322-HCS6P2-100 Discrete Sockets
  • Sleeve Style Open Bottom
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Wire/Cable Type Discrete Wire
  • Product Type Contact
  • Profile Zero
  • Sealant No
  • Sleeve Material Copper
  • Sleeve Plating Material Tin
  • Contact Current Rating (Max) 5
  • Contact Transmits (Typical) Signal (Data)/Power
  • Contact Base Material Beryllium Copper
  • Contact Type Socket
  • Contact Spring Plating Material Tin
  • Contact Mating Area Plating Thickness .76
  • Contact Mating Area Plating Material Tin
  • Socket Type Discrete
  • Termination Method to PC Board Through Hole - Press-Fit
  • Termination Method to Wire/Cable Solder
  • Insertion Method Hand/Semi-Automatic/Automatic
  • Socket Length 3.45
  • Hole Size (Recommended) 1.61
  • Wire/Cable Size .081 – .162
  • Mating Pin Diameter Range .51 – .76
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Circuit Application Signal
  • Packaging Method Reel
  • Packaging Quantity 2000
  • Spring Material Beryllium Copper
8134-HC-8P3 Discrete Sockets
  • Sleeve Style Open Bottom
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Wire/Cable Type Discrete Wire
  • Product Type Contact
  • Profile Zero
  • Sealant No
  • Sleeve Material Copper
  • Sleeve Plating Material Tin
  • Contact Current Rating (Max) 5
  • Contact Transmits (Typical) Signal (Data)/Power
  • Contact Base Material Beryllium Copper
  • Contact Type Socket
  • Contact Spring Plating Material Tin
  • Contact Mating Area Plating Material Tin-Lead
  • Socket Type Discrete
  • Termination Method to PC Board Through Hole - Press-Fit
  • Termination Method to Wire/Cable Solder
  • Insertion Method Hand/Semi-Automatic
  • Socket Length 3.45
  • Hole Size (Recommended) 1.47
  • Mating Pin Diameter Range .64 – .89
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Circuit Application Signal
  • Packaging Method Loose Piece
  • Packaging Quantity 2500
  • Spring Material Beryllium Copper
322-HCS5P2-100 Discrete Sockets
  • Sleeve Style Open Bottom
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Wire/Cable Type Discrete Wire
  • Product Type Contact
  • Profile Zero
  • Sealant No
  • Sleeve Material Copper
  • Sleeve Plating Material Tin
  • Contact Current Rating (Max) 5
  • Contact Transmits (Typical) Signal (Data)/Power
  • Contact Base Material Beryllium Copper
  • Contact Type Socket
  • Contact Spring Plating Material Tin
  • Contact Mating Area Plating Material Gold
  • Socket Type Discrete
  • Termination Method to PC Board Through Hole - Press-Fit
  • Termination Method to Wire/Cable Solder
  • Insertion Method Hand/Semi-Automatic/Automatic
  • Socket Length 2.54
  • Hole Size (Recommended) 1.04
  • Mating Pin Diameter Range .28 – .46
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -55 – 125
  • Circuit Application Signal
  • Packaging Method Reel
  • Packaging Quantity 2500
  • Spring Material Beryllium Copper
9-1437514-0 Discrete Sockets
  • Sleeve Style Open Bottom
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Wire/Cable Type Discrete Wire
  • Product Type Contact
  • Profile Zero
  • Sealant No
  • Sleeve Material Copper
  • Sleeve Plating Material Tin
  • Contact Current Rating (Max) 5
  • Contact Transmits (Typical) Signal (Data)/Power
  • Contact Base Material Beryllium Copper
  • Contact Type Socket
  • Contact Spring Plating Material Tin
  • Contact Mating Area Plating Material Tin
  • Socket Type Discrete
  • Termination Method to PC Board Through Hole - Press-Fit
  • Termination Method to Wire/Cable Solder
  • Insertion Method Hand/Semi-Automatic/Automatic
  • Socket Length 3.51
  • Hole Size (Recommended) 1.57
  • Mating Pin Diameter Range .66 – .74
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Circuit Application Signal
  • Packaging Method Loose Piece
  • Packaging Quantity 2500
  • Spring Material Beryllium Copper
1-1437514-3 DIP Sockets
  • DIP Socket Type Open Frame
  • Profile Zero
  • Row-to-Row Spacing 7.62
  • Leg Style Straight
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Socket
  • Number of Positions 1
  • Number of Rows 2
  • Contact Resistance 10
  • Insulation Resistance 1000
  • Frame Style Film Carrier
  • Carrier Strip Material Mylar
  • Contact Style Screw Machine
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness 25
  • Solder Tail Contact Plating Material Gold
  • Contact Current Rating (Max) 3
  • Contact Base Material Beryllium Copper
  • Socket Style Standard
  • Mating Contact Type Four-Fingered
  • Contact Type Socket
  • Socket Type DIP
  • Contact Termination Type Through Hole
  • Termination Post Length 3.18
  • Mounting Angle Vertical
  • Connector Mounting Type Board Mount
  • PCB Mount Retention Without
  • Centerline (Pitch) 2.54
  • Height above PC Board 0
  • Operating Temperature Range -55 – 125
  • Circuit Application Signal
  • Packaging Method Reel
  • Packaging Quantity 5000
  • Patterns Per Reel 1
322-HCS5P3-300LF DIP Sockets
  • DIP Socket Type Open Frame
  • Profile Zero
  • Row-to-Row Spacing 7.62
  • Leg Style Straight
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Socket
  • Number of Positions 1
  • Contact Resistance 10
  • Insulation Resistance 1000
  • Frame Style Film Carrier
  • Carrier Strip Material Mylar
  • Sleeve Plating Material Tin
  • Contact Style Screw Machine
  • Contact Mating Area Plating Material Tin
  • Contact Mating Area Plating Thickness 25
  • Solder Tail Contact Plating Material Tin
  • Contact Current Rating (Max) 3
  • Contact Base Material Beryllium Copper
  • Socket Style Standard
  • Mating Contact Type Four-Fingered
  • Contact Type Socket
  • Socket Type DIP
  • Contact Termination Type Through Hole
  • Termination Post Length 3.18
  • Mounting Angle Vertical
  • Connector Mounting Type Board Mount
  • PCB Mount Retention Without
  • Centerline (Pitch) 2.54
  • Height above PC Board 0
  • Operating Temperature Range -55 – 105
  • Circuit Application Signal
  • Packaging Method Reel
  • Packaging Quantity 5000
  • Patterns Per Reel 1
322-HCS8P2-100 Discrete Sockets
  • Sleeve Style Open Bottom
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Wire/Cable Type Discrete Wire
  • Product Type Contact
  • Profile Zero
  • Sealant No
  • Sleeve Material Copper
  • Sleeve Plating Material Tin
  • Contact Current Rating (Max) 5
  • Contact Transmits (Typical) Signal (Data)/Power
  • Contact Base Material Beryllium Copper
  • Contact Type Socket
  • Contact Spring Plating Material Tin
  • Contact Mating Area Plating Thickness .76
  • Contact Mating Area Plating Material Tin
  • Socket Type Discrete
  • Termination Method to PC Board Through Hole - Press-Fit
  • Termination Method to Wire/Cable Solder
  • Insertion Method Hand/Semi-Automatic/Automatic
  • Socket Length 3.45
  • Hole Size (Recommended) 1.61
  • Wire/Cable Size .081 – .162
  • Mating Pin Diameter Range .64 – .89
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Circuit Application Signal
  • Packaging Method Reel
  • Packaging Quantity 2500
  • Spring Material Beryllium Copper
322-HCS-5P2-424 DIP Sockets
  • DIP Socket Type Open Frame
  • Profile Zero
  • Row-to-Row Spacing 10.16
  • Leg Style Straight
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Socket
  • Number of Positions 24
  • Number of Rows 2
  • Contact Resistance 10
  • Insulation Resistance 1000
  • Frame Style Film Carrier
  • Carrier Strip Material Mylar
  • Contact Style Screw Machine
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness 25
  • Solder Tail Contact Plating Material Tin
  • Contact Current Rating (Max) 3
  • Contact Base Material Beryllium Copper
  • Socket Style Standard
  • Mating Contact Type Four-Fingered
  • Contact Type Socket
  • Socket Type DIP
  • Contact Termination Type Through Hole
  • Termination Post Length 3.18
  • Mounting Angle Vertical
  • Connector Mounting Type Board Mount
  • PCB Mount Retention Without
  • Centerline (Pitch) 2.54
  • Height above PC Board 0
  • Operating Temperature Range -55 – 125
  • Circuit Application Signal
  • Packaging Method Reel
  • Packaging Quantity 5000
  • Patterns Per Reel 208
6-1437514-7 Discrete Sockets
  • Sleeve Style Open Bottom
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Wire/Cable Type Discrete Wire
  • Product Type Contact
  • Profile Zero
  • Sealant No
  • Sleeve Material Copper
  • Sleeve Plating Material Tin
  • Contact Current Rating (Max) 5
  • Contact Transmits (Typical) Signal (Data)/Power
  • Contact Base Material Beryllium Copper
  • Contact Type Socket
  • Contact Spring Plating Material Tin
  • Contact Mating Area Plating Material Tin-Lead
  • Socket Type Discrete
  • Termination Method to PC Board Through Hole - Press-Fit
  • Termination Method to Wire/Cable Solder
  • Insertion Method Hand/Semi-Automatic/Automatic
  • Socket Length 3.51
  • Hole Size (Recommended) 1.57
  • Mating Pin Diameter Range .66 – .74
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Circuit Application Signal
  • Packaging Method Loose Piece
  • Packaging Quantity 2000
  • Spring Material Beryllium Copper
8134-HC-12P2 Discrete Sockets
  • Sleeve Style Open Bottom
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Wire/Cable Type Discrete Wire
  • Product Type Contact
  • Profile Zero
  • Sealant No
  • Sleeve Material Copper
  • Sleeve Plating Material Tin
  • Contact Current Rating (Max) 5
  • Contact Transmits (Typical) Signal (Data)/Power
  • Contact Base Material Beryllium Copper
  • Contact Type Socket
  • Contact Spring Plating Material Tin
  • Contact Mating Area Plating Thickness .76
  • Contact Mating Area Plating Material Gold
  • Socket Type Discrete
  • Termination Method to PC Board Through Hole - Press-Fit
  • Termination Method to Wire/Cable Solder
  • Insertion Method Hand/Semi-Automatic
  • Socket Length 3.96
  • Hole Size (Recommended) 2.08
  • Wire/Cable Size .081 – .162
  • Mating Pin Diameter Range .89 – 1.14
  • PCB Thickness (Recommended) .79 – 3.18
  • Operating Temperature Range -65 – 125
  • Circuit Application Signal
  • Packaging Method Loose Piece
  • Packaging Quantity 2000
  • Spring Material Beryllium Copper