1-2199070-4 Board-to-Board Headers & Receptacles  1
  • Connector Style Hermaphroditic
  • Connector System Board-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Row-to-Row Spacing 3.2
  • Series Fine Stack
  • PCB Mounting Orientation Vertical
  • Boss Yes
  • Product Type Connector
  • Stackable Yes
  • Number of Positions 24
  • Board-to-Board Configuration Mezzanine
  • Number of Rows 2
  • Post Entry Direction With
  • Dielectric Withstanding Voltage 500
  • Insulation Resistance 500
  • Voltage 30
  • Insulation Resistance 2
  • Sealant No
  • Busbar Mating Area Plating Thickness 500
  • PCB Termination Area Plating Material Gold
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .38
  • Contact Current Rating (Max) .5
  • Solder Tail Contact Plating Thickness .05
  • Contact Layout Inline
  • Contact Base Material Copper Alloy
  • Contact Type Pin
  • PCB Termination Method Surface Mount
  • Mating Alignment With
  • Mating Alignment Type Polarized
  • PCB Mount Retention Without
  • PCB Mount Retention Type None
  • PCB Mount Alignment With
  • PCB Mount Alignment Type Locating Posts
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) .5
  • Housing Material LCP (Liquid Crystal Polymer)
  • Stack Height 4
  • Height 3.6
  • Operating Temperature Range -40 – 125
  • High Temperature Compatible Yes
  • Assembly Process Feature Vacuum Cover
  • Pick and Place Cover With
  • Circuit Application Signal
  • For Use With Self
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tape & Reel
  • Packaging Quantity 1100
2199070-4 Board-to-Board Headers & Receptacles  1
  • Connector Style Hermaphroditic
  • Connector System Board-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Row-to-Row Spacing 3.2
  • Series Fine Stack
  • PCB Mounting Orientation Vertical
  • Boss No
  • Product Type Connector
  • Stackable Yes
  • Number of Positions 24
  • Board-to-Board Configuration Mezzanine
  • Number of Rows 2
  • Post Entry Direction With
  • Dielectric Withstanding Voltage 500
  • Insulation Resistance 500
  • Voltage 30
  • Insulation Resistance 2
  • Sealant No
  • Busbar Mating Area Plating Thickness 500
  • PCB Termination Area Plating Material Gold
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .38
  • Contact Current Rating (Max) .5
  • Solder Tail Contact Plating Thickness .05
  • Contact Layout Inline
  • Contact Base Material Copper Alloy
  • Contact Type Pin
  • PCB Termination Method Surface Mount
  • Mating Alignment With
  • Mating Alignment Type Polarized
  • PCB Mount Retention Without
  • PCB Mount Retention Type None
  • PCB Mount Alignment Without
  • PCB Mount Alignment Type None
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) .5
  • Housing Material LCP (Liquid Crystal Polymer)
  • Stack Height 4
  • Height 3.6
  • Operating Temperature Range -40 – 125
  • High Temperature Compatible Yes
  • Assembly Process Feature Vacuum Cover
  • Pick and Place Cover With
  • Circuit Application Signal
  • For Use With Self
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tape & Reel
  • Packaging Quantity 1100
2291283-2 Board-to-Board Headers & Receptacles  1
  • Connector Style Hermaphroditic
  • Connector System Board-to-Board
  • Connector & Contact Terminates To Board
  • Number of Positions 30
  • Board-to-Board Configuration Mezzanine
  • Insulation Resistance 30
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .38
  • Contact Current Rating (Max) .5
  • Mating Alignment With
  • Mating Alignment Type Polarization
  • PCB Mount Retention Without
  • PCB Mount Retention Type Solder Peg
  • PCB Mount Alignment Without
  • PCB Mount Alignment Type Locating Posts
  • Centerline (Pitch) .5
  • Stack Height 4
  • Operating Temperature Range -40 – 125
  • Assembly Process Feature Pick and Place Cover
  • Pick and Place Cover With
  • Circuit Application Signal
  • Packaging Method Tape & Reel
2291283-1 Board-to-Board Headers & Receptacles  1
  • Connector Style Hermaphroditic
  • Connector System Board-to-Board
  • Sealable No
  • Connector & Contact Terminates To Board
  • Number of Positions 30
  • Board-to-Board Configuration Mezzanine
  • Insulation Resistance 30
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .38
  • Contact Current Rating (Max) .5
  • Mating Alignment With
  • Mating Alignment Type Polarization
  • PCB Mount Retention Without
  • PCB Mount Retention Type Solder Peg
  • PCB Mount Alignment With
  • PCB Mount Alignment Type Locating Posts
  • Centerline (Pitch) .5
  • Stack Height 4
  • Operating Temperature Range -40 – 125
  • Assembly Process Feature Pick and Place Cover
  • Pick and Place Cover With
  • Circuit Application Signal
  • Packaging Method Tape & Reel