TE New Product Announcement: Thermally Enhanced zSFP+ and zQSFP+ Cages

Thermally enhanced zQSFP+ cages

New Cages Improve Airflow, Can Help Reduce Costs

February 28, 2017

TE Connectivity (TE), a world leader in connectivity and sensors, today announced its Thermally Enhanced zSFP+ and zQSFP+ cages, which offer improved airflow through the cages, enabling better heat dissipation. These cages offer better thermal performance at a competitive price to most alternatives in the markets, and are ideal for any application that requires high-speed I/O transmission. The Thermally Enhanced zSFP+ and zQSFP+ cages offer:

• Better thermal performance – the best thermal performance of TE’s zSFP+ and zQSFP+ portfolio of products
• Better airflow – front-to-back and back-to-front airflow for cooler operation
• Lower costs – innovative and simple cooling enhancements can also lower operating costs

 

“As manufacturers move to higher internal speeds in their switches and other data communications equipment, they need I/O products that deliver 28Gbps performance without retaining too much heat,” said Melissa Knox, product manager of Data and Devices at TE Connectivity. “Our Thermally Enhanced zSFP+ and zQSFP+ cages improve thermal dissipation and are available at an attractive price point.”

About TE

TE Connectivity (NYSE: TEL) is a $12 billion global technology leader. Our commitment to innovation enables advancements in transportation, industrial applications, medical technology, energy, data communications, and the home. TE’s unmatched breadth of connectivity and sensor solutions, proven in the harshest of environments, helps build a safer, greener, smarter and more connected world. With 75,000 people – including more than 7,000 engineers – working alongside customers in nearly 150 countries, we help ensure that EVERY CONNECTION COUNTS – www.TE.com

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zSFP+ and zQSFP+ are a part of the ZXP® family of connectors and uses ZXP technology. ZXP is a trademark of Molex LLC.