203743-000 Joints & Splices  1
ANSI C119.1
  • Technology Cold Applied
  • Product Type Roll-On Sleeves
  • Closing Method Roll-On
  • Cable Seal Mastic
  • Strain Relief No
  • Number of Main Wires (Max) 1
  • Voltage Class ≤ 1
  • Color Black
  • Cable Cross-Section (Max) (Main) 70
  • Cable Cross-Section (Min) (Main) 10
  • Cable Diameter (Max) (Main) 17
  • Cable Diameter (Min) (Main) 9
  • Operating Temperature Range -40 – 130
  • Chemical Resistance Water, Humic Acids
  • UV-Stabilized Yes
  • Halogen Free Yes
  • Solvent-Free Yes
  • Free of Lead, Cadmium, Heavy Metals Yes
  • Low Smoke Emission No
  • Emission Free Label-Free Acc (REACH & CLP) Yes
  • Marine-Offshore-Shipbuilding Certified No
  • Silicone-Free No
  • Non-Toxic & Non-Corrosive Emission Isocyanate-Free Yes
  • Standards ANSI C119.1
  • CSA Certified Yes
  • UL Rating Yes
  • Product Availability AMERICAS
  • Minimum Order Quantity 1
  • Packaging Quantity 1
  • Minimum Packaging Unit 1
  • Packaging Method Bag
  • Product Use Outdoor, Overhead & Direct Buried
  • Other Colors Available No
2013311-3 SO DIMM Sockets
  • DRAM Type Double Data Rate (DDR) 3
  • Connector System Cable-to-Board
  • Profile Reverse
  • Row-to-Row Spacing 8.2
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Socket
  • Module Orientation Right Angle
  • Number of Positions 204
  • Number of Rows 2
  • Keying Reverse
  • Number of Bays 2
  • Number of Keys 1
  • Center Key Offset Right
  • DRAM Voltage 1.5
  • SGRAM Voltage 1.5
  • Ejector Type Locking
  • Module Key Type SGRAM
  • Latch Plating Material Tin
  • Latch Material Stainless Steel
  • Ejector Location Both Ends
  • Solder Tail Contact Plating Material Gold
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .76
  • Contact Current Rating (Max) .5
  • Contact Base Material Copper Alloy
  • Socket Type Memory Card
  • Socket Style SO DIMM
  • Insertion Style Cam-In
  • PCB Mounting Style Surface Mount
  • Connector Mounting Type Board Mount
  • PCB Mount Retention With
  • PCB Mount Retention Type Solder Peg
  • Centerline (Pitch) .6
  • Housing Color Black
  • Housing Material High Temperature Thermoplastic
  • Stack Height 9.2
  • Operating Temperature Range -55 – 85
  • Circuit Application Power
  • UL Flammability Rating UL 94V-0
  • Packaging Method Semi-Hard Tray Assembly
  • Packaging Quantity 20
  • Comment With floating peg.
2-2013290-1 SO DIMM Sockets
  • DRAM Type Double Data Rate (DDR) 3
  • Connector System Cable-to-Board
  • Profile Reverse
  • Row-to-Row Spacing 8.2
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Socket
  • Module Orientation Right Angle
  • Number of Positions 204
  • Number of Rows 2
  • Keying Reverse
  • Number of Bays 2
  • Number of Keys 1
  • Center Key Offset Right
  • DRAM Voltage 1.5
  • SGRAM Voltage 1.5
  • Ejector Type Locking
  • Module Key Type SGRAM
  • Latch Plating Material Tin
  • Latch Material Stainless Steel
  • Ejector Location Both Ends
  • Solder Tail Contact Plating Material Gold
  • Contact Mating Area Plating Material Gold Flash
  • Contact Current Rating (Max) .5
  • Contact Base Material Copper Alloy
  • Socket Type Memory Card
  • Socket Style SO DIMM
  • Insertion Style Cam-In
  • PCB Mounting Style Surface Mount
  • Connector Mounting Type Board Mount
  • PCB Mount Retention With
  • PCB Mount Retention Type Solder Peg
  • Centerline (Pitch) .6
  • Housing Color Black
  • Housing Material High Temperature Thermoplastic
  • Stack Height 5.2
  • Operating Temperature Range -55 – 85
  • Circuit Application Power
  • UL Flammability Rating UL 94V-0
  • Packaging Method Emboss on Reel
  • Packaging Quantity 200
  • Comment With floating peg.
1903302-3 SD Card Connectors  1
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Removable Memory Products
  • Shielded No
  • Format Secure Digital
  • Operating Function Push-On Push-Off
  • Number of Positions 9
  • Number of Rows 1
  • Lead Configuration Inline
  • Hold-Downs Without
  • Color Black
  • Shell Material Copper Alloy
  • Solder Tail Contact Plating Material Tin
  • Underplate Material Nickel
  • Contact Current Rating (Max) .5
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .2 – .5
  • Contact Base Material Copper Alloy
  • Vacuum Tape Without
  • PCB Mounting Style Surface Mount
  • Mounting Angle Right Angle
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) 1.7
  • Housing Material LCP (Liquid Crystal Polymer)
  • Housing Color Black
  • Solder Tab Length .8
  • Height above PC Board 2.95
  • Operating Temperature Range -25 – 85
  • Circuit Application Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tape & Reel
2-2013287-1 SO DIMM Sockets
  • DRAM Type Double Data Rate (DDR) 3
  • Connector System Cable-to-Board
  • Profile Reverse
  • Row-to-Row Spacing 8.2
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Socket
  • Module Orientation Right Angle
  • Number of Positions 204
  • Number of Rows 2
  • Keying Reverse
  • Number of Bays 2
  • Number of Keys 1
  • Center Key Offset Right
  • DRAM Voltage 1.5
  • SGRAM Voltage 1.5
  • Ejector Type Locking
  • Module Key Type SGRAM
  • Latch Plating Material Tin
  • Latch Material Stainless Steel
  • Ejector Location Both Ends
  • Solder Tail Contact Plating Material Gold
  • Contact Mating Area Plating Material Gold Flash
  • Contact Current Rating (Max) .5
  • Contact Base Material Copper Alloy
  • Socket Type Memory Card
  • Socket Style SO DIMM
  • Insertion Style Cam-In
  • PCB Mounting Style Surface Mount
  • Connector Mounting Type Board Mount
  • PCB Mount Retention With
  • PCB Mount Retention Type Solder Tail (Pin)
  • Centerline (Pitch) .6
  • Housing Color Black
  • Housing Material High Temperature Thermoplastic
  • Stack Height 4
  • Operating Temperature Range -55 – 85
  • Circuit Application Power
  • UL Flammability Rating UL 94V-0
  • Packaging Method Emboss on Reel
  • Packaging Quantity 200
  • Comment Without floating peg.
2-2013290-2 SO DIMM Sockets
  • DRAM Type Double Data Rate (DDR) 3
  • Connector System Cable-to-Board
  • Profile Reverse
  • Row-to-Row Spacing 8.2
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Socket
  • Module Orientation Right Angle
  • Number of Positions 204
  • Number of Rows 2
  • Keying Reverse
  • Number of Bays 2
  • Number of Keys 1
  • Center Key Offset Right
  • DRAM Voltage 1.5
  • SGRAM Voltage 1.5
  • Ejector Type Locking
  • Module Key Type SGRAM
  • Latch Plating Material Tin
  • Latch Material Stainless Steel
  • Ejector Location Both Ends
  • Solder Tail Contact Plating Material Gold
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .254
  • Contact Current Rating (Max) .5
  • Contact Base Material Copper Alloy
  • Socket Type Memory Card
  • Socket Style SO DIMM
  • Insertion Style Cam-In
  • PCB Mounting Style Surface Mount
  • Connector Mounting Type Board Mount
  • PCB Mount Retention With
  • PCB Mount Retention Type Solder Peg
  • Centerline (Pitch) .6
  • Housing Color Black
  • Housing Material High Temperature Thermoplastic
  • Stack Height 5.2
  • Operating Temperature Range -55 – 85
  • Circuit Application Power
  • UL Flammability Rating UL 94V-0
  • Packaging Method Emboss on Reel
  • Packaging Quantity 200
  • Comment With floating peg.
2041127-1 PCB D-Sub Connectors
  • Shell Type Front Metal Shell
  • Connector Style Receptacle
  • Connector System Cable-to-Board
  • Row-to-Row Spacing .5 in
  • Shell Size 1
  • Profile Slim
  • PCB Mounting Orientation Right Angle
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Shape Reverse "D" Shaped
  • Footprint 3.1
  • Grounding Indents Without
  • Product Type Connector
  • Grounding Straps Without
  • Orientation Reverse
  • Number of Positions 15
  • Number of Rows 3
  • Preloaded Yes
  • Shell Material SPCC
  • Plastic No
  • Shell Plating Material Nickel
  • Color Black
  • Solder Tail Contact Plating Material Tin
  • Contact Shape Round
  • Contact Current Rating (Max) 1
  • Contact Mating Area Plating Material Gold Flash
  • PCB Termination Area Plating Finish Matte
  • Contact Base Material Brass
  • Termination Post Length 1.8
  • Grounding Clips With
  • Panel Mount Feature Without
  • PCB Mounting Style Through Hole
  • PCB Mount Retention With
  • PCB Mount Retention Type Retention Legs
  • Mating Connector Lock Without
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) 2.29
  • Housing Color Black
  • Housing Material LCP
  • PCB Thickness (Recommended) 1.19
  • Operating Temperature Range -55 – 105
  • Circuit Application Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Quantity 200
  • Packaging Method Reel
  • Comment Black cap is supplied.
1871916-1 SD Card Connectors
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Removable Memory Products
  • PCB Offset .8
  • Shielded No
  • Format Secure Digital
  • Operating Function Push-On Push-Off
  • Number of Positions 9
  • Number of Rows 1
  • Lead Configuration Inline
  • Hold-Downs Without
  • Color Black
  • Shell Material Copper Alloy
  • Solder Tail Contact Plating Material Tin
  • Underplate Material Nickel
  • Contact Current Rating (Max) .5
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .2 – .5
  • Contact Base Material Copper Alloy
  • Vacuum Tape Without
  • PCB Mounting Style Surface Mount
  • Mounting Angle Right Angle
  • Connector Mounting Type Board Mount
  • Polarizing Post Length .8
  • Centerline (Pitch) 1.7
  • Housing Material LCP (Liquid Crystal Polymer)
  • Housing Color Black
  • Solder Tab Length .8
  • Height above PC Board 2.95
  • Operating Temperature Range -25 – 85
  • Circuit Application Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tape & Reel
1981287-4 SO DIMM Sockets
  • DRAM Type Double Data Rate (DDR)
  • Connector System Cable-to-Board
  • Profile Reverse
  • Row-to-Row Spacing 6.2
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Socket
  • Module Orientation Right Angle
  • Number of Positions 200
  • Number of Rows 2
  • Keying Reverse
  • Number of Bays 2
  • Number of Keys 1
  • Center Key None
  • DRAM Voltage 1.8
  • SGRAM Voltage 1.8
  • Ejector Type Locking
  • Module Key Type SGRAM
  • Latch Plating Material Tin
  • Latch Material Stainless Steel
  • Ejector Location Both Ends
  • Solder Tail Contact Plating Material Gold Flash
  • Contact Mating Area Plating Material Gold
  • Contact Current Rating (Max) .5
  • Contact Base Material Copper Alloy
  • Socket Type Memory Card
  • Socket Style SO DIMM
  • Insertion Style Cam-In
  • PCB Mounting Style Surface Mount
  • Connector Mounting Type Board Mount
  • PCB Mount Retention With
  • PCB Mount Retention Type Solder Tail (Pin)
  • Centerline (Pitch) .6
  • Housing Color Black
  • Housing Material High Temperature Thermoplastic
  • Stack Height 9.2
  • Operating Temperature Range -55 – 85
  • Circuit Application Power
  • UL Flammability Rating UL 94V-0
  • Packaging Method Box & Tray
  • Packaging Quantity 20
2-2013311-1 SO DIMM Sockets
  • DRAM Type Double Data Rate (DDR) 3
  • Connector System Cable-to-Board
  • Profile Reverse
  • Row-to-Row Spacing 8.2
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Socket
  • Module Orientation Right Angle
  • Number of Positions 204
  • Number of Rows 2
  • Keying Reverse
  • Number of Bays 2
  • Number of Keys 1
  • Center Key Offset Right
  • DRAM Voltage 1.5
  • SGRAM Voltage 1.5
  • Ejector Type Locking
  • Module Key Type SGRAM
  • Latch Plating Material Tin
  • Latch Material Stainless Steel
  • Ejector Location Both Ends
  • Solder Tail Contact Plating Material Gold
  • Contact Mating Area Plating Material Gold Flash
  • Contact Current Rating (Max) .5
  • Contact Base Material Copper Alloy
  • Socket Type Memory Card
  • Socket Style SO DIMM
  • Insertion Style Cam-In
  • PCB Mounting Style Surface Mount
  • Connector Mounting Type Board Mount
  • PCB Mount Retention With
  • PCB Mount Retention Type Solder Peg
  • Centerline (Pitch) .6
  • Housing Color Black
  • Housing Material High Temperature Thermoplastic
  • Stack Height 9.2
  • Operating Temperature Range -55 – 85
  • Circuit Application Power
  • UL Flammability Rating UL 94V-0
  • Packaging Method Emboss on Reel
  • Packaging Quantity 150
  • Comment With floating peg.