LITESURF Plating Technology
TE Connectivity has developed a green, Sn-free, Bismuth (Bi)-based plating technology to provide electronics manufacturers with a comprehensive tin-whisker prevention solution.
How can automotive manufacturers safely reduce the risk of metallic whisker growth?
TE Connectivity’s LITESURF is a lean plating finish for press-fit pins. Instead of tin (Sn) this plating consists of bismuth (Bi), a non-hazardous heavy metal, which reduces the risk associated with metallic growth by a factor of over 1,600. LITESURF confirms that TE’s Press-Fit technology offers fast, economical and highly reliable manufacturing with true automotive grade robustness and virtually no risk from metallic whiskers.
Our whitepaper describes how the LITESURF plating technology offers ultra-low risk of whisker growth in automotive electronic components. After around four years of development and intense research, TE’s Bi-based LITESURF plating now provides a reliable environmentally-friendly tin-free plating solution for use with Press-Fit interconnections with negligible risk from metallic whisker growth. Learn more by registering to download our whitepaper.