LITESURF Plating Technology

Trend

LITESURF Plating Technology

TE Connectivity has developed a green, Sn-free, Bismuth (Bi)-based plating technology to provide electronics manufacturers with a comprehensive tin-whisker prevention solution.

How can automotive manufacturers safely reduce the risk of metallic whisker growth?

TE Connectivity’s LITESURF plating technology is a lean plating finish for press-fit pins. Instead of tin (Sn) this plating consists of bismuth (Bi), a non-hazardous heavy metal, which reduces the risk associated with metallic growth by a factor of over 1,600. LITESURF plating confirms that TE’s Press-Fit technology offers fast, economical and highly reliable manufacturing with true automotive grade robustness and virtually no risk from metallic whiskers.

In comparison to tin based plating solutions, research has proven that our bismuth based LITESURF plating reduces the whisker growth by a factor greater than 1,600X
  1. Full Interview | LITESURF Plating Technology with Dr. Erika Crandall (English)

View the full interview with Dr. Erika Crandall, Senior R&D Product Development Engineer on TE Connectivity's LITESURF plating technology, a green, Sn-free, Bismuth (Bi)-based plating technology to provide electronics manufacturers with a comprehensive tin-whisker prevention solution.

  1. LITESURF plating and how it helps to solve the challenge of tin whiskers (English)

LITESURF Plating Technology - Interview with Dr. Erika Crandall, Senior R&D Product Development Engineer. In this video section, you will learn what is TE's LITESURF plating and how it helps to solve the challenge of tin whiskers.

  • What are metallic whiskers and what is their significance? (English)

  • Why are metallic whiskers a risk to automotive manufacturers today? (English)

  • What actions must automotive manufacturers take to avoid metallic whiskers? (English)