray
  • Packaging Quantity 15
1775763-1 PCB D-Sub Connectors
  • Shell Type Full Metal Shell
  • Connector Style Receptacle
  • Connector System Cable-to-Board
  • Row-to-Row Spacing .077 in
  • Shell Size 1
  • Profile Slim
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Shape Reverse "D" Shaped
  • Grounding Indents Without
  • Product Type Connector
  • Footprint 3.1
  • Orientation Reverse
  • Grounding Straps Without
  • Number of Positions 15
  • Number of Rows 3
  • PCB Mount Orientation Offset
  • Preloaded Yes
  • Shell Material SPCC
  • Plastic No
  • Shell Plating Material Nickel
  • Color Black
  • Contact Base Material Brass
  • PCB Contact Termination Area Plating Material Tin
  • Contact Shape Round
  • Contact Current Rating (Max) 1
  • Contact Mating Area Plating Material Gold Flash
  • PCB Termination Area Plating Finish Matte
  • Grounding Clips With
  • Termination Post Length 1.8
  • Panel Mount Feature Without
  • PCB Mounting Style Through Hole
  • PCB Mount Retention With
  • PCB Mount Retention Type Retention Leg
  • Mating Connector Lock Without
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) 2.29
  • Housing Color Black
  • Housing Material PA 9T GF
  • PCB Thickness (Recommended) 1.2
  • Operating Temperature Range -55 – 105
  • Circuit Application Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Quantity 200
  • Packaging Method Reel
  • Comment Black cap is supplied.