• Connector System Board-to-Board
  • PCB Mounting Orientation Right Angle
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Connector
  • Connector Style Hermaphroditic
  • Number of Positions 1
  • Number of Rows 1
  • Contact Mating Area Plating Material Tin
  • Contact Current Rating (Max) 3
  • Contact Termination Area Plating Material Tin
  • Contact Termination Area Plating Thickness 2 – 6
  • Stamped and Formed Yes
  • Termination Method to PC Board Surface Mount
  • Mating Retention Friction
  • Mating Retention Type Contact Friction
  • Housing Material LCP (Liquid Crystal Polymer)
  • Housing Color Natural
  • Post-Mating Assembly Measurement .433 in
  • Length 5.9
  • Operating Temperature Range -40 – 105
  • Agency/Standard UL
  • UL Flammability Rating UL 94V-0
  • Agency/Standard Number UL 1977
  • UL File Number E28476
  • Packaging Method Pocket tape on reel
1971567-2 Board-to-Board Headers & Receptacles  1
  • Connector Style Hermaphroditic
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Series Hemaphrodic Board-to-Board Connectors
  • PCB Mounting Orientation Right Angle
  • Connector Type Connector Assembly
  • Make First / Break Last No
  • Product Type Connector
  • Selectively Loaded No
  • Stackable No
  • Number of Positions 4
  • Board-to-Board Configuration Parallel Board-to-Board
  • Number of Rows 1
  • Dielectric Withstanding Voltage 300
  • Voltage 300
  • Voltage 300
  • Dielectric Withstanding Voltage 300
  • PCB Termination Area Plating Material Tin
  • Contact Mating Area Plating Material Tin
  • Contact Current Rating (Max) 3
  • Contact Layout Inline
  • Contact Base Material Copper Alloy
  • Contact Type Hermaphroditic
  • Termination Method to PC Board Surface Mount
  • Mating Alignment Without
  • PCB Mount Retention Without
  • PCB Mount Alignment Without
  • PCB Mount Alignment Type None
  • Centerline (Pitch) 3
  • Housing Material LCP
  • Housing Color Natural
  • PCB Thickness (Recommended) 1.57
  • Operating Temperature Range -40 – 105
  • High Temperature Compatible Yes
  • Pick and Place Cover Without
  • MIL-C-55032 No
  • Approved Standards CSA LR7189
  • CSA Certified Yes
  • UL Flammability Rating UL 94V-0
  • Agency/Standard CSA
  • CSA File Number LR7199
  • UL File Number E28476
  • Packaging Method Tape & Reel
1971567-1 Board-to-Board Headers & Receptacles  1
  • Connector Style Hermaphroditic
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Series Hemaphrodic Board-to-Board Connectors
  • PCB Mounting Orientation Right Angle
  • Connector Type Connector Assembly
  • Make First / Break Last No
  • Product Type Connector
  • Selectively Loaded No
  • Stackable No
  • Number of Positions 2
  • Board-to-Board Configuration Parallel Board-to-Board
  • Number of Rows 1
  • Dielectric Withstanding Voltage 300
  • Voltage 300
  • Voltage 300
  • Dielectric Withstanding Voltage 300
  • PCB Termination Area Plating Material Tin
  • Contact Mating Area Plating Material Tin
  • Contact Current Rating (Max) 3
  • Contact Layout Inline
  • Contact Base Material Copper Alloy
  • Contact Type Hermaphroditic
  • Termination Method to PC Board Surface Mount
  • Mating Alignment Without
  • PCB Mount Retention Without
  • PCB Mount Alignment Without
  • PCB Mount Alignment Type None
  • Centerline (Pitch) 3
  • Housing Material LCP
  • Housing Color Natural
  • PCB Thickness (Recommended) 1.57
  • Operating Temperature Range -40 – 105
  • High Temperature Compatible Yes
  • Pick and Place Cover Without
  • MIL-C-55032 No
  • Approved Standards CSA LR7189
  • CSA Certified Yes
  • UL Flammability Rating UL 94V-0
  • Agency/Standard CSA
  • CSA File Number LR7198
  • UL File Number E28476
  • Packaging Method Tape & Reel
1971567-3 Board-to-Board Headers & Receptacles  1
  • Connector Style Hermaphroditic
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Series Hemaphrodic Board-to-Board Connectors
  • PCB Mounting Orientation Right Angle
  • Connector Type Connector Assembly
  • Make First / Break Last No
  • Product Type Connector
  • Selectively Loaded No
  • Stackable No
  • Number of Positions 6
  • Board-to-Board Configuration Parallel Board-to-Board
  • Number of Rows 1
  • Dielectric Withstanding Voltage 300
  • Voltage 300
  • Voltage 300
  • Dielectric Withstanding Voltage 300
  • PCB Termination Area Plating Material Tin
  • Contact Mating Area Plating Material Tin
  • Contact Current Rating (Max) 3
  • Contact Layout Inline
  • Contact Base Material Copper Alloy
  • Contact Type Hermaphroditic
  • Termination Method to PC Board Surface Mount
  • Mating Alignment Without
  • PCB Mount Retention Without
  • PCB Mount Alignment Without
  • PCB Mount Alignment Type None
  • Centerline (Pitch) 3
  • Housing Material LCP
  • Housing Color Natural
  • PCB Thickness (Recommended) 1.57
  • Operating Temperature Range -40 – 105
  • High Temperature Compatible Yes
  • Pick and Place Cover Without
  • MIL-C-55032 No
  • Approved Standards CSA LR7189
  • CSA Certified Yes
  • UL Flammability Rating UL 94V-0
  • Agency/Standard CSA
  • CSA File Number LR7200
  • UL File Number E28476
  • Packaging Method Tape & Reel
  • Connector System Board-to-Board
  • PCB Mounting Orientation Right Angle
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Connector
  • Connector Style Hermaphroditic
  • Number of Positions 1
  • Number of Rows 1
  • Contact Mating Area Plating Material Tin
  • Contact Current Rating (Max) 3
  • Contact Termination Area Plating Material Tin
  • Contact Termination Area Plating Thickness 2 – 6
  • Stamped and Formed Yes
  • Termination Method to PC Board Surface Mount
  • Mating Retention Friction
  • Mating Retention Type Contact Friction
  • Housing Material LCP (Liquid Crystal Polymer)
  • Housing Color Natural
  • Post-Mating Assembly Measurement .433 in
  • Length 5.9
  • Operating Temperature Range -40 – 105
  • Agency/Standard UL
  • UL Flammability Rating UL 94V-0
  • Agency/Standard Number UL 1977
  • UL File Number E28476
  • Packaging Method Pocket tape on reel
2213611-1 Board-to-Board Headers & Receptacles  1
  • Connector Style Hermaphroditic
  • Number of Positions 2
  • Board-to-Board Configuration Right Angle
  • Contact Mating Area Plating Material Gold over Nickel
  • Contact Mating Area Plating Thickness 3.81 – 7.62
  • Contact Mating Area Plating Material Finish Matte
  • Mating Alignment Without
  • PCB Mount Retention Without
  • PCB Mount Alignment With
  • PCB Mount Alignment Type Peg
  • Centerline (Pitch) 4
  • Pick and Place Cover Without
  • Packaging Method Pocket Tape
2213611-2 Board-to-Board Headers & Receptacles  1
  • Connector Style Hermaphroditic
  • Number of Positions 4
  • Board-to-Board Configuration Right Angle
  • Contact Mating Area Plating Material Gold over Nickel
  • Contact Mating Area Plating Thickness 3.81 – 7.62
  • Contact Mating Area Plating Material Finish Matte
  • Mating Alignment Without
  • PCB Mount Retention Without
  • PCB Mount Alignment With
  • PCB Mount Alignment Type Peg
  • Centerline (Pitch) 4
  • Pick and Place Cover Without
  • Packaging Method Pocket Tape
2213611-3 Board-to-Board Headers & Receptacles  1
  • Connector Style Hermaphroditic
  • Stackable No
  • Number of Positions 6
  • Board-to-Board Configuration Right Angle
  • Number of Rows 1
  • Contact Mating Area Plating Material Gold over Nickel
  • Contact Mating Area Plating Thickness 3.81 – 7.62
  • Contact Mating Area Plating Material Finish Matte
  • Mating Alignment Without
  • PCB Mount Retention Without
  • PCB Mount Alignment With
  • PCB Mount Alignment Type Peg
  • Centerline (Pitch) 4
  • Pick and Place Cover Without
  • Packaging Method Pocket Tape
2213610-1 Board-to-Board Headers & Receptacles  1
  • Connector Style Hermaphroditic
  • Connector System Board-to-Board
  • Sealable No
  • Number of Positions 2
  • Board-to-Board Configuration Right Angle
  • Contact Mating Area Plating Material Tin over Nickel
  • Contact Mating Area Plating Thickness 3.81 – 7.62
  • Contact Mating Area Plating Material Finish Matte
  • Contact Current Rating (Max) 3
  • Mating Alignment Without
  • PCB Mount Retention Without
  • PCB Mount Alignment With
  • PCB Mount Alignment Type Peg
  • Centerline (Pitch) 4
  • Operating Temperature Range -40 – 105
  • Pick and Place Cover Without
  • Circuit Application Power
  • Packaging Method Pocket Tape
2213610-2 Board-to-Board Headers & Receptacles  1
  • Connector Style Hermaphroditic
  • Connector System Board-to-Board
  • Sealable No
  • Number of Positions 4
  • Board-to-Board Configuration Right Angle
  • PCB Termination Area Plating Material Tin
  • Contact Mating Area Plating Material Tin
  • Contact Mating Area Plating Thickness 3.81 – 7.62
  • Contact Mating Area Plating Material Finish Matte
  • Contact Current Rating (Max) 3
  • Mating Alignment Without
  • PCB Mount Retention Without
  • PCB Mount Alignment With
  • PCB Mount Alignment Type Peg
  • Centerline (Pitch) 4
  • Operating Temperature Range -40 – 105
  • Pick and Place Cover Without
  • Circuit Application Power
  • Packaging Method Pocket Tape
2213610-3 Board-to-Board Headers & Receptacles  1
  • Connector Style Hermaphroditic
  • Connector System Board-to-Board
  • Sealable No
  • Number of Positions 6
  • Board-to-Board Configuration Right Angle
  • PCB Termination Area Plating Material Tin
  • Contact Mating Area Plating Material Tin
  • Contact Mating Area Plating Thickness 3.81 – 7.62
  • Contact Mating Area Plating Material Finish Matte
  • Contact Current Rating (Max) 3
  • Mating Alignment Without
  • PCB Mount Retention Without
  • PCB Mount Alignment With
  • PCB Mount Alignment Type Peg
  • Centerline (Pitch) 4
  • Operating Temperature Range -40 – 105
  • Pick and Place Cover Without
  • Circuit Application Power
  • Packaging Method Pocket Tape
2306038-1 Board-to-Board Headers & Receptacles  1
  • Connector Style Hermaphroditic
  • Connector System Board-to-Board
  • Sealable No
  • Number of Positions 2
  • Board-to-Board Configuration Right Angle
  • Contact Mating Area Plating Material Gold over Nickel
  • Contact Mating Area Plating Thickness 3.81 – 7.62
  • Contact Mating Area Plating Material Finish Matte
  • Contact Current Rating (Max) 3
  • Mating Alignment Without
  • PCB Mount Retention Without
  • PCB Mount Alignment Without
  • PCB Mount Alignment Type None
  • Centerline (Pitch) 4
  • Operating Temperature Range -40 – 105
  • Pick and Place Cover Without
  • Circuit Application Power
  • Packaging Method Pocket Tape
2306038-2 Board-to-Board Headers & Receptacles  1
  • Connector Style Hermaphroditic
  • Connector System Board-to-Board
  • Sealable No
  • Number of Positions 4
  • Board-to-Board Configuration Right Angle
  • Contact Mating Area Plating Material Gold over Nickel
  • Contact Mating Area Plating Thickness 3.81 – 7.62
  • Contact Mating Area Plating Material Finish Matte
  • Contact Current Rating (Max) 3
  • Mating Alignment Without
  • PCB Mount Retention Without
  • PCB Mount Alignment Without
  • PCB Mount Alignment Type None
  • Centerline (Pitch) 4
  • Operating Temperature Range -40 – 105
  • Pick and Place Cover Without
  • Circuit Application Power
  • Packaging Method Pocket Tape
2306038-3 Board-to-Board Headers & Receptacles  1
  • Connector Style Hermaphroditic
  • Connector System Board-to-Board
  • Sealable No
  • Stackable No
  • Number of Positions 6
  • Board-to-Board Configuration Right Angle
  • Number of Rows 1
  • Contact Mating Area Plating Material Gold over Nickel
  • Contact Mating Area Plating Material Finish Matte
  • Contact Current Rating (Max) 3
  • Mating Alignment Without
  • PCB Mount Retention Without
  • PCB Mount Alignment Without
  • PCB Mount Alignment Type None
  • Centerline (Pitch) 4
  • Operating Temperature Range -40 – 105
  • Pick and Place Cover Without
  • Circuit Application Power
  • Packaging Method Pocket Tape