Improved Packaging Space


Improved Packaging Space

A vehicle’s weight can be reduced utilizing lighter or less material. One way to employ less material in a vehicle is to miniaturize its components.

TE is meeting this challenge with the our NanoMQS and MCON 0.50 interconnection systems.  TE’s miniaturized connectivity solutions enable a reduced PCB size for electronic components, smaller wires down to 0.13mm2 and a reduced total connector package. These features combine to conserve energy and resources while reducing weight and, ultimately, CO2 emissions. Leading products include: 

  1. NanoMQS – Size and Weight Reduction (English)

Demonstration of size and weight reduction using TE's NanoMQS technology featuring a printed circuit board header (PCB) for engine management.